Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol

2020 ◽  
Vol 182 ◽  
pp. 74-80 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Omid Mokhtari ◽  
Fosca Conti ◽  
Gordon Elger
Keyword(s):  
Thermal Decomposition ◽  
Polyethylene Glycol ◽  
High Temperature ◽  
Die Attach ◽  
Temperature Applications

Silver micropowders as SiC die attach material for high temperature applications

2012 ◽  
Author(s):  
Ryszard Kisiel ◽  
Zbigniew Szczepanski ◽  
Piotr Firek ◽  
Jakub Grochowski ◽  
Marcin Mysliwiec ◽  
...  
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications

SiC Die Attach for High-Temperature Applications

2013 ◽  
Vol 43 (3) ◽  
pp. 695-701 ◽  
Author(s):  
A. Drevin-Bazin ◽  
F. Lacroix ◽  
J. -F. Barbot
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications

Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications

2018 ◽  
Vol 87 ◽  
pp. 232-237 ◽  
Author(s):  
Shuji Nishimoto ◽  
Seyed Ali Moeini ◽  
Toyo Ohashi ◽  
Yoshiyuki Nagatomo ◽  
Patrick McCluskey
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications

An overview of die-attach material for high temperature applications

2017 ◽  
Author(s):  
Kim Seah Tan ◽  
Norasiah Mohammad Noordin ◽  
Kuan Yew Cheong
Keyword(s):  
High Temperature ◽  
Die Attach ◽  
Temperature Applications
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