A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

2010 ◽  
Vol 50 (1) ◽  
pp. 116-126 ◽  
Author(s):  
Dominik Herkommer ◽  
Jeff Punch ◽  
Michael Reid
Keyword(s):  
Thermal Cycling ◽  
Reliability Model ◽  
Mechanical Cycling ◽  
Sac Solder

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

2009 ◽  
Vol 49 (9-11) ◽  
pp. 1267-1272 ◽  
Author(s):  
M. Berthou ◽  
P. Retailleau ◽  
H. Frémont ◽  
A. Guédon-Gracia ◽  
C. Jéphos-Davennel
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Thermal Storage ◽  
Sac Solder

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

2007 ◽  
Author(s):  
X. Long ◽  
I. Dutta ◽  
R. Guduru ◽  
R. Prasanna ◽  
M. Pacheco
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Inelastic Strain ◽  
Fatigue Reliability ◽  
Element Analysis ◽  
Mechanical Cycling ◽  
Experimental Apparatus ◽  
Dependent Strain ◽  
Accelerated Thermal Cycling

A thermo-mechanical loading system, which can superimpose a temperature and location dependent strain on solder joints, is proposed in order to conduct highly accelerated thermal-mechanical cycling (HATC) tests to assess thermal fatigue reliability of Ball Grid Array (BGA) solder joints in microelectronics packages. The application of this temperature and position dependent strain produces generally similar loading modes (shear and tension) encountered by BGA solder joints during service, but substantially enhances the inelastic strain accumulated during thermal cycling over the same temperature range as conventional ATC (accelerated thermal cycling) tests, thereby leading to a substantial acceleration of low-cycle fatigue damage. Finite element analysis was conducted to aid the design of experimental apparatus and to predict the fatigue life of solder joints in HATC testing. Detailed analysis of the loading locations required to produce failure at the appropriate joint (next to the die-edge ball) under the appropriate tension/shear stress partition are presented. The simulations showed that the proposed HATC test constitutes a valid methodology for further accelerating conventional ATC tests. An experimental apparatus, capable of applying the requisite loads to a BGA package was constructed, and experiments were conducted under both HATC and ATC conditions. It is shown that HATC proffers much reduced cycling times compared to ATC.

Extending the fatigue life of Pb-free SAC solder joints under thermal cycling

2013 ◽  
Vol 53 (5) ◽  
pp. 741-747 ◽  
Author(s):  
Shoho Ishikawa ◽  
Hironori Tohmyoh ◽  
Satoshi Watanabe ◽  
Tomonori Nishimura ◽  
Yoshikatsu Nakano
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Sac Solder

Finite Element Simulation for TGO Instability with Crack Propagation under Thermal Cycling Based on Modified COD Criterion

2012 ◽  
Vol 472-475 ◽  
pp. 183-188
Author(s):  
Xia Huang ◽  
Jun Ding ◽  
Wen Zhong Li
Keyword(s):  
Finite Element ◽  
Crack Propagation ◽  
Thermal Cycling ◽  
Crack Opening ◽  
Thermally Grown Oxide ◽  
Opening Displacement ◽  
Mechanical Cycling ◽  
Element Simulation ◽  
Good Agreement ◽  
Model Crack

In this work, the displacement instability of thermally grown oxide (TGO) occurring near the surface groove in Fecralloy substrate subjected to multiple purely thermal cycling, has been simulated coupled with crack propagation in TGO layer using finite element method. Due to insufficiency in the traditional criterion of crack opening displacement (COD), a modified COD criterion is employed to model crack propagation in TGO layer as thermal cycles in which the required input parameters are continually modified as thermal cycling based on the calculation result. The comparison between FEA and experimental results shows a good agreement indicating the validity and accuracy of the simulation, which may provide a solution for future works on more complicated case such as in thermal-mechanical cycling.

scholarly journals Edgebond and Edgefill Induced Loading Effect on Large WLCSP Thermal Cycling Performance

2020 ◽  
Vol 33 (2) ◽  
pp. 22-27
Author(s):  
Andy Hsiao ◽  
Greg Baty ◽  
Edward Ibe ◽  
Karl Loh ◽  
Steve Perng ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Degradation Mechanism ◽  
Stress Component ◽  
High Stress ◽  
Cycling Performance ◽  
Propagation Path ◽  
Wafer Level ◽  
Electron Backscattered Diffraction ◽  
Mechanical Cycling ◽  
Failure Location

Various external load conditions affecting components on electronic devices and modules are constant factors, which need to be considered for the component long-term reliability. Recently, to enhance the high stress component thermo-mechanical cycling performance, various types and configuration using edgebond and edgefill technology are introduced and tested. These applications induce a multi-axis loading condition, which alter the degradation mechanism and failure location during thermal cycling, which need closer investigation. In this study, high stress 12x12mm2 wafer level chip scale packages (WLCSP) were selected and subject to thermal cycling with full-edgebond, dot-edgebond and edgefill adhesive, which improves the characteristic lifecycle numbers base on the configurations, but altered the failure location due to different stress conditions. The -40 to 125oC thermal cycling profile revealed localized degradation per configuration during thermal cycling, showed a shift of the crack propagation path, based on full-edgebond, dot-edgebond and edgefill adhesive sample conditions. Through these series of observation, the interconnect thermal cycling degradation mechanisms are able to be explained. The correlation between the stress condition and microstructure are  presented and discussed based on Electron backscattered diffraction (EBSD) analysis.

