Importance of Interfaces in Governing Thermal Transport in Composite Materials: Modeling and Experimental Perspectives

2012 ◽  
Vol 4 (2) ◽  
pp. 545-563 ◽  
Author(s):  
Ajit K. Roy ◽  
Barry L. Farmer ◽  
Vikas Varshney ◽  
Sangwook Sihn ◽  
Jonghoon Lee ◽  
...  
Keyword(s):  
Composite Materials ◽  
Thermal Transport ◽  
Materials Modeling

Optimized Design of Composite Materials for Heat Transport Applications

2011 ◽  
Author(s):  
Babak Kouchmeshky ◽  
Peter Kroll ◽  
Ibukun Olubanjo
Keyword(s):  
Thermal Conductivity ◽  
Composite Materials ◽  
Thermal Transport ◽  
Elevated Temperatures ◽  
Phonon Scattering ◽  
Optimized Design ◽  
Individual Contributions ◽  
Non Equilibrium Molecular Dynamics ◽  
Dynamics Simulations ◽  
The Individual

Careful design of composite materials offers a chance for engineering phonon band gaps and controlling phonon scattering. Taking advantage of this strategy, we study properties of SiC composite materials for engineering applications in which the control of thermal transport is important. In particular, knowledge of the individual contributions of phonons on thermal transport provides us the necessary information to focus on most significant phonon frequencies. In our study, we select a series of candidate model geometries and use a virtual testing method for elevated temperatures to support the design process. Integrating atomistic non-equilibrium molecular dynamics simulations to determine thermal conductivity we provide a proof-of-concept study and deliver best design scenarios of SiC composite materials with very low-thermal conductivity.

scholarly journals A cross-interface model for thermal transport across the interface between overlapped nanoribbons

2019 ◽  
Vol 21 (45) ◽  
pp. 25072-25079 ◽  
Author(s):  
Wentao Feng ◽  
Xiaoxiang Yu ◽  
Yue Wang ◽  
Dengke Ma ◽  
Zhijia Sun ◽  
...  
Keyword(s):  
Composite Materials ◽  
Thermal Transport ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Interface Model ◽  
Comprehensive Understanding ◽  
The Cross ◽  
Low Dimensional ◽  
Low Dimensional Materials

The application of low-dimensional materials for heat dissipation requires a comprehensive understanding of thermal transport at the cross-interface, which widely exists in various composite materials and electronic devices.

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