Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

2006 ◽  
Vol 129 (1) ◽  
pp. 35-40 ◽  
Author(s):  
Hai Bo Fan ◽  
Edward K. L. Chan ◽  
Cell K. Y. Wong ◽  
Matthew M. F. Yuen
Keyword(s):  
Molecular Dynamics ◽  
Thermal Cycling ◽  
Cuprous Oxide ◽  
Interfacial Adhesion ◽  
Copper Substrate ◽  
Oxide System ◽  
Dynamics Simulation ◽  
Oxide Content ◽  
Thermal Cycling Test ◽  
Cycling Test

Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important to develop a better understanding of the reliability at a molecular level. In this paper, molecular dynamics (MD) simulations were conducted to investigate the interfacial energy of the epoxy molding compound (EMC) cuprous oxide system during the thermal cycling test. In order to investigate the effect of the cuprous oxide content in the copper substrate on the interfacial adhesion, two kinds of MD models were examined in this study. The results revealed that the cuprous oxide content in the copper substrate had a large effect on the interfacial adhesion between the EMC and copper, which is consistent with the experimental observation.

scholarly journals Influence of Nanoscale Textured Surfaces and Subsurface Defects on Friction Behaviors by Molecular Dynamics Simulation

Nanomaterials ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 1617 ◽  
Author(s):  
Ruiting Tong ◽  
Zefen Quan ◽  
Yangdong Zhao ◽  
Bin Han ◽  
Geng Liu
Keyword(s):  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Friction Force ◽  
Copper Substrate ◽  
Dynamics Simulation ◽  
Textured Surfaces ◽  
Friction Forces ◽  
Subsurface Structures ◽  
Texture Orientation ◽  
Subsurface Defects

In nanomaterials, the surface or the subsurface structures influence the friction behaviors greatly. In this work, nanoscale friction behaviors between a rigid cylinder tip and a single crystal copper substrate are studied by molecular dynamics simulation. Nanoscale textured surfaces are modeled on the surface of the substrate to represent the surface structures, and the spacings between textures are seen as defects on the surface. Nano-defects are prepared at the subsurface of the substrate. The effects of depth, orientation, width and shape of textured surfaces on the average friction forces are investigated, and the influence of subsurface defects in the substrate is also studied. Compared with the smooth surface, textured surfaces can improve friction behaviors effectively. The textured surfaces with a greater depth or smaller width lead to lower friction forces. The surface with 45° texture orientation produces the lowest average friction force among all the orientations. The influence of the shape is slight, and the v-shape shows a lower average friction force. Besides, the subsurface defects in the substrate make the sliding process unstable and the influence of subsurface defects on friction forces is sensitive to their positions.

A thermal cycling test of tungsten copper bonds for divertor collector plates

1989 ◽  
Vol 9 ◽  
pp. 271-276 ◽  
Author(s):  
M. Ogawa ◽  
M. Seki ◽  
K. Fukaya ◽  
T. Horie ◽  
T. Araki
Keyword(s):  
Thermal Cycling ◽  
Thermal Cycling Test ◽  
Cycling Test

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Reliability of Fan-Out Wafer-Level Heterogeneous Integration

2018 ◽  
Vol 15 (4) ◽  
pp. 148-162 ◽  
Author(s):  
John Lau ◽  
Ming Li ◽  
Yang Lei ◽  
Margie Li ◽  
Iris Xu ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Thermal Cycling Test ◽  
Wafer Level ◽  
Molding Compound ◽  
Shock Test ◽  
Cycling Test

Abstract In this study, the reliability (thermal cycling and shock) performances of a fan-out wafer-level system-in-package (SiP) or heterogeneous integration with one large chip (5 × 5 mm), three small chips (3 ×3 mm), and four capacitors (0402) embedded in an epoxy molding compound package (10 × 10 mm) with two redistribution layers (RDLs) are experimentally determined. Emphasis is placed on the estimation of the Weibull life distribution, characteristic life, and failure rate of the solder joint and RDL of this package. The fan-out wafer-level packaging is assembled on a printed circuit board (PCB) with more than 400 (Sn3wt%Ag0.5wt%Cu) solder joints. It is a six-layer PCB. The sample sizes for the thermal cycling test and shock test are, respectively, equal to 60 and 24. The failure location and modes of the thermal cycling test and shock test of the fan-out wafer-level SiP solder joints and RDLs are provided and discussed. 3-D nonlinear finite element models are also constructed and analyzed for the fan-out heterogeneous integration package during thermal cycling and shock conditions. The simulation results are correlated to the experimental results. Finally, recommendations on improving the fan-out wafer-level SiP solder joints and RDLs under thermal and shock conditions are provided.

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