Fluorinated polyimide with polyhedral oligomeric silsesquioxane aggregates: Toward low dielectric constant and high toughness

2019 ◽  
Vol 181 ◽  
pp. 107700 ◽  
Author(s):  
Zhigeng Chen ◽  
Yubin Zhou ◽  
Yancheng Wu ◽  
Shumei Liu ◽  
Haohao Huang ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Low Dielectric Constant ◽  
High Toughness ◽  
Low Dielectric ◽  
Fluorinated Polyimide ◽  
Oligomeric Silsesquioxane

Toughening of cyanate resin with low dielectric constant by glycidyl polyhedral oligomeric silsesquioxane

2016 ◽  
Vol 29 (4) ◽  
pp. 458-466 ◽  
Author(s):  
Jian Jiao ◽  
Li-zhen Zhao ◽  
Yu Xia ◽  
Lei Wang
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Low Dielectric Constant ◽  
Curing Agent ◽  
Melt Blending ◽  
Elongation At Break ◽  
Low Dielectric ◽  
Oligomeric Silsesquioxane ◽  
Scanning Electron

In this article, a high-performance hybrid material was prepared by melt blending from glycidyl polyhedral oligomeric silsesquioxane (G-POSS) and bisphenol-A cyanate ester (CE), using triethylamine as the curing agent. The structure of the hybrid was characterized by Fourier transform infrared spectroscopy and scanning electron microscopy (SEM), and the transparency properties, mechanical properties, dielectric properties, thermal performance, and wet fastness were studied. The results showed that G-POSS was uniformly distributed in the CE matrix and could obviously accelerate the curing reaction of the resin. Large amounts of corrugated and scaled structures were observed on the fractures of G-POSS/CE by the SEM photos. When the G-POSS content increased to 7 phr, the tensile strength (75.45 MPa), elongation at break (3.19%), and impact strength (23.76 kJ m−2) reached maximum values, representing increases of 21.75%, 27.6%, and 157.98% relative to that of pure CE, respectively, which indicated that the addition of G-POSS can significantly improve the toughness of G-POSS/CE composites. When the G-POSS content increased to 4 phr, the dielectric constant decreased from 3.27 to the minimum value of 3.05. The heat resistance and wet fastness of G-POSS/CE hybrid materials decreased with increasing G-POSS content.

scholarly journals Fluorinated polyimide/POSS hybrid polymers with high solubility and low dielectric constant

2016 ◽  
Vol 34 (11) ◽  
pp. 1363-1372 ◽  
Author(s):  
Chen-yi Wang ◽  
Wen-tao Chen ◽  
Chang Xu ◽  
Xiao-yan Zhao ◽  
Jian Li
Keyword(s):  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
High Solubility ◽  
Hybrid Polymers ◽  
Low Dielectric ◽  
Fluorinated Polyimide

High-performance fluorinated polyimide/pure silica zeolite nanocrystal hybrid films with a low dielectric constant

RSC Advances ◽  
2015 ◽  
Vol 5 (93) ◽  
pp. 76476-76482 ◽  
Author(s):  
Zhenxun Huang ◽  
Shumei Liu ◽  
Yanchao Yuan ◽  
Jianqing Zhao
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Hybrid Films ◽  
Low Dielectric ◽  
Simple Strategy ◽  
Pure Silica ◽  
Fluorinated Polyimide ◽  
Enhanced Properties

A simple strategy for preparing the low-κ FPI hybrids with enhanced properties.

scholarly journals Functional Polyimide/Polyhedral Oligomeric Silsesquioxane Nanocomposites

Polymers ◽  
2018 ◽  
Vol 11 (1) ◽  
pp. 26 ◽  
Author(s):  
Mohamed Mohamed ◽  
Shiao Kuo
Keyword(s):  
Mechanical Characteristics ◽  
Chemical Resistance ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Surface Hydrophobicity ◽  
Low Dielectric Constant ◽  
Hybrid Nanocomposite ◽  
Low Dielectric ◽  
Redox Stability ◽  
Oligomeric Silsesquioxane ◽  
Physical Blending

The preparation of hybrid nanocomposite materials derived from polyhedral oligomeric silsesquioxane (POSS) nanoparticles and polyimide (PI) has recently attracted much attention from both academia and industry, because such materials can display low water absorption, high thermal stability, good mechanical characteristics, low dielectric constant, flame retardance, chemical resistance, thermo-redox stability, surface hydrophobicity, and excellent electrical properties. Herein, we discussed the various methods that have been used to insert POSS nanoparticles into PI matrices, through covalent chemical bonding and physical blending, as well as the influence of the POSS units on the physical properties of the PIs.

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