scholarly journals Thermal Fatigue Model of Aluminium Alloy Die Casting H-13 Dies under Thermo-Mechanical Cycle

Mechanika ◽  
2021 ◽  
Vol 27 (5) ◽  
pp. 385-391
Author(s):  
Ghusoon Ridha Mohammed Ali ◽  
Ethar Mohammed Mubarak ◽  
Basim Hussein Abbas
Keyword(s):  
Thermal Cycling ◽  
Fatigue Resistance ◽  
Thermal Fatigue ◽  
Fatigue Behavior ◽  
Die Casting ◽  
Thermal Conditions ◽  
Thermal Fatigue Resistance ◽  
Heating And Cooling ◽  
Mechanical Cycling ◽  
Fatigue Model

In industrial fields, thermal fatigue behavior has recently acquired an important role which is mainly related to the interaction between mechanical and thermal conditions. This paper proposes a thermal fatigue model of H13 tool steel under thermos-mechanical cycles. A test apparatus was used to assess the thermal fatigue resistance of materials to estimate surface crack area when specimens are subjected to thermal cycling. Thermal cycling up to 700°C was used, and crack patterns were examined after 1850, 3000, and 5000 cycles. Temperature distributions were measured at different locations in the test specimens. A model was developed to establish a relationship between mechanical cycling and thermal analysis. From the results, the thermal fatigue resistance was significantly improved over the control parameter after heating and cooling during thermomechanical cycles. The model was applied to determine the best performance and in-service life of die casting tools.

Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy

2008 ◽  
Author(s):  
Ken Holdermann ◽  
Gayatri Cuddalorepatta ◽  
Abhijit Dasgupta
Keyword(s):  
Grain Size ◽  
Focused Ion Beam ◽  
Solder Joints ◽  
Ion Beam ◽  
Fatigue Tests ◽  
Sac305 Solder ◽  
Creep Tests ◽  
Lap Shear ◽  
Mechanical Cycling ◽  
Sac Solder

This study examines microstructural recrystallization in Sn3.0Ag0.5Cu (SAC305) solder joints due to isothermal, mechanical cycling. It is well known that after reflow SAC solder joints at length scales of 200 μm consist of only a few grains [1–3]. This coarse microstructure makes the joint mechanically inhomogeneous and anisotropic, and non-repeatable. Creep tests conducted on modified lap-shear SAC305 solder joints therefore show significant scatter in their results, because of piece-to-piece variability in the microstructural morphology [1]. However, results of cyclic fatigue tests of the same SAC305 solder joints show less significant scatter [4]. One possible hypothesis is that dynamic recrystallization occurs during the cycling, resulting in a much finer (and hence more isotropic, homogeneous and repeatable) microstructure. Recrystallization of solder has been reported to occur under thermal cycling [5–6]. The objective of this study is to assess the extent of recrystallization of SAC305 solder during isothermal mechanical cycling fatigue. Focused ion beam technology is used to prepare a very clean and even surface to reveal the SAC305 grains in modified lap-shear test specimens, both before and after isothermal mechanical cycling. Polarized light microscopy, scanning electron microscopy and focused ion beam microscopy are used to reveal the microstructure of these SAC305 solder joints. The results show that mechanical cycling produces the same type of recrystallization behavior of SAC solder, as has been reported in the literature for thermally cycled specimens [5–6]. The number of grains in the SAC305 solder joint changes from a few to hundreds, during mechanical cycling. As expected, the recrystallization is observed to be localized around cracks in the solder joint, where the local stresses are the highest. The minimal grain size near the cracked region is approximately 4–6 μm and the average grain size increases significantly with increasing distance from the crack face. The transition of solder from very few (non-homogeneous and anisotropic) to a homogenous recrystallized state may be one possible explanation for differences in the extent of scatter in the data from creep tests and isothermal mechanical fatigue tests.

Effect of Thermal Cycling on the Mechanical Properties of a Continuous Fibre Composite Used for Car Clutch Facings

2014 ◽  
Vol 891-892 ◽  
pp. 42-47 ◽  
Author(s):  
Camille Flament ◽  
Michelle Salvia ◽  
Bruno Berthel ◽  
Gerard Crosland
Keyword(s):  
Mechanical Properties ◽  
Thermal Cycling ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Fibre Composite ◽  
Thermal Ageing ◽  
Effect Of Temperature ◽  
Full Field ◽  
Continuous Fibre ◽  
Mechanical Cycling

In dry clutch systems, the clutch facing is an annular shaped continuous fibre composite with organic matrix (thermo set resins) which transmits the torque from the engine to the wheels. In use it is submitted to thermo-mechanical cycling. Due to the composite fibre organisation, the strain field under thermo-mechanical loading is not homogenous. Full field data is needed to describe the material behaviour. Digital Image Stereo-Correlation (DISC) was used to determine the coefficient of thermal expansion (CTE) of the material. To determine the effect of temperature and cyclic loading on the mechanical properties, the composite was subjected to different thermal cycles. The material properties are modified with increasing temperature and number of cycles. These results were confirmed by dynamic mechanical analysis which showed thermal ageing of the resin. The local information given by the strain fields revealed a non uniform evolution of the material properties with thermal cycling.

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