Facile synthesis of imidazole microcapsules via thiol-click chemistry and their application as thermally latent curing agent for epoxy resins

2017 ◽  
Vol 142 ◽  
pp. 198-206 ◽  
Author(s):  
Chunmei Li ◽  
Jiaojun Tan ◽  
Junwei Gu ◽  
Ying Xue ◽  
Lei Qiao ◽  
...  
2010 ◽  
Vol 51 (7) ◽  
pp. 1022-1025 ◽  
Author(s):  
Guilherme Rocha Pereira ◽  
Leandro José Santos ◽  
Inácio Luduvico ◽  
Rosemeire Brondi Alves ◽  
Rossimiriam Pereira de Freitas

2008 ◽  
Vol 41 (24) ◽  
pp. 9542-9547 ◽  
Author(s):  
Paul D. Topham ◽  
Nicolas Sandon ◽  
Elizabeth S. Read ◽  
Jeppe Madsen ◽  
Anthony J. Ryan ◽  
...  

CORROSION ◽  
1961 ◽  
Vol 17 (1) ◽  
pp. 11t-20t ◽  
Author(s):  
RONALD L. DeHOFF

Abstract The epoxy resins most widely used in corrosion prevention are liquids of low molecular weight which can be converted to hard, tough, chemically resistant polymers by the use of various curing agents. Unlike other thermosetting resins such as polyesters, the curing agents may produce chemical linkages in the final polymers that differ from those present in the uncured form. Hence, the properties of cured epoxy resins are likely dependent upon, and may even reflect the properties of the curing agent used. Some seven different epoxy resin systems were exposed to various chemical environments and evaluatd for changes in dimensional stability and flexural strengths over a six month period. From the data presented herein, only limited conclusions may be drawn. Heat cured systems fare better than room temperature cured systems in every case. Anhydride cured epoxy resins show greater resistance to outdoor weathering than amine cured systems. 5.4.5, 6.6.8


1999 ◽  
Vol 19 (3) ◽  
pp. 161-174 ◽  
Author(s):  
Oriana Motta ◽  
Antonino Rocca ◽  
Valentina Siracusa ◽  
Domenico Acierno

Abstract In this paper we carried out the crosslinking of the tetraglycidyl-4,4′- diaminodiphenyl methane epoxy resin by using a reactive poly(arylene ether sulphone) as curing agent. Differential scanning calorimetry was used to derive the kinetic parameters of the reactions involved in the cure process and to evaluate the extent of the reaction as a function of time by measuring the total (ΔHr) and the residual heat(ΔHresid) of the resin at different curing times. A comparatively slower reaction was found to take place when the resin was cured with the poly(arylene ether sulphone) that when it was cured with the conventional curing agent 4,4′-diaminodiphenyl sulphone.


2020 ◽  
Vol 31 (7) ◽  
pp. 1553-1561
Author(s):  
Wei Wei ◽  
Xin Sun ◽  
Weitao Ye ◽  
Bowen Zhang ◽  
Xiaoma Fei ◽  
...  

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