Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives

2017 ◽  
Vol 170 ◽  
pp. 54-58 ◽  
Author(s):  
Hongbin Xiao ◽  
Hu He ◽  
Xinyu Ren ◽  
Peng Zeng ◽  
Fuliang Wang
Keyword(s):  
Numerical Modeling ◽  
Experimental Verification ◽  
Copper Electrodeposition ◽  
Through Silicon Via

scholarly journals Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives

2014 ◽  
Vol 117 ◽  
pp. 8-12 ◽  
Author(s):  
Yunhui Zhu ◽  
Shenglin Ma ◽  
Xin Sun ◽  
Jing Chen ◽  
Min Miao ◽  
...  
Keyword(s):  
Numerical Modeling ◽  
Experimental Verification ◽  
Through Silicon Via

scholarly journals Numerical modeling and experimental verification of ductile damage in boron steel hot stamping process

2017 ◽  
Vol 207 ◽  
pp. 675-680
Author(s):  
Bingtao Tang ◽  
Chenchen Li ◽  
Guangchun Xiao ◽  
Wei Zhao ◽  
Huiping Li
Keyword(s):  
Numerical Modeling ◽  
Experimental Verification ◽  
Hot Stamping ◽  
Ductile Damage ◽  
Boron Steel ◽  
Stamping Process

High Speed Copper Electrodeposition for Through Silicon Via(TSV)

2019 ◽  
Vol 25 (38) ◽  
pp. 127-131
Author(s):  
Kazuo Kondo ◽  
Yushi Suzuki ◽  
Takeyasu Saito ◽  
Naoki Okamoto
Keyword(s):  
High Speed ◽  
Copper Electrodeposition ◽  
Through Silicon Via

BEM Numerical Modeling and Experimental Verification of Cathodic Protection for Offshore Structures

2011 ◽  
Vol 339 ◽  
pp. 617-623
Author(s):  
Zhi Gang Lan ◽  
Bao Rong Hou ◽  
Xiu Tong Wang
Keyword(s):  
Numerical Modeling ◽  
Boundary Element Method ◽  
Boundary Element ◽  
Computer Modeling ◽  
Cathodic Protection ◽  
Experimental Verification ◽  
Offshore Structures ◽  
Sacrificial Anode ◽  
Test Pool ◽  
Good Agreement

The progresses and theoretical methodology of computer modeling of cathodic protection using the boundary element method (BEM) are outlined. To test the effectiveness and accuracy of BEM numerical modeling of cathodic protection for offshore structures, a miniature model offshore jacket with a sacrificial anode was built and put in a test pool full of seawater. Cathodic protection potentials on different positions were measured and compared with the values obtained from computer modeling. The results show good agreement between measured value and numerical simulated value. The factors that led to discrepancy in the two groups of data were discussed.

Retraction: Copper Electrodeposition in Through-Silicon Via under Galvanostatic Condition [J. Electrochem. Soc., 163, D694 (2016)]

2016 ◽  
Vol 164 (2) ◽  
pp. X2-X2
Author(s):  
Wei Luo ◽  
Zhipeng Chen ◽  
Junhong Zhang ◽  
Ying Zhu ◽  
Liming Gao ◽  
...  
Keyword(s):  
Copper Electrodeposition ◽  
Through Silicon Via ◽  
Galvanostatic Condition

Parameters determination for modelling of copper electrodeposition in through-silicon-via with additives

2018 ◽  
Vol 196 ◽  
pp. 25-31 ◽  
Author(s):  
Yan Wang ◽  
Xin Deng ◽  
Xinyu Ren ◽  
Xiang Li ◽  
Fuliang Wang ◽  
...  
Keyword(s):  
Copper Electrodeposition ◽  
Through Silicon Via
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