High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

2012 ◽  
Vol 537 ◽  
pp. 70-75 ◽  
Author(s):  
Jung-Pyo Hong ◽  
Sung-Woon Yoon ◽  
Taeseon Hwang ◽  
Joon-Suk Oh ◽  
Seung-Chul Hong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Nitride ◽  
Bimodal Distribution ◽  
High Thermal Conductivity ◽  
Epoxy Composites

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Surface Modified ◽  
Enhanced Thermal Conductivity ◽  
Electrical Insulation Properties

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.

scholarly journals Synergistic Enhanced Thermal Conductivity and Dielectric Constant of Epoxy Composites with Mesoporous Silica Coated Carbon Nanotube and Boron Nitride Nanosheet

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5251
Author(s):  
Yutao Hao ◽  
Qihan Li ◽  
Xianhai Pang ◽  
Bohong Gong ◽  
Chengmei Wei ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Boron Nitride ◽  
Mesoporous Silica ◽  
Epoxy Composite ◽  
Dielectric Materials ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Charge Movement ◽  
Boron Nitride Nanosheet

Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here, a multifunctional epoxy composite is fulfilled by incorporation of boron nitride nanosheets (BNNSs) and mesoporous silica coated multi-walled carbon nanotubes (MWCNTs@mSiO2). Owing to the effective establishment of continuous thermal conductive network, the obtained BNNSs/MWCNTs@mSiO2/epoxy composite exhibits a high thermal conductivity of 0.68 W m−1 K−1, which is 187% higher than that of epoxy matrix. In addition, the introducing of mesoporous silica dielectric layer can screen charge movement to shut off leakage current between MWCNTs, which imparts BNNSs/MWCNTs@mSiO2/epoxy composite with high dielectric constant (8.10) and low dielectric loss (<0.01) simultaneously. It is believed that the BNNSs/MWCNTs@mSiO2/epoxy composites with admirable features have potential applications in modern electronics.

Epoxy composites filled with boron nitride and aluminum nitride for improved thermal conductivity

Polimery ◽  
2017 ◽  
Vol 62 (7/8) ◽  
pp. 560-566 ◽  
Author(s):  
John M. Hutchinson ◽  
Frida Roman ◽  
Pilar Cortes ◽  
Yolanda Calventus
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Nitride ◽  
Epoxy Composites

High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration

2021 ◽  
pp. 109264
Author(s):  
Eun-Sung Lee ◽  
Jong-Gu Kang ◽  
Min-Kyeong Kang ◽  
Ki-Hong Kim ◽  
Seon-Tae Park ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites

Boron nitride@graphene oxide hybrids for epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2016 ◽  
Vol 6 (42) ◽  
pp. 35847-35854 ◽  
Author(s):  
Tao Huang ◽  
Xiaoliang Zeng ◽  
Yimin Yao ◽  
Rong Sun ◽  
Fanling Meng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Self Assembly ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Assembly Strategy ◽  
Enhanced Thermal Conductivity

Boron nitride/graphene oxide hybrids prepared by an electrostatic self-assembly strategy were used as fillers for epoxy composites with high thermal conductivity.

Nano–micro structure of functionalized boron nitride and aluminum oxide for epoxy composites with enhanced thermal conductivity and breakdown strength

RSC Advances ◽  
2014 ◽  
Vol 4 (40) ◽  
pp. 21010-21017 ◽  
Author(s):  
Lijun Fang ◽  
Chao Wu ◽  
Rong Qian ◽  
Liyuan Xie ◽  
Ke Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Aluminum Oxide ◽  
Breakdown Strength ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Micro Structure ◽  
Ceramic Fillers ◽  
Enhanced Thermal Conductivity

Nano-micro structure of modified 2-D and 0-D ceramic fillers is designed for epoxy with high thermal conductivity and breakdown strength.

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