Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

2018 ◽  
Vol 50 (11) ◽  
pp. 1046-1050 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Jong-Hoon Back ◽  
Seung-Boo Jung
Keyword(s):  
Solder Joints ◽  
Interfacial Reactions ◽  
Sac305 Solder ◽  
Surface Finishes

scholarly journals Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish

Materials ◽  
2021 ◽  
Vol 14 (24) ◽  
pp. 7874
Author(s):  
Panwang Chi ◽  
Yesu Li ◽  
Hongfa Pan ◽  
Yibo Wang ◽  
Nancheng Chen ◽  
...  
Keyword(s):  
Layer Thickness ◽  
Surface Finish ◽  
High Frequency ◽  
Solder Joints ◽  
Interface Reaction ◽  
Temperature Cycle ◽  
Sac305 Solder ◽  
Surface Finishes ◽  
Reliability Of Solder Joints ◽  
Temperature Cycle Test

Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high impedance and weldability. In this paper, the interfacial reaction process between ultrathin ENEPIG substrates with different Ni layer thicknesses (0.112 and 0.185 μm) and Sn–3.0Ag–0.5Cu (SAC305) solder during reflow and aging was studied. The bonding ability and reliability of solder joints with different surface finishes were evaluated based on solder ball shear test, drop test and temperature cycle test (TCT), and the failure mechanism was analyzed from the perspective of intermetallic compound (IMC) interface growth. The results showed that the Ni–Sn–P layer generated by ultrathin ENEPIG can inhibit the growth of brittle IMC so that the solder joints maintain high shear strength. Ultrathin ENEPIG with a Ni layer thickness of 0.185 μm had no failure cracks under thermal cycling and drop impact, which can meet actual reliability standards. Therefore, ultrathin ENEPIG has broad prospects and important significance in the field of high-frequency chip substrate design and manufacturing.

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

Effect of Material Anisotropy on Deformation Behavior of Multiple Grained Sac305 Solder Joints

2021 ◽  
Author(s):  
Debabrata Mondal ◽  
Abdullah Fahim ◽  
KM Rafidh Hassan ◽  
Jeffrey Suhling ◽  
Pradeep Lall
Keyword(s):  
Deformation Behavior ◽  
Solder Joints ◽  
Material Anisotropy ◽  
Sac305 Solder

Determination of Anand Parameters From Creep Testing of Sac305 Solder Joints

2021 ◽  
Author(s):  
Mohammad Ashraful Haq ◽  
Mohd Aminul Hoque ◽  
Jeffrey Suhling ◽  
Pradeep Lall
Keyword(s):  
Solder Joints ◽  
Creep Testing ◽  
Sac305 Solder
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