Bendable Electronics and Innovation Centers

2011 ◽  
Vol 83 (9) ◽  
pp. 3223-3223 ◽  
Keyword(s):  
Bendable Electronics

Bendable Electronics

2012 ◽  
pp. 186-186
Author(s):  
Arash Kheyraddini Mousavi ◽  
Zayd Chad Leseman ◽  
Manuel L. B. Palacio ◽  
Bharat Bhushan ◽  
Scott R. Schricker ◽  
...  
Keyword(s):  
Bendable Electronics

scholarly journals Superflexibility of graphene oxide

2016 ◽  
Vol 113 (40) ◽  
pp. 11088-11093 ◽  
Author(s):  
Philippe Poulin ◽  
Rouhollah Jalili ◽  
Wilfrid Neri ◽  
Frédéric Nallet ◽  
Thibaut Divoux ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Unique Feature ◽  
Bending Rigidity ◽  
X Ray Diffraction ◽  
Synchrotron Source ◽  
X Ray ◽  
Bending Modulus ◽  
Bendable Electronics ◽  
Very High

Graphene oxide (GO), the main precursor of graphene-based materials made by solution processing, is known to be very stiff. Indeed, it has a Young’s modulus comparable to steel, on the order of 300 GPa. Despite its very high stiffness, we show here that GO is superflexible. We quantitatively measure the GO bending rigidity by characterizing the flattening of thermal undulations in response to shear forces in solution. Characterizations are performed by the combination of synchrotron X-ray diffraction at small angles and in situ rheology (rheo-SAXS) experiments using the high X-ray flux of a synchrotron source. The bending modulus is found to be 1kT, which is about two orders of magnitude lower than the bending rigidity of neat graphene. This superflexibility compares with the fluidity of self-assembled liquid bilayers. This behavior is discussed by considering the mechanisms at play in bending and stretching deformations of atomic monolayers. The superflexibility of GO is a unique feature to develop bendable electronics after reduction, films, coatings, and fibers. This unique combination of properties of GO allows for flexibility in processing and fabrication coupled with a robustness in the fabricated structure.

Silicon: A flexible material for bendable electronics and sensors

2016 ◽  
Author(s):  
Yannick Kervran ◽  
K. Kandoussi ◽  
Hanpeng Dong ◽  
Sabri Janfaoui ◽  
Nathalie Coulon ◽  
...  
Keyword(s):  
Flexible Material ◽  
Bendable Electronics

Large Expansion of Operating Voltage Window in Polymer Based Flexible Solid State Supercapacitor

MRS Advances ◽  
2018 ◽  
Vol 3 (23) ◽  
pp. 1291-1300
Author(s):  
Curtis White ◽  
Tristan Skinner ◽  
Kevin Santiago ◽  
Sangram K. Pradhan ◽  
Messaoud Bahoura
Keyword(s):  
Electrode Materials ◽  
Conductive Polymer ◽  
Hybrid Structure ◽  
Operating Voltage ◽  
Super Capacitor ◽  
Energy Unit ◽  
Large Expansion ◽  
High Efficient ◽  
In Series ◽  
Bendable Electronics

ABSTRACTSpecific demand of lightweight and high efficient flexible energy unit is increased day by day for its integration into bendable electronics devices. Super-capacitor is one of the promising power unit to meet the current requirement. Flexible metal oxide and polypyrrole based flexible electrode materials are prepared using electrodeposition. The calculated specific capacitances of the devices shows 0.5 mill farad per gram. The super-capacitor is ultra-flexible, stable with operational voltage window expands from 0.8 to 2.5 V which can help to reduce the number of super-capacitor in series connection to obtain the same output. In this study, a conductive polymer can be coupled with MnO2 to improve capacitance and conductivity of a hybrid structure based on MnO2.

Technology and design aspects of ultra-thin silicon chips for bendable electronics

2009 ◽  
Author(s):  
Harald Richter ◽  
Horst D. Rempp ◽  
Mahadi-Ul Hassan ◽  
Christine Harendt ◽  
Nicoleta Wacker ◽  
...  
Keyword(s):  
Silicon Chips ◽  
Thin Silicon ◽  
Bendable Electronics ◽  
Technology And Design
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