Improved interfacial adhesion between diamond film and copper substrate using a Cu(Cr)–diamond composite interlayer

2012 ◽  
Vol 81 ◽  
pp. 155-157 ◽  
Author(s):  
W.Q. Qiu ◽  
Z.W. Liu ◽  
L.X. He ◽  
D.C. Zeng ◽  
Y.-W. Mai
Keyword(s):  
Diamond Film ◽  
Interfacial Adhesion ◽  
Copper Substrate ◽  
Diamond Composite

Nano-Crystalline Diamond Films Deposited on Copper Substrate by MPCVD Method

2011 ◽  
Vol 117-119 ◽  
pp. 1310-1314
Author(s):  
Xing Rui Li ◽  
Xin Wei Shi ◽  
Ning Yao ◽  
Xin Chang Wang
Keyword(s):  
Diamond Film ◽  
Deposition Time ◽  
Microwave Plasma ◽  
Copper Substrate ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Annealing Process ◽  
Adhesive Properties ◽  
Plasma Chemical Vapor Deposition ◽  
Nano Crystalline

Nano-crystalline diamond (NCD) films with good adhesion were deposited on flexible copper substrate with Ni interlayer by Microwave Plasma Chemical Vapor Deposition (MPCVD). In this paper, two-stage method was used to improve the adhesion between the copper substrates and the diamond films. The effect of deposition time of the first stage on the morphology, crystal structure, non-diamond phase and adhesive properties of diamond films was investigated. The performance and structure of the diamond films were studied by Scanning Electron Microscope (SEM), Raman Spectroscopy (Raman) and X-Ray Diffraction (XRD). The results showed that the films were nano-crystalline diamond films positively. Impress method was used to examine the adhesion between diamond film and the substrate. When deposition time is 1.5h, the adhesion between diamond film and the copper substrate is better than the others. When it was 2.5h or longer, because the graphite layers existed as intermediate, the adherence between the diamond films and copper substrates was very poor. Therefore, the diamond films were easily peeled off from the substrates. Otherwise, the second stage called annealing process after the deposition played an important role to the adhesion. The films would be easily peeled off by curling without the annealing process.

Free-standing diamond film preparation using copper substrate

1997 ◽  
Vol 6 (2-4) ◽  
pp. 422-425 ◽  
Author(s):  
Qi Hua Fan ◽  
J. Gracio ◽  
E. Pereira
Keyword(s):  
Diamond Film ◽  
Copper Substrate ◽  
Free Standing ◽  
Film Preparation

Tribological performances of diamond film and graphite/diamond composite film

Wear ◽  
2002 ◽  
Vol 253 (7-8) ◽  
pp. 711-719 ◽  
Author(s):  
Ya-Qi Hou ◽  
Da-Ming Zhuang ◽  
Gong Zhang ◽  
Min-Sheng Wu ◽  
Jia-Jun Liu
Keyword(s):  
Composite Film ◽  
Diamond Film ◽  
Diamond Composite

Fabrication of Diamond Films on Cu Metal Substrates with Buffers (SiC or MoSi2) by Hot Filament Chemical Vapor Deposition

2014 ◽  
Vol 936 ◽  
pp. 276-281
Author(s):  
Qi Zhao ◽  
Ming Jiang Dai ◽  
Di Tan ◽  
Chun Bei Wei ◽  
Wan Qi Qiu ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Diamond Film ◽  
Copper Substrate ◽  
Diamond Films ◽  
Chemical Deposition ◽  
Chemical Vapor ◽  
Metal Substrate ◽  
Buffer Layers ◽  
Laser Raman ◽  
Hot Filament

Diamond films were grown by hot filament chemical deposition (HFCVD) on Cu metal substrate with two different buffer layers (SiC or MoSi2) synthesized by using magnetron sputtering technique. The components of films were investigated using X-ray diffraction (XRD) and laser Raman spectrum, and the surface morphology and structure were observed with scanning electron microscopy (SEM). Film adherence was investigated by micro-indentation. The results showed that the diamond films were successfully grown on Cu metal substrate with two different buffer layers. There were cracks on diamond film grown on 3µm SiC buffer layer and some SiC crystal whiskers were observed. Dense diamond films with bad adhesion were observed on 22µm MoSi2 buffered copper substrate. MoSi2 made chemical reaction with CH4 and produced MoC and Mo5Si3 on the process of HFCVD. Conclusion: the 3µm buffer layer of SiC can’t help deposit no cracking diamond film; the 22µm buffer layer of MoSi2 is helpful for depositing good diamond film, but can’t effectively improve the bond strength between diamond film and copper substrate.

