Low-Temperature Fusible Silver Micro/Nanodendrites-Based Electrically Conductive Composites for Next-Generation Printed Fuse-Links

ACS Nano ◽  
2017 ◽  
Vol 11 (8) ◽  
pp. 7710-7718 ◽  
Author(s):  
Rui Yang ◽  
Yang Wang ◽  
Dang Wu ◽  
Yubin Deng ◽  
Yingying Luo ◽  
...  
Keyword(s):  
Low Temperature ◽  
Next Generation ◽  
Electrically Conductive ◽  
Conductive Composites

Possibilities of Utilization of Waste Materials in Production of Electrically Conductive Composites on Silicate Basis

2021 ◽  
Vol 321 ◽  
pp. 171-176
Author(s):  
Jana Majerová ◽  
Rostislav Drochytka
Keyword(s):  
Nickel Powder ◽  
Cement Composite ◽  
Wire Drawing ◽  
Waste Materials ◽  
Electrically Conductive ◽  
Conductive Composites ◽  
Steel Wires ◽  
The Subject ◽  
Conductive Properties ◽  
Functional Fillers

The electrical conductivity of concrete can be achieved by adding steel wires or functional fillers. Commonly used fillers are nanotubes, carbon black, nickel powder and so on. These fillers are expensive, but there is a possibility to use waste materials. This is the subject of this experiment. The conductive properties of conductive sand, sludge from the wire drawing process, iron grinding dust waste and waste carbon were verified. From these fillers, waste carbon showed the best electrical properties (impedance). The impedance of the waste carbon was 0.31 Ω and the impedance of the cement composite containing 70% of the weight of waste carbon was less than 670 Ω.

scholarly journals Fractal dendrite-based electrically conductive composites for laser-scribed flexible circuits

2015 ◽  
Vol 6 (1) ◽  
Author(s):  
Cheng Yang ◽  
Xiaoya Cui ◽  
Zhexu Zhang ◽  
Sum Wai Chiang ◽  
Wei Lin ◽  
...  
Keyword(s):  
Electrically Conductive ◽  
Conductive Composites

Electrically Conductive Composites Based on Chitosan and Graphene Stabilized by Pluronic F-108

2018 ◽  
Vol 60 (5) ◽  
pp. 678-682
Author(s):  
B. Ch. Kholkhoev ◽  
A. S. Buinov ◽  
S. A. Bal’zhinov ◽  
V. G. Makotchenko ◽  
V. E. Fedorov ◽  
...  
Keyword(s):  
Electrically Conductive ◽  
Conductive Composites

Low Temperature Curing - Aqueous Base Developable Photoimageable Dielectric for WLP (Wafer Level Packaging)

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000986-001015
Author(s):  
Eric Huenger ◽  
Joe Lachowski ◽  
Greg Prokopowicz ◽  
Ray Thibault ◽  
Michael Gallagher ◽  
...  
Keyword(s):  
Low Temperature ◽  
Dielectric Material ◽  
Broad Band ◽  
Dielectric Materials ◽  
Next Generation ◽  
Wafer Level ◽  
Moore’S Law ◽  
Moore's Law ◽  
3D Chip Stacking ◽  
The Impact

As advanced packaging application space evolves and continues to deviate from the conventional shrinkage pathway predicted by Moore's law, material suppliers need to continue to work with OEMs, OSATs and Foundries to identify specific opportunities. One such opportunity continues to present itself in developing new materials to support new platforms for next generation products to support 3D chip stacking and TSV applications. The newer material sets can be established to meet more challenging design requirements associated with the demands, presented by the application from both a physical/lithographical processing and design perspective. Next generation packages requires the development of new dielectric materials that can support both the physical demands of 3D chip stacking and TSV package design aspects while maintaining strengths of the existing material platform. While vertical integration necessitates the use of thinned substrates and its associated integration challenges, there is a continuing need to support horizontal shrinkage typical of the Moore's Law, which pushes the lithography envelope requiring finer pitch and smaller feature resolution capability. This presentation identifies the strategy we have taken and highlights approach taking in the development of low temperature curable photoimageable dielectric materials with enhanced lithographic performance. We will discuss the methodology used to create benzocyclobutene based dielectric material curable at 180 °C and show how lithographic performance can be tuned to allow sub 5 micron via using broad band illumination. Finally we will review the impact of low temperature processing on the mechanical, thermal and electrical properties of this novel photoimageable dielectric material.

scholarly journals Ultra-Low-Temperature Cofired Ceramic Substrates with Low Residual Carbon for Next-Generation Microwave Applications

2019 ◽  
Vol 11 (26) ◽  
pp. 23798-23807 ◽  
Author(s):  
Nina Joseph ◽  
Jobin Varghese ◽  
Merja Teirikangas ◽  
Timo Vahera ◽  
Heli Jantunen
Keyword(s):  
Low Temperature ◽  
Residual Carbon ◽  
Next Generation ◽  
Ceramic Substrates ◽  
Microwave Applications

scholarly journals Stiff and electrically conductive composites of carbon nanotube aerogels and polymers

2009 ◽  
Vol 19 (21) ◽  
pp. 3370 ◽  
Author(s):  
Marcus A. Worsley ◽  
Sergei O. Kucheyev ◽  
Joshua D. Kuntz ◽  
Alex V. Hamza ◽  
Joe H. Satcher, Jr. ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Electrically Conductive ◽  
Conductive Composites
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