Improved reliability of copper-cored solder joints under a harsh thermal cycling condition

2012 ◽  
Vol 52 (7) ◽  
pp. 1441-1444 ◽  
Author(s):  
Yunsung Kim ◽  
Hyelim Choi ◽  
Hyoungjoo Lee ◽  
Dongjun Shin ◽  
Jinhan Cho ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Thermal Cycling Condition ◽  
Cycling Condition

Damage Mechanisms of 5A06 Al Alloy Weld Joints under Constant Load and Thermal Cycling Condition

2007 ◽  
Vol 539-543 ◽  
pp. 368-373 ◽  
Author(s):  
Cheng Jin ◽  
Ji Tai Niu ◽  
Shi Yu He ◽  
Hong Bin Geng ◽  
G. Long
Keyword(s):  
Thermal Cycling ◽  
Mechanical Performance ◽  
Base Material ◽  
Constant Load ◽  
Al Alloy ◽  
Damage Mechanisms ◽  
Weld Joints ◽  
Thermal Cycling Condition ◽  
Cycling Condition ◽  
Alloy Weld

In this paper, the micro-damage mechanisms of 5A06 Al alloy weld joints have been studied under the condition of constant load and cyclic thermal load. The mechanical performance variation of the base material and its weld joint are analyzed and compared. Microstructure analysis reveals that the main damage mechanism in weld joints is the interior voids nucleation and growth. The voids distribution and evolution govern the damage process. Test results also show most fractures occur at HAZ near the welding fusion line. The development of these voids results in the performance deterioration of the weld joints under thermal cycling condition.

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
John H. Lau
Keyword(s):  
Thermal Cycling ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Direct Imaging ◽  
Printed Circuit ◽  
Thermal Cycling Condition ◽  
Recent Advances ◽  
Cycling Condition

The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die face-down, and (c) chip last or redistribution layer (RDL)-first; (B) the RDL fabrications such as (a) organic RDLs, (b) inorganic RDLs, (c) hybrid RDLs, and (d) laser direct imaging (LDI)/printed circuit board (PCB) Cu platting and etching RDLs; (C) warpage; (D) thermal performance; (E) the temporary wafer versus panel carriers; and (F) the reliability of packages on PCBs subjected to thermal cycling condition. Some opportunities for FOW/PLP will be presented.

Effects of Different Solder Alloys on Reliability of 3D PLUS Solder Joint

2011 ◽  
Vol 314-316 ◽  
pp. 1038-1042 ◽  
Author(s):  
Nuo Bao ◽  
Chun Jie Wang ◽  
Lin Zhu ◽  
Shun Guang Song
Keyword(s):  
Plastic Strain ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Equivalent Stress ◽  
Lead Free ◽  
Stress And Strain ◽  
Free Solder ◽  
Stress And Strain Distribution ◽  
Better Than ◽  
Cycling Condition

Thermal cycling was applied to assess the effect of tin-lead solder 63Sn37Pb and lead-free solder 95.5Sn3.8Ag0.7Cu on the reliability of 3D PLUS solder joints. Nonlinear finite element method and viscoplastic Anand model were used to evaluate the stress and strain distribution and dangerous position of solders under the thermal cycling condition. The law of solder joints stress and plastic strain were finally obtained and showed significant cyclical changes. The stress and strain emerged the trend of accumulated enhancement with the process of time, then ultimately stabilized. Comparing two curves of equivalent stress and plastic strain obtained from lead-free and tin-lead solder, it was found that the reliability of 95.5Sn3.8Ag0.7Cu was better than that of 63Sn37Pb.

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