scholarly journals Electro-chemical mechanical polishing of single-crystal SiC using CeO2 slurry

2015 ◽  
Vol 52 ◽  
pp. 5-8 ◽  
Author(s):  
Hui Deng ◽  
Kenji Hosoya ◽  
Yusuke Imanishi ◽  
Katsuyoshi Endo ◽  
Kazuya Yamamura
Keyword(s):  
Single Crystal ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Single Crystal Sic

scholarly journals A Review on Precision Polishing Technology of Single-Crystal SiC

Crystals ◽  
2022 ◽  
Vol 12 (1) ◽  
pp. 101
Author(s):  
Gaoling Ma ◽  
Shujuan Li ◽  
Feilong Liu ◽  
Chen Zhang ◽  
Zhen Jia ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Chemical Mechanical Polishing ◽  
Surface Defects ◽  
Waste Treatment ◽  
Removal Rate ◽  
Research Direction ◽  
Mechanical Polishing ◽  
Neutral Salt ◽  
Single Crystal Sic

Single-crystal SiC is a typical third-generation semiconductor power-device material because of its excellent electronic and thermal properties. An ultrasmooth surface with atomic surface roughness that is scratch free and subsurface damage (SSD) free is indispensable before its application. As the last process to reduce the surface roughness and remove surface defects, precision polishing of single-crystal SiC is essential. In this paper, precision polishing technologies for 4H-SiC and 6H-SiC, which are the most commonly used polytypes of single-crystal SiC, such as chemical mechanical polishing (CMP), photocatalytic chemical mechanical polishing (PCMP), plasma-assisted polishing (PAP), electrochemical mechanical polishing (ECMP), and catalyst-referred etching (CARE), were reviewed and compared with emphasis on the experimental setup, polishing mechanism, material removal rate (MRR), and surface roughness. An atomically smooth surface without SSD can be obtained by CMP, PCMP, PAP, and CARE for single-crystal SiC. However, their MRRs are meager, and the waste treatment after CMP is difficult and expensive. Moreover, PAP’s operation is poor due to the complex polishing system, plasma generation, and irradiation devices. A high MRR can be achieved by ECMP. In addition, it is an environmentally friendly precision polishing process for single-crystal SiC since the neutral salt solution is generally used as the electrolyte in ECMP. However, the formation of the egglike protrusions at the oxide/SiC interface during anodic oxidation would lead to a bigger surface roughness after ECMP than that after PAP is processed. The HF solution used in CARE was toxic, and Pt was particularly expensive. Ultrasonic vibration-assisted single-crystal SiC polishing and electrolyte plasma polishing (EPP) were discussed; furthermore, the research direction of further improving the surface quality and MRR of single-crystal SiC was prospected.

A novel slurry for chemical mechanical polishing of single crystal diamond

2021 ◽  
pp. 150431
Author(s):  
Longxing Liao ◽  
Zhenyu Zhang ◽  
Fanning Meng ◽  
Dongdong Liu ◽  
Bin Wu ◽  
...  
Keyword(s):  
Single Crystal ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Single Crystal Diamond

scholarly journals Integration Technology for Wafer-Level LiNbO3 Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2554
Author(s):  
Wenping Geng ◽  
Xiangyu Yang ◽  
Gang Xue ◽  
Wenhao Xu ◽  
Kaixi Bi ◽  
...  
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Chemical Mechanical Polishing ◽  
Adhesive Bonding ◽  
Mechanical Polishing ◽  
Bonding Interface ◽  
Infrared Analysis ◽  
Mems Devices ◽  
Wafer Level ◽  
Integration Technology

An integration technology for wafer-level LiNbO3 single-crystal thin film on Si has been achieved. The optimized spin-coating speed of PI (polyimide) adhesive is 3500 rad/min. According to Fourier infrared analysis of the chemical state of the film baked under different conditions, a high-quality PI film that can be used for wafer-level bonding is obtained. A high bonding strength of 11.38 MPa is obtained by a tensile machine. The bonding interface is uniform, completed and non-porous. After the PI adhesive bonding process, the LiNbO3 single-crystal was lapped by chemical mechanical polishing. The thickness of the 100 mm diameter LiNbO3 can be decreased from 500 to 10 μm without generating serious cracks. A defect-free and tight bonding interface was confirmed by scanning electron microscopy. X-ray diffraction results show that the prepared LiNbO3 single-crystal thin film has a highly crystalline quality. Heterogeneous integration of LiNbO3 single-crystal thin film on Si is of great significance to the fabrication of MEMS devices for in-situ measurement of space-sensing signals.

Sign in / Sign up

Export Citation Format

Share Document