The relationship between chemical structure and dielectric properties of plasma-enhanced chemical vapor deposited polymer thin films

2007 ◽  
Vol 515 (7-8) ◽  
pp. 3513-3520 ◽  
Author(s):  
Hao Jiang ◽  
Lianggou Hong ◽  
N. Venkatasubramanian ◽  
John T. Grant ◽  
Kurt Eyink ◽  
...  
Keyword(s):  
Thin Films ◽  
Dielectric Properties ◽  
Chemical Structure ◽  
Polymer Thin Films ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited ◽  
The Relationship

scholarly journals Dielectric properties of hydrogen-incorporated chemical vapor deposited diamond thin films

2007 ◽  
Vol 102 (7) ◽  
pp. 074115 ◽  
Author(s):  
Chao Liu ◽  
Xingcheng Xiao ◽  
Jian Wang ◽  
Bing Shi ◽  
Vivekananda P. Adiga ◽  
...  
Keyword(s):  
Thin Films ◽  
Dielectric Properties ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited ◽  
Diamond Thin Films

Amorphous Highly Conjugated Chemical-Vapor-Deposited Polymer Thin Films

2006 ◽  
Vol 12 (5) ◽  
pp. 285-289 ◽  
Author(s):  
J. J. Senkevich ◽  
B. W. Woods ◽  
B. P. Carrow ◽  
R. D. Geil ◽  
B. R. Rogers
Keyword(s):  
Thin Films ◽  
Polymer Thin Films ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

Studies of the Coefficient of Thermal Expansion of Low-k ILD Materials by X-Ray Reflectivity

2006 ◽  
Vol 914 ◽  
Author(s):  
George Andrew Antonelli ◽  
Tran M. Phung ◽  
Clay D. Mortensen ◽  
David Johnson ◽  
Michael D. Goodner ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Chemical Vapor ◽  
Dielectric Materials ◽  
Free Standing ◽  
Dielectric Thin Films ◽  
X Ray ◽  
Chemical Vapor Deposited ◽  
Low K

AbstractThe electrical and mechanical properties of low-k dielectric materials have received a great deal of attention in recent years; however, measurements of thermal properties such as the coefficient of thermal expansion remain minimal. This absence of data is due in part to the limited number of experimental techniques capable of measuring this parameter. Even when data does exist, it has generally not been collected on samples of a thickness relevant to current and future integrated processes. We present a procedure for using x-ray reflectivity to measure the coefficient of thermal expansion of sub-micron dielectric thin films. In particular, we elucidate the thin film mechanics required to extract this parameter for a supported film as opposed to a free-standing film. Results of measurements for a series of plasma-enhanced chemical vapor deposited and spin-on low-k dielectric thin films will be provided and compared.

Growth, Structural and Mechanical Characterization and Reliability of Chemical Vapor Deposited Co and Co3O4 Thin Films as Candidate Materials for Sensing Applications

2011 ◽  
Vol 495 ◽  
pp. 108-111 ◽  
Author(s):  
Vasiliki P. Tsikourkitoudi ◽  
Elias P. Koumoulos ◽  
Nikolaos Papadopoulos ◽  
Costas A. Charitidis
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Elastic Modulus ◽  
Data Storage ◽  
Mechanical Stability ◽  
Chemical Vapor ◽  
Magnetic Sensors ◽  
Functional Coatings ◽  
Sensing Applications ◽  
Chemical Vapor Deposited

The adhesion and mechanical stability of thin film coatings on substrates is increasingly becoming a key issue in device reliability as magnetic and storage technology driven products demand smaller, thinner and more complex functional coatings. In the present study, chemical vapor deposited Co and Co3O4thin films on SiO2and Si substrates are produced, respectively. Chemical vapor deposition is the most widely used deposition technique which produces thin films well adherent to the substrate. Co and Co3O4thin films can be used in innovative applications such as magnetic sensors, data storage devices and protective layers. The produced thin films are characterized using nanoindentation technique and their nanomechanical properties (hardness and elastic modulus) are obtained. Finally, an evaluation of the reliability of each thin film (wear analysis) is performed using the hardness to elastic modulus ratio in correlation to the ratio of irreversible work to total work for a complete loading-unloading procedure.

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