Insertable thin film thermocouples for in situ transient temperature monitoring in ultrasonic metal welding of battery tabs

2013 ◽  
Vol 15 (1) ◽  
pp. 136-140 ◽  
Author(s):  
Jingzhou Zhao ◽  
Hang Li ◽  
Hongseok Choi ◽  
Wayne Cai ◽  
Jeffrey A. Abell ◽  
...  
2016 ◽  
Vol 52 (13) ◽  
pp. 1140-1141 ◽  
Author(s):  
WenLian Wang ◽  
Hui Zhang ◽  
XiaoJun Du ◽  
YouYi Sun

Sensors ◽  
2020 ◽  
Vol 20 (5) ◽  
pp. 1289 ◽  
Author(s):  
Jinjun Deng ◽  
Linwei Zhang ◽  
Liuan Hui ◽  
Xinhang Jin ◽  
Binghe Ma

Indium tin oxide (ITO) thin-film thermocouples monitor the temperature of hot section components in gas turbines. As an in situ measuring technology, the main challenge of a thin-film thermocouple is its installation on complex geometric surfaces. In this study, an ITO thin-film thermocouple probe based on a sapphire microrod was used to access narrow areas. The performance of the probe, i.e., the thermoelectricity and stability, was analyzed. This novel sensor resolves the installation difficulties of thin-film devices.


2011 ◽  
Vol 189-193 ◽  
pp. 3170-3174
Author(s):  
Qi Yong Zeng ◽  
Xiao Feng Zheng ◽  
Gao Hui Zhang ◽  
Le Chen

Temperature plays a vital role in the machining industry today. NiCr/NiSi thin-film thermocouples have been deposited on the rake face of polycrystalline cubic boron nitride (PCBN) tools by magnetron sputtering. The typical deposition conditions are summarized. Static and dynamic calibrations of the NiCr/NiSi thin-film thermocouples are presented. The Seebeck coefficient of the TFTC is 37.3 μV/°C. The response time is about 3.9 ms. The testing results indicate that the developed NiCr/NiSi thin-film thermocouple sensors perform excellently when machining A3 steel in situ.


Author(s):  
Hongseok Choi ◽  
Arindom Datta ◽  
Xiaochun Li

This paper studies the fabrication and calibration of thin film temperature sensors embedded in metal structures. Thin film thermocouples have been successfully fabricated on various metal substrates and advanced embedding techniques have been developed to ensure sensor function inside metal structures. Thin film thermocouple was insulated with multiple thin film layers (Al2O3 and Si3N4) by e-beam evaporating and plasma enhanced chemical vapor deposition (PECVD). The sensors are calibrated. These embedded thin film sensors provide superior spatial and temporal resolution that is not possible with traditional sensors used in various manufacturing processes. This research is significant in a way that it provides a new and improved route for in-situ monitoring of manufacturing process.


2012 ◽  
Vol 512-515 ◽  
pp. 2068-2071 ◽  
Author(s):  
Hang Guo ◽  
Jun Ying Jiang ◽  
Jia Xing Liu ◽  
Zhi Hua Nie ◽  
Fang Ye ◽  
...  

Thin film thermocouples (TFTCs) have vast vistas owing to their advantages, such as thin junction, small volume, fast response rate, high sensitivity and so on. In this investigation, a transient temperature sensor of TFTCs was fabricated to measure the surface transient temperature by vacuum coating technology. Silicon dioxide was selected as insulating substrate, the overall dimension of which was 8 mm long, 8 mm wide, and 0.1 mm thick. Two different metal layers were sandwiched between silicon dioxide 2 insulating substrate and silicon dioxide protective layer: cuprum and nickel films, which were 0.08 μm thick. TFTCs consist of 13 Cu-Ni junctions, which are connected in series. The whole TFTCs area is 4.6mm × 4.6 mm. The aggregate thickness of the transient temperature sensor is 0.17 μm. To protect Cu and Ni films, a silicon dioxide layer thickness of 0.01 μm was evaporated on metal layers excluding terminal points. This research carried out static and dynamic calibration to TFTCs. The Seebeck coefficient of the thin film thermocouple is 0.83843 μV/°C. The dynamic performance of TFTCs exhibited dynamic behavior corresponding to the heat flux change on the surface of thin film thermocouple.


2006 ◽  
Vol 129 (2) ◽  
pp. 416-424 ◽  
Author(s):  
Xudong Cheng ◽  
Arindom Datta ◽  
Hongseok Choi ◽  
Xugang Zhang ◽  
Xiaochun Li

Real time monitoring, diagnosis, and control of numerous manufacturing processes is of critical importance in reducing operation costs, improving product quality, and shortening response time. Current sensors used in manufacturing are normally unable to provide measurements with desired spatial and temporal resolution at critical locations in metal tooling structures that operate in hostile environments (e.g., elevated temperatures and severe strains). Microsensors are expected to offer tremendous benefits for real time sensing in manufacturing processes. Rapid tooling, a layered manufacturing process, could allow microsensors to be placed at any critical location in metal tooling structures. However, a viable approach is needed to effectively integrate microsensors into metal structures during the process. In this study, a novel batch production of metal embedded microsensor units was realized by transferring thin-film sensors from silicon wafers directly into nickel substrates through standard microfabrication and electroplating techniques. Ultrasonic metal welding (USMW) was studied to obtain optimized process parameters and then used to integrate nickel embedded thin-film thermocouple (TFTC) units into copper workpieces. The embedded TFTCs successfully survived the welding tests, validating that USMW is a viable method to integrate microsensors to metallic tool materials. Moreover, the embedded microsensors were also able to measure the transient temperature in situ at 50μm directly beneath the welding interface during welding. The transient temperatures measured by the metal embedded TFTCs provide strong evidence that the heat generation is not critical for weld formation during USMW. Metal embedded microsensors yield great potential to improve fundamental understanding of numerous manufacturing processes by providing in situ sensing data with high spatial and temporal resolution at critical locations.


2014 ◽  
Vol 260 ◽  
pp. 43-49 ◽  
Author(s):  
Madhu Santosh K. Mutyala ◽  
Jingzhou Zhao ◽  
Jianyang Li ◽  
Hongen Pan ◽  
Chris Yuan ◽  
...  

Author(s):  
Hongseok Choi ◽  
Xiaochun Li

It is of fundamental interest to investigate the complicated and transient thermal phenomena near the nanosecond pulsed laser-material interaction region. While numerous analytic and numerical models have been developed, little experimental results are available for a solid understanding of transient thermal phenomena in nanosecond pulsed laser micro drilling. In this paper, micro thin film thermocouples were fabricated on electroplated nickel substrates to study the transient temperature variations during laser micro drilling. Transient temperatures were successfully measured with superior temporal and spatial resolutions for the fundamental study of the nanosecond pulsed laser micro drilling. The in-situ measured data can be used to improve existing analytical and numerical models.


Sign in / Sign up

Export Citation Format

Share Document