Extremely high thermal conductivity of nanodiamond-polydopamine/thin-layer graphene composite films

2018 ◽  
Vol 167 ◽  
pp. 313-322 ◽  
Author(s):  
Hui-Ching Yuan ◽  
Chi-Young Lee ◽  
Nyan-Hwa Tai
Author(s):  
Seung Won Lee ◽  
Hyoung Tae Kim ◽  
In Cheol Bang

The fuel rod performance of enhanced thermal conductivity UO2/graphene composites is investigated through a LBLOCA analysis. The benefits increased monotonically with increasing thermal conductivity in terms of reduced fuel center temperature and PCT. The performance of the UO2/graphene composite fuel is assessed in OPR-1000 (Optimized Power Reactor-1000) during a LBLOCA. Graphene can be a promising material for developing advanced nuclear fuel because of its property about the high thermal conductivity and low absorption cross section. The results confirm a LBLOCA performance related to PCT of the UO2/graphene composite fuel and its potential while maintaining large safety margins.


2019 ◽  
Vol 2019 ◽  
pp. 1-12 ◽  
Author(s):  
Min Chao ◽  
Yanming Li ◽  
Guanglei Wu ◽  
Zhenjun Zhou ◽  
Luke Yan

Polyimide- (PI-) based nanocomposites containing the 4,4′-diaminodiphenyl ether- (ODA-) modified multiwalled carbon nanotube (MWCNT) filler were successfully prepared. The PI/MWCNTs-ODA composite films exhibit high thermal conductivity and excellent mechanical property. The optimal value of thermal conductivity of the PI/MWCNTs-ODA composite film is 0.4397 W/mK with 3 wt.% filler loading, increased by 221.89% in comparison with that of the pure PI film. In addition, the tensile strength of the PI/MWCNTs-ODA composite film is 141.48 MPa with 3 wt.% filler loading, increased by 20.74% in comparison with that of the pure PI film. This work develops a new strategy to achieve a good balance between the high thermal conductivity and excellent mechanical properties of polyimide composite films by using functionalized carbon nanotubes as an effective thermal conductive filler.


RSC Advances ◽  
2017 ◽  
Vol 7 (25) ◽  
pp. 15492-15499 ◽  
Author(s):  
Shoya Uchida ◽  
Tomoya Murakami ◽  
Takeru Iwamura ◽  
Ryohei Ishige ◽  
Shinji Ando

Novel composite films exhibiting high thermal conductivity along the out-of-plane direction were prepared from two types of immiscible polyimides (PIs) and needle-shaped ZnO particles.


2020 ◽  
Vol 503 ◽  
pp. 144334 ◽  
Author(s):  
Jiaqi Yang ◽  
Yibo Hu ◽  
Chenggang Jin ◽  
Lanjian Zhuge ◽  
Xuemei Wu

2020 ◽  
Vol 503 ◽  
pp. 144169
Author(s):  
Cheng Chen ◽  
Lu Kou ◽  
Tom Hauffman ◽  
Zhiyong Zhang ◽  
Sven Pletincx ◽  
...  

2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000001-00005
Author(s):  
Ya Liu ◽  
Nan Wang ◽  
Lilei Ye ◽  
Abdelhafid Zehri ◽  
Andreas Nylander ◽  
...  

Abstract Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m−1 K−1 and 0.485 W m−1 K−1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.


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