Ultra low dielectric constant soluble polyhedral oligomeric silsesquioxane (POSS)–poly(aryl ether ketone) nanocomposites with excellent thermal and mechanical properties

2014 ◽  
Vol 2 (6) ◽  
pp. 1094-1103 ◽  
Author(s):  
Zhi Geng ◽  
Mingxin Huo ◽  
Jianxin Mu ◽  
Shuling Zhang ◽  
Yaning Lu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Dielectric Constant ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Low Dielectric Constant ◽  
Thermal And Mechanical Properties ◽  
Aryl Ether ◽  
Low Dielectric ◽  
Aryl Ether Ketone ◽  
Ether Ketone ◽  
Oligomeric Silsesquioxane

Design and preparation of silica tube/poly(aryl ether ketone) composites with low dielectric constant

RSC Advances ◽  
2016 ◽  
Vol 6 (77) ◽  
pp. 72999-73005 ◽  
Author(s):  
Yaning Lu ◽  
Shuling Zhang ◽  
Zhi Geng ◽  
Yinlong Du ◽  
Kai Zhu ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Silica Tube ◽  
Aryl Ether ◽  
Low Dielectric ◽  
Aryl Ether Ketone ◽  
Ether Ketone ◽  
Porous Composites ◽  
Nanosized Silica

Low dielectric constant porous composites in which uniform nanosized silica tubes are covalently bonding onto fluoropoly(aryl ether ketone) are prepared.

Design and preparation of poly(aryl ether ketone)/phosphotungstic acid hybrid films with low dielectric constant

2013 ◽  
Vol 129 (6) ◽  
pp. 3219-3225 ◽  
Author(s):  
Zhi Geng ◽  
Shuling Zhang ◽  
Jianxin Mu ◽  
Xu Jiang ◽  
Pengfei Huo ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Phosphotungstic Acid ◽  
Low Dielectric Constant ◽  
Aryl Ether ◽  
Hybrid Films ◽  
Low Dielectric ◽  
Aryl Ether Ketone ◽  
Ether Ketone

Hybrid formation of graphene oxide–POSS and their effect on the dielectric properties of poly(aryl ether ketone) composites

2017 ◽  
Vol 41 (8) ◽  
pp. 3089-3096 ◽  
Author(s):  
Yaning Lu ◽  
Shuling Zhang ◽  
Zhi Geng ◽  
Kai Zhu ◽  
Menghan Zhang ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Graphene Oxide ◽  
Dielectric Properties ◽  
Polymer Matrix ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Aryl Ether ◽  
Covalent Functionalization ◽  
Aryl Ether Ketone ◽  
Ether Ketone ◽  
Oligomeric Silsesquioxane

Covalent functionalization of graphene oxide with aminopropylisobutyl polyhedral oligomeric silsesquioxane efficiently reduced the dielectric constant of the polymer matrix.

Toughening of cyanate resin with low dielectric constant by glycidyl polyhedral oligomeric silsesquioxane

2016 ◽  
Vol 29 (4) ◽  
pp. 458-466 ◽  
Author(s):  
Jian Jiao ◽  
Li-zhen Zhao ◽  
Yu Xia ◽  
Lei Wang
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Low Dielectric Constant ◽  
Curing Agent ◽  
Melt Blending ◽  
Elongation At Break ◽  
Low Dielectric ◽  
Oligomeric Silsesquioxane ◽  
Scanning Electron

In this article, a high-performance hybrid material was prepared by melt blending from glycidyl polyhedral oligomeric silsesquioxane (G-POSS) and bisphenol-A cyanate ester (CE), using triethylamine as the curing agent. The structure of the hybrid was characterized by Fourier transform infrared spectroscopy and scanning electron microscopy (SEM), and the transparency properties, mechanical properties, dielectric properties, thermal performance, and wet fastness were studied. The results showed that G-POSS was uniformly distributed in the CE matrix and could obviously accelerate the curing reaction of the resin. Large amounts of corrugated and scaled structures were observed on the fractures of G-POSS/CE by the SEM photos. When the G-POSS content increased to 7 phr, the tensile strength (75.45 MPa), elongation at break (3.19%), and impact strength (23.76 kJ m−2) reached maximum values, representing increases of 21.75%, 27.6%, and 157.98% relative to that of pure CE, respectively, which indicated that the addition of G-POSS can significantly improve the toughness of G-POSS/CE composites. When the G-POSS content increased to 4 phr, the dielectric constant decreased from 3.27 to the minimum value of 3.05. The heat resistance and wet fastness of G-POSS/CE hybrid materials decreased with increasing G-POSS content.

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