Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes

2018 ◽  
Vol 82 ◽  
pp. 204-212 ◽  
Author(s):  
Chin-Li Kao ◽  
Tei-Chen Chen
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Surface Finishes ◽  
Different Temperatures ◽  
Impact Responses

Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu ◽  
Chang-Lin Yeh ◽  
Jenn-Ming Song
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

2007 ◽  
Vol 37 (2) ◽  
pp. 201-209 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses

Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

2009 ◽  
Vol 21 (3) ◽  
pp. 4-9
Author(s):  
Yi‐Shao Lai ◽  
C.R. Kao ◽  
Hsiao‐Chuan Chang ◽  
Chin‐Li Kao
Keyword(s):  
Solder Joints ◽  
Ball Impact ◽  
Impact Responses ◽  
Multiple Reflow Cycles

Characterizations of Ball Impact Responses of Tin-Silver-Copper Solder Joints Doped With Nickel or Germanium

2007 ◽  
Author(s):  
Yi-Shao Lai ◽  
Jenn-Ming Song ◽  
Hsiao-Chuan Chang ◽  
Ying-Ta Chiu
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Ball Impact ◽  
Test Methodology ◽  
Surface Finishes ◽  
Reliability Of Solder Joints ◽  
Tin Silver Copper ◽  
Board Level ◽  
Immersion Tin ◽  
Board Level Reliability

The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this work, we present BIT results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu-0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

2018 ◽  
Vol 47 (7) ◽  
pp. 4165-4169 ◽  
Author(s):  
Yong-Gue Sung ◽  
Woo-Ram Myung ◽  
Haksan Jeong ◽  
Min-Kwan Ko ◽  
Jeonghoon Moon ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Mechanical Reliability ◽  
Surface Finishes

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

2018 ◽  
Vol 50 (11) ◽  
pp. 1046-1050 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Jong-Hoon Back ◽  
Seung-Boo Jung
Keyword(s):  
Solder Joints ◽  
Interfacial Reactions ◽  
Sac305 Solder ◽  
Surface Finishes

Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling

2016 ◽  
Vol 3 (4) ◽  
pp. 269-275
Author(s):  
Chaobo Shen ◽  
Zhou Hai ◽  
Cong Zhao ◽  
Jiawei Zhang ◽  
John L. Evans ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Reliability Study ◽  
Surface Finishes
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