Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip

2004 ◽  
Author(s):  
Chih-Tang Peng ◽  
Chia-Tai Kuo ◽  
Kuo-Ning Chiang ◽  
T. Ku ◽  
K. Chang
Keyword(s):  
Mechanical Behavior ◽  
Behavior Analysis ◽  
Intermetallic Compounds ◽  
Solder Bump ◽  
Experimental Characterization

MICROSTRUCTURE AND MECHANICAL BEHAVIOR OF AMORPHOUS Al–Cu–Ti METAL FOAMS SYNTHESIZED BY SPARK PLASMA SINTERING

2017 ◽  
Vol 24 (Supp02) ◽  
pp. 1850022
Author(s):  
MAOYUAN LI ◽  
LIN LU ◽  
ZHEN DAI ◽  
YIQIANG HONG ◽  
WEIWEI CHEN ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Mechanical Behavior ◽  
Intermetallic Compounds ◽  
Spark Plasma Sintering ◽  
Elevated Temperatures ◽  
Volume Fraction ◽  
Metal Foams ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Xrd Patterns

Amorphous Al–Cu–Ti metal foams were prepared by spark plasma sintering (SPS) process with the diameter of 10[Formula: see text]mm. The SPS process was conducted at the pressure of 200 and 300[Formula: see text]MPa with the temperature of 653–723[Formula: see text]K, respectively. NaCl was used as the space-holder, forming almost separated pores with the porosity of 65 vol%. The microstructure and mechanical behavior of the amorphous Al–Cu–Ti metal foams were systematically investigated. The results show that the crystallinity increased at elevated temperatures. The effect of pressure and holding time on the crystallization was almost negligible. The intermetallic compounds, i.e. Al–Ti, Al–Cu and Al–Cu–Ti were identified from X-ray diffraction (XRD) patterns. It was found that weak adhesion and brittle intermetallic compounds reduced the mechanical properties, while lower volume fraction and smaller size of NaCl powders improved the mechanical properties.

Precise Quantitative Evaluation of Nano-Ordered Intermetallic Compounds in Sn-3.0Ag-0.5Cu Lead-Free Solder Bump by Using TEM

2008 ◽  
Vol 47-50 ◽  
pp. 907-911
Author(s):  
Chang Woo Lee ◽  
Y.S. Shin ◽  
J.H. Kim
Keyword(s):  
Intermetallic Compounds ◽  
Flip Chip ◽  
Solder Bump ◽  
Lead Free Solder ◽  
Growth Behaviour ◽  
Sic Particles ◽  
Imcs Growth ◽  
Ordered Intermetallic ◽  
Free Solder ◽  
The One

The growth behaviour of the intermetallic compounds (IMCs) in Pb-free solder bump is investigated. The Pb-free micro-bump, Sn-50%Bi, was fabricated by binary electroplating for flip-chip bond. The diameter of the bump is about 506m and the height is about 60 6m. In order to increase the reliability of the bonding, it is necessary to protect the growth of the IMCs in interface between Cu pad and the solder bump. For control of IMCs growth, SiC particles were distributed in the micro-solder bump during electroplating. The thickness of the IMCs in the interface was estimated by FE-SEM, EDS, XRF and TEM. From the results, The IMCs were found as Cu6Sn5 and Cu3Sn. The thickness of the IMCs decreases with increase the amount of SiC particles until 4 g/cm2. The one candidate of the reasons is that the SiC particles could decrease the area which be reacted between the solder and Cu layer. And another candidate is that the particle can make to difficult inter-diffusion within the interface.

scholarly journals Microstructure and Mechanical Behavior of Al-Mg Composites Synthesized by Reactive Sintering

Metals ◽  
2018 ◽  
Vol 8 (10) ◽  
pp. 762 ◽  
Author(s):  
Rub Nawaz Shahid ◽  
Sergio Scudino
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Yield Strength ◽  
Mechanical Behavior ◽  
Intermetallic Compounds ◽  
Metal Matrix ◽  
Stress Model ◽  
Matrix Composites ◽  
Reactive Sintering ◽  
Powder Mixtures

Lightweight metal matrix composites are synthesized from elemental powder mixtures of aluminum and magnesium using pressure-assisted reactive sintering. The effect of the reaction between aluminum and magnesium on the microstructure and mechanical properties of the composites due to the formation of β-Al3Mg2 and γ-Al12Mg17 intermetallics is investigated. The formation of the intermetallic compounds progressively consumes aluminum and magnesium and induces strengthening of the composites: the yield and compressive strengths increase with the increase of the content of intermetallic reinforcement at the expense of the plastic deformation. The yield strength of the composites follows the iso-stress model when the data are plotted as a function of the intermetallic content.

Mechanical Behavior Analysis of a 1 MJ SMES Magnet

2010 ◽  
Vol 20 (3) ◽  
pp. 1916-1919 ◽  
Author(s):  
Peng Chen ◽  
Yinming Dai ◽  
Qiuliang Wang ◽  
Quan Zhang
Keyword(s):  
Mechanical Behavior ◽  
Behavior Analysis
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