Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn–3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

2006 ◽  
Vol 46 (2-4) ◽  
pp. 523-534 ◽  
Author(s):  
Chih-Tang Peng ◽  
Chia-Tai Kuo ◽  
Kuo-Ning Chiang ◽  
Terry Ku ◽  
Kenny Chang
Keyword(s):  
Mechanical Behavior ◽  
Behavior Analysis ◽  
Intermetallic Compounds ◽  
Solder Bump ◽  
Lead Free ◽  
Lead Free Solder ◽  
Experimental Characterization ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Precise Quantitative Evaluation of Nano-Ordered Intermetallic Compounds in Sn-3.0Ag-0.5Cu Lead-Free Solder Bump by Using TEM

2008 ◽  
Vol 47-50 ◽  
pp. 907-911
Author(s):  
Chang Woo Lee ◽  
Y.S. Shin ◽  
J.H. Kim
Keyword(s):  
Intermetallic Compounds ◽  
Flip Chip ◽  
Solder Bump ◽  
Lead Free Solder ◽  
Growth Behaviour ◽  
Sic Particles ◽  
Imcs Growth ◽  
Ordered Intermetallic ◽  
Free Solder ◽  
The One

The growth behaviour of the intermetallic compounds (IMCs) in Pb-free solder bump is investigated. The Pb-free micro-bump, Sn-50%Bi, was fabricated by binary electroplating for flip-chip bond. The diameter of the bump is about 506m and the height is about 60 6m. In order to increase the reliability of the bonding, it is necessary to protect the growth of the IMCs in interface between Cu pad and the solder bump. For control of IMCs growth, SiC particles were distributed in the micro-solder bump during electroplating. The thickness of the IMCs in the interface was estimated by FE-SEM, EDS, XRF and TEM. From the results, The IMCs were found as Cu6Sn5 and Cu3Sn. The thickness of the IMCs decreases with increase the amount of SiC particles until 4 g/cm2. The one candidate of the reasons is that the SiC particles could decrease the area which be reacted between the solder and Cu layer. And another candidate is that the particle can make to difficult inter-diffusion within the interface.

Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

2005 ◽  
Vol 392 (1-2) ◽  
pp. 192-199 ◽  
Author(s):  
D.Q. Yu ◽  
C.M.L. Wu ◽  
C.M.T. Law ◽  
L. Wang ◽  
J.K.L. Lai
Keyword(s):  
Intermetallic Compounds ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Free Solder

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers

2013 ◽  
Vol 2013 (1) ◽  
pp. 000420-000423
Author(s):  
Kwang-Seong Choi ◽  
Ho-Eun Bae ◽  
Haksun Lee ◽  
Hyun-Cheol Bae ◽  
Yong-Sung Eom
Keyword(s):  
Screen Printing ◽  
Flip Chip ◽  
Solder Bump ◽  
Low Cost ◽  
Organic Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermally Activated ◽  
Fine Pitch ◽  
Free Solder

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process with the result that a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology can be easily implemented. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is, successfully, formed.

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