A cross-interface model for thermal transport across the interface between overlapped nanoribbons
2019 ◽
Vol 21
(45)
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pp. 25072-25079
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Keyword(s):
The application of low-dimensional materials for heat dissipation requires a comprehensive understanding of thermal transport at the cross-interface, which widely exists in various composite materials and electronic devices.
2017 ◽
Vol 21
(4)
◽
pp. 201-236
◽
Keyword(s):
Keyword(s):
2005 ◽
Vol 14
(14)
◽
pp. 103-127
◽