Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition

2017 ◽  
Vol 636 ◽  
pp. 251-256 ◽  
Author(s):  
Byoungyong Im ◽  
Sunjung Kim ◽  
Soo-Hyun Kim
Author(s):  
Yoon Kyeung Lee ◽  
Chanyoung Yoo ◽  
Woohyun Kim ◽  
Jeongwoo Jeon ◽  
Cheol Seong Hwang

Atomic layer deposition (ALD) is a thin film growth technique that uses self-limiting, sequential reactions localized at the growing film surface. It guarantees exceptional conformality on high-aspect-ratio structures and controllability...


2012 ◽  
Vol 89 ◽  
pp. 109-115 ◽  
Author(s):  
Jong Mun Choi ◽  
Dohan Lee ◽  
Ji Hun Park ◽  
Chang Gyoun Kim ◽  
Taek-Mo Chung ◽  
...  

2011 ◽  
Vol 11 (2) ◽  
pp. 1577-1580 ◽  
Author(s):  
Yong Jun Park ◽  
Dong Ryeol Lee ◽  
Hyun Hwi Lee ◽  
Han-Bo-Ram Lee ◽  
Hyungjun Kim ◽  
...  

2010 ◽  
Vol 16 (47) ◽  
pp. 13925-13929 ◽  
Author(s):  
Manjunath Puttaswamy ◽  
Kenneth Brian Haugshøj ◽  
Leif Højslet Christensen ◽  
Peter Kingshott

2013 ◽  
Vol 2 (10) ◽  
pp. P91-P93 ◽  
Author(s):  
J. R. Kim ◽  
H. Lim ◽  
S. Park ◽  
Y. J. Choi ◽  
S. Suh ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document