Metal Reinforced Diamond Composite Films

1991 ◽  
Vol 239 ◽  
Author(s):  
C. Tsai ◽  
J. Nelson ◽  
W. Gerberich ◽  
J. Heberlein ◽  
E. Pfender
Keyword(s):  
Diamond Film ◽  
Composite Films ◽  
Diamond Composite ◽  
Step Process ◽  
Metal Binder ◽  
Composite Diamond ◽  
Pin On Disk ◽  
Disk Testing ◽  
And Tungsten

ABSTRACTA three-step process for producing a composite diamond film is presented. Plasma deposited diamonds are reinforced by an electroplated metal binder and the diamonds regrown to produce a continuous, strongly adhered diamond film on molybdenum and tungsten substrates. Microscratching and pin-on-disk testing indicate that the composite films are more adherent than plasma deposited diamonds alone.

Preparation and characterization of diamond film on Cu substrate using Cu-diamond composite interlayer

2014 ◽  
Vol 24 (3) ◽  
pp. 758-763 ◽  
Author(s):  
Wan-qi QIU ◽  
Zhi-gang HU ◽  
Zhong-wu LIU ◽  
De-chang ZENG ◽  
Ke-song ZHOU
Keyword(s):  
Diamond Film ◽  
Diamond Composite ◽  
Cu Substrate

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

2006 ◽  
Vol 129 (1) ◽  
pp. 35-40 ◽  
Author(s):  
Hai Bo Fan ◽  
Edward K. L. Chan ◽  
Cell K. Y. Wong ◽  
Matthew M. F. Yuen
Keyword(s):  
Molecular Dynamics ◽  
Thermal Cycling ◽  
Cuprous Oxide ◽  
Interfacial Adhesion ◽  
Copper Substrate ◽  
Oxide System ◽  
Dynamics Simulation ◽  
Oxide Content ◽  
Thermal Cycling Test ◽  
Cycling Test

Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important to develop a better understanding of the reliability at a molecular level. In this paper, molecular dynamics (MD) simulations were conducted to investigate the interfacial energy of the epoxy molding compound (EMC) cuprous oxide system during the thermal cycling test. In order to investigate the effect of the cuprous oxide content in the copper substrate on the interfacial adhesion, two kinds of MD models were examined in this study. The results revealed that the cuprous oxide content in the copper substrate had a large effect on the interfacial adhesion between the EMC and copper, which is consistent with the experimental observation.

Effect of Surface Treatments on the Structural and Mechanical Properties of Nanostructured Diamond Coatings on Tungsten Carbide Cutting Tools

2003 ◽  
Vol 791 ◽  
Author(s):  
Vaibhav Vohra ◽  
Shane A. Catledge ◽  
Yogesh K. Vohra
Keyword(s):  
Tungsten Carbide ◽  
Diamond Film ◽  
Interfacial Adhesion ◽  
Single Layer ◽  
Chemical Vapor ◽  
Film Structure ◽  
Nanocrystalline Diamond ◽  
Growth Surface ◽  
Binder Phase ◽  
Diamond Coatings

ABSTRACTChemical Vapor Deposition (CVD) using hydrogen, methane, and nitrogen feed gases has proven to be useful in depositing well-adhered diamond films on metal substrates. These films have already found a market in the cutting tool industry as coatings on cobalt-cemented tungsten carbide (WC-Co) inserts. The purpose of this investigation is to examine how the thermal and chemical pre-treatments typically used for carbide inserts (to remove the cobalt binder near the surface) affect the structure and interfacial adhesion of the diamond coating. Removal of the cobalt binder phase in various pre-treatment methods has been shown to minimize its catalytic effect of graphite formation during diamond deposition by CVD. The diamond-coated inserts in our study were characterized using x-ray diffraction, Raman spectroscopy, atomic force microscopy, and Rockwell indentation testing. We use an unconventionally high methane concentration in the feedgas in order to saturate the growth surface with carbon, thereby limiting cobalt migration from the bulk to the surface and reducing the dissolution and diffusion of carbon atoms coming from the plasma. Nitrogen is used in the feedgas in order to provide a tough, single-layer nanocrystalline diamond film structure. In addition, a multi-layer (nano-/micro-/nano-crystalline) CVD diamond film was grown by controlling the flow of nitrogen in order to show its characteristics in comparison with the single layer nanocrystalline diamond film. The multilayer film on the thermally-treated insert shows enhanced interfacial adhesion and fracture toughness when compared to other pretreatments and diamond coatings. This was demonstrated by indentation tests using 1470 N load.

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