Effects of grain boundary adhesion and grain size on ductility of thin metal films on polymer substrates

2008 ◽  
Vol 59 (8) ◽  
pp. 862-865 ◽  
Author(s):  
Zhao Zhang ◽  
Teng Li
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Polymer Substrates

scholarly journals FIB TEM Cross-Section Sample Preparation of Thin Metal Films Deposited on Polymer Substrates

2011 ◽  
Vol 17 (S2) ◽  
pp. 638-639 ◽  
Author(s):  
F Rivera ◽  
J Abbott ◽  
R Davis ◽  
R Vanfleet
Keyword(s):  
Sample Preparation ◽  
Cross Section ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Polymer Substrates ◽  
Section Sample

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

Crack-like grain-boundary diffusion wedges in thin metal films

1999 ◽  
Vol 47 (10) ◽  
pp. 2865-2878 ◽  
Author(s):  
H. Gao ◽  
L. Zhang ◽  
W.D. Nix ◽  
C.V. Thompson ◽  
E. Arzt
Keyword(s):  
Grain Boundary ◽  
Boundary Diffusion ◽  
Metal Films ◽  
Grain Boundary Diffusion ◽  
Thin Metal ◽  
Thin Metal Films

Dislocation–grain boundary interaction in 〈111〉 textured thin metal films

2010 ◽  
Vol 58 (16) ◽  
pp. 5232-5241 ◽  
Author(s):  
D.V. Bachurin ◽  
D. Weygand ◽  
P. Gumbsch
Keyword(s):  
Grain Boundary ◽  
Metal Films ◽  
Thin Metal ◽  
Thin Metal Films ◽  
Boundary Interaction

The Improvement of Immunity to Electromigration by Means of Microstructural Design

1996 ◽  
Vol 428 ◽  
Author(s):  
O. V. Kononenko ◽  
V. N. Matveev
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Grain Growth ◽  
Metal Films ◽  
Thin Metal ◽  
The Self ◽  
Thin Metal Films ◽  
Deposition Technique ◽  
Aluminum Films ◽  
Microstructural Design

AbstractIt is known from literature that the properties of thin films greatly depend on their structuare. Therefore, the microstructural design is attractive for control over the properties of thin metal films used for interconnect metallization.In this paper we discuss the potentialities of the self-ion assisted deposition technique for control over the grain and grain boundary structures of thin metal films and their properties such as resistivity and immunity to electromigration.It was found that resistivity of aluminum films deposited at the 6 kV bias was virtually equal to resistivity of bulk aluminum. Films deposited at the less bias or without it had higher resistivities. Abnormal grain growth was found in 6 kV-films. In films prepared without bias normal grain growth proceeds.

Sign in / Sign up

Export Citation Format

Share Document