Role of silica nanoparticle in multi-component epoxy composites for electrical insulation with high thermal conductivity

2017 ◽  
Vol 101 (6) ◽  
pp. 2450-2458 ◽  
Author(s):  
Dae Ho Lee ◽  
Nakyung Lee ◽  
Hoyyul Park
Keyword(s):  
Thermal Conductivity ◽  
Silica Nanoparticle ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Epoxy Composites

scholarly journals Composites of epoxy/graphene-modified-diamond filler show enhanced thermal conductivity and high electrical insulation

RSC Advances ◽  
2017 ◽  
Vol 7 (65) ◽  
pp. 40761-40766 ◽  
Author(s):  
Jin Jiang ◽  
Feixiang Liu ◽  
Kunyi Zhuang ◽  
Danqing Chen ◽  
Guohua Chen
Keyword(s):  
Thermal Conductivity ◽  
Electric Conductivity ◽  
Single Step ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Step Process ◽  
Enhanced Thermal Conductivity

In this work, we developed a single-step process to cast epoxy composites having a high thermal conductivity but a low electric conductivity.

Effect of aminopropylisobutyl polyhedral oligomeric silsesquioxane functionalized graphene on the thermal conductivity and electrical insulation properties of epoxy composites

RSC Advances ◽  
2016 ◽  
Vol 6 (13) ◽  
pp. 10498-10506 ◽  
Author(s):  
Peisong Zong ◽  
Jifang Fu ◽  
Liya Chen ◽  
Jintao Yin ◽  
Xing Dong ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Interfacial Interaction ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Functionalized Graphene ◽  
Strong Interfacial Interaction ◽  
Oligomeric Silsesquioxane ◽  
Electrical Insulation Properties

To obtain homogeneous dispersion and strong interfacial interaction in epoxy nanocomposites, an effective approach is proposed to prepare ApPOSS-graphene enhancement epoxy hybrids with high thermal conductivity and electrical insulating property.

Sandwich-structured PVA/rGO films from self-construction with high thermal conductivity and electrical insulation

2021 ◽  
Vol 207 ◽  
pp. 108707
Author(s):  
Fanghua Luo ◽  
Min Zhang ◽  
Songlin Chen ◽  
Jianfeng Xu ◽  
Chen Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Insulation ◽  
High Thermal Conductivity

The flexible film of SCF/BN/PDMS composites with high thermal conductivity and electrical insulation

2021 ◽  
Vol 23 ◽  
pp. 100573
Author(s):  
Houbao Liu ◽  
Xinqing Su ◽  
Renli Fu ◽  
Binyong Wu ◽  
Xudong Chen
Keyword(s):  
Thermal Conductivity ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Flexible Film

Unprecedentedly high thermal conductivity of carbon/epoxy composites derived from parameter optimization studies

2020 ◽  
Vol 186 ◽  
pp. 107915 ◽  
Author(s):  
Yong Sik Yeom ◽  
Kie Yong Cho ◽  
Heun Young Seo ◽  
Jong Suk Lee ◽  
Do Hyun Im ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Parameter Optimization ◽  
High Thermal Conductivity ◽  
Epoxy Composites

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

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