Efficacy of lone-pair electrons to engender ultralow thermal conductivity

2016 ◽  
Vol 111 ◽  
pp. 49-53 ◽  
Author(s):  
Baoli Du ◽  
Kan Chen ◽  
Haixue Yan ◽  
Michael J. Reece
2018 ◽  
Vol 6 (39) ◽  
pp. 18928-18937 ◽  
Author(s):  
Yuchong Qiu ◽  
Ying Liu ◽  
Jinwen Ye ◽  
Jun Li ◽  
Lixian Lian

Doping Sn into the Cu2Te lattice can synergistically enhance the power factor and decrease thermal conductivity, leading to remarkably optimized zTs. The lone pair electrons from the 5s orbital of Sn can increase the DOS near the Fermi level of Cu2Te to promote PF and reduce κe by decreasing the carrier concentration. This study explores a scalable strategy to optimize the thermoelectric performance for intrinsically highly degenerate semiconductors.


ChemPhysChem ◽  
2015 ◽  
Vol 16 (15) ◽  
pp. 3264-3270 ◽  
Author(s):  
Yongkwan Dong ◽  
Artem R. Khabibullin ◽  
Kaya Wei ◽  
James R. Salvador ◽  
George S. Nolas ◽  
...  

2020 ◽  
Vol 56 (31) ◽  
pp. 4356-4359 ◽  
Author(s):  
Mengjia Luo ◽  
Kejun Bu ◽  
Xian Zhang ◽  
Jian Huang ◽  
Ruiqi Wang ◽  
...  

An intrinsically low thermal conductivity is observed in a new p-type semiconductor SrOCuBiSe2 which combines the dual effect of Bi 6s2 lone-pair electrons and rattling vibration of Cu atoms.


2017 ◽  
Vol 96 (23) ◽  
Author(s):  
Zhenzhen Feng ◽  
Tiantian Jia ◽  
Jihua Zhang ◽  
Yuanxu Wang ◽  
Yongsheng Zhang

2018 ◽  
Vol 44 (13) ◽  
pp. 15833-15838 ◽  
Author(s):  
Kyung Min Ok ◽  
Yuji Ohishi ◽  
Yusuke Mitazono ◽  
Hiroaki Muta ◽  
Ken Kurosaki ◽  
...  

2019 ◽  
Vol 30 (08) ◽  
pp. 1950045
Author(s):  
Xiao-Peng Liu ◽  
Zhen-Zhen Feng ◽  
Shu-Ping Guo ◽  
Yi Xia ◽  
Yongsheng Zhang

Skutterudites and half-Heusler compounds are well-studied promising thermoelectric (TE) materials due to favorable electrical properties. However, their intrinsic lattice thermal conductivities are so high that various methodologies have been developed to decrease them. Based on our first-principles phonon calculations, we find that thermodynamically stable Cu3VX4 ([Formula: see text], Se, Te) compounds exhibit good thermoelectric properties due to their special crystal structure (a Cu-V-X framework plus large void tunnels). The mechanically stable framework is the favorite pathway for the carrier conduction, which induces high electrical conductivity and power factor (comparative to those of filled-skutterudites and half-Heusler systems). Moreover, the void tunnels in the crystal structure result in unsaturated coordinations at the X sites and corresponding lone-pair electrons, which lower the lattice thermal conductivity. The calculated intrinsic lattice thermal conductivity of Cu3VX4 is much lower than those of the well-studied skutterudites and half-Heusler compounds. Thus, the maximum ZT values approach 1.6 (at 900[Formula: see text]K, [Formula: see text][Formula: see text][Formula: see text]) and 1.2 (at 1000[Formula: see text]K, [Formula: see text][Formula: see text][Formula: see text]) for the p- and n-type Cu3VTe4 compounds, respectively. Our work provides not only distinctive high-performance TE materials (Cu3VX4), but also a guideline for future promising thermoelectric discoveries.


2020 ◽  
Vol 58 (5) ◽  
pp. 340-347
Author(s):  
Sung-Yoon Kim ◽  
Ji-Hee Pi ◽  
Go-Eun Lee ◽  
Il-Ho Kim

Tetrahedrite (C<sub>12</sub>Sb<sub>4</sub>S<sub>13</sub>) has attracted attention as a p-type thermoeletric material with very low thermal conductivity induced by the anharmonic oscillation of Cu due to the lone-pair electrons of Sb. Many studies have been conducted to improve its thermoelectric performance by partially substituting the transition elements for the Cu sites. In this study, Fe-doped tetrahedrites Cu<sub>12-x</sub>Fe<sub>x</sub>Sb<sub>4</sub>S<sub>13</sub> (x = 0.1-0.4) were prepared by mechanical alloying and hot pressing. The tetrahedrite phase was successfully synthesized by mechanical alloying without post-annealing and exhibited stability even without phase transition after hot pressing. Moreover, the Fe content was observed to be directly proportional to the lattice constant, which confirmed the Fe substitutions on the Cu sites. The electrical conductivity was observed to decrease with the increase in the Seebeck coefficient due to the charge compensation caused by Fe doping (electron donation). The highest power factor was 0.84 mWm<sup>-1</sup>K<sup>-2</sup> at 723 K for the specimen with x = 0.1; however, it decreased with an increase in Fe content. In addition, as the Fe content increased, the electronic thermal conductivity decreased. Thus, the lowest thermal conductivity value was obtained for the specimen with x = 0.4 (0.45–0.64 Wm<sup>-1</sup>K<sup>-1</sup>) in the temperature range of 323–723 K. As a result, the maximum value of the dimensionless figure of merit (ZT = 0.80) was achieved at 723 K for the specimen with x = 0.2.


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