scholarly journals Multiscale modeling and experimental analysis of chemical vapor deposited aluminum films: Linking reactor operating conditions with roughness evolution

2016 ◽  
Vol 155 ◽  
pp. 449-458 ◽  
Author(s):  
Ioannis G. Aviziotis ◽  
Nikolaos Cheimarios ◽  
Thomas Duguet ◽  
Constantin Vahlas ◽  
Andreas G. Boudouvis
Keyword(s):  
Multiscale Modeling ◽  
Experimental Analysis ◽  
Chemical Vapor ◽  
Operating Conditions ◽  
Aluminum Films ◽  
Chemical Vapor Deposited ◽  
Reactor Operating

Characterization of the Interface Between Metal Contacts and Epilayers of Doped Silicon Carbide

1995 ◽  
Vol 405 ◽  
Author(s):  
M. A. George ◽  
D. J. Larkin ◽  
J. Petit ◽  
A. Burger ◽  
S. H. Morgan ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Ohmic Contacts ◽  
Chemical Vapor ◽  
Metal Contacts ◽  
Aluminum Films ◽  
Force Microscopy ◽  
Atomic Force ◽  
Chemical Vapor Deposited ◽  
Before And After ◽  
P Type

AbstractAluminum contacts on chemical vapor deposited (CVD) SiC films were studied to examine variations in the chemical, morphological and electrical properties of the samples. Nitrogen and aluminum doped substrates were prepared to give n-type and p-type SiC epilayers respectively. These preparations were examined by surface sensitive spectroscopies and by atomic force microscopy (AFM). Samples were studied both before and after the deposition of aluminum films to compare differences between SiC(p++)/metal and SiC(n++)/metal contact interfacial properties. Aluminum has generally been found to have good adherence to the n+ epilayer but do not form good ohmic contacts, while metal films deposited on p+ epilayers have had poor adherence but have been found to provide better ohmic character. AFM images revealed nanometer sized clusters, attributed to excess Si on the n+ epilayers, while no clusters were observed on the p+ epilayers. XPS studies of the as-prepared samples indicated that the n+ epilayers had higher concentrations of oxides which may enhance adhesion. The chemical composition and morphology is discussed and correlated to the electrical properties obtained for the various samples.

Numerical Simulation of GaN Growth in a MOCVD Process

2011 ◽  
Author(s):  
Jiandong Meng ◽  
Yogesh Jaluria
Keyword(s):  
Growth Rate ◽  
Film Growth ◽  
Chemical Vapor ◽  
Operating Conditions ◽  
Operating Pressure ◽  
Reactor Performance ◽  
Chemical Mechanisms ◽  
Mocvd Reactor ◽  
Reactor Operating ◽  
Gan Film

This paper describes a model for the growth of gallium nitride in a vertical impinging metalorganic chemical vapor deposition (MOCVD) reactor. With trimethylgallium (TMGa) and ammonia (NH3) carried by hydrogen (H2) as precursors, the flow, temperature and concentration profiles are predicted by numerical modeling, which is performed using a commercial CFD software package CFD-ACE+. The growth rate is predicted based on detailed reaction mechanisms given in the literature, and related studies are carried out to verify the reliability and adaptability of the chosen chemical kinetics. A detailed mathematical model is developed first, and the complete chemical mechanisms are introduced. Then, the dependence of the growth rate and uniformity of the deposited layers on operating conditions, such as reactor operating pressure, susceptor temperature, inlet velocity and concentration of the precursors, is investigated to gain greater insight into the reactor performance and characteristics. Based on the simulation results, discussion is presented in this paper to offer the possibility of better control of the GaN film growth process, and to ultimately lead to an optimization of the process, with respect to production rate and film quality.

Ion Beam Induced Interfacial Reactions in Molybdenum Thin Films on Silicon

1981 ◽  
Vol 39 ◽  
pp. 162-163
Author(s):  
L. J. Chen ◽  
L. S. Hung ◽  
J. W. Mayer
Keyword(s):  
Ion Beam ◽  
Chemical Vapor ◽  
Interfacial Reactions ◽  
Practical Applications ◽  
Microelectronic Devices ◽  
Recent Emergence ◽  
Chemical Vapor Deposited ◽  
Atomic Mixing ◽  
Silicon Interface ◽  
Kinetics Of

When an energetic ion penetrates through an interface between a thin film (of species A) and a substrate (of species B), ion induced atomic mixing may result in an intermixed region (which contains A and B) near the interface. Most ion beam mixing experiments have been directed toward metal-silicon systems, silicide phases are generally obtained, and they are the same as those formed by thermal treatment.Recent emergence of silicide compound as contact material in silicon microelectronic devices is mainly due to the superiority of the silicide-silicon interface in terms of uniformity and thermal stability. It is of great interest to understand the kinetics of the interfacial reactions to provide insights into the nature of ion beam-solid interactions as well as to explore its practical applications in device technology.About 500 Å thick molybdenum was chemical vapor deposited in hydrogen ambient on (001) n-type silicon wafer with substrate temperature maintained at 650-700°C. Samples were supplied by D. M. Brown of General Electric Research & Development Laboratory, Schenectady, NY.

Metal Microstructures in Advanced CMOS Devices

1996 ◽  
Vol 54 ◽  
pp. 358-359
Author(s):  
L. M. Gignac ◽  
K. P. Rodbell
Keyword(s):  
Grain Boundaries ◽  
Semiconductor Device ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Metal Films ◽  
Thin Metal ◽  
Electrical Performance ◽  
Thin Metal Films ◽  
Chemical Vapor Deposited ◽  
Boundary Properties

As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.

scholarly journals Grain boundaries in chemical-vapor-deposited atomically thin hexagonal boron nitride

2019 ◽  
Vol 3 (1) ◽  
Author(s):  
Xibiao Ren ◽  
Jichen Dong ◽  
Peng Yang ◽  
Jidong Li ◽  
Guangyuan Lu ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Grain Boundaries ◽  
Hexagonal Boron Nitride ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

scholarly journals Nanofabrication using home-made RF plasma coupled chemical vapour deposition system

2014 ◽  
Vol 32 ◽  
pp. 1460342
Author(s):  
Si Ci Ong ◽  
Usman Ilyas ◽  
Rajdeep Singh Rawat
Keyword(s):  
Chemical Vapour ◽  
Chemical Vapor ◽  
Wide Band ◽  
Zno Nanowires ◽  
Operating Conditions ◽  
Rf Plasma ◽  
Zno Nanostructures ◽  
Energetic Ions ◽  
Cvd Method ◽  
Etching Effect

Zinc oxide, ZnO , a popular semiconductor material with a wide band gap (3.37 eV) and high binding energy of the exciton (60 meV), has numerous applications such as in optoelectronics, chemical/biological sensors, and drug delivery. This project aims to (i) optimize the operating conditions for growth of ZnO nanostructures using the chemical vapor deposition (CVD) method, and (ii) investigate the effects of coupling radiofrequency (RF) plasma to the CVD method on the quality of ZnO nanostructures. First, ZnO nanowires were synthesized using a home-made reaction setup on gold-coated and non-coated Si (100) substrates at 950 °C. XRD, SEM, EDX, and PL measurements were used for characterizations and it was found that a deposition duration of 10 minutes produced the most well-defined ZnO nanowires. SEM analysis revealed that the nanowires had diameters ranging from 30-100 mm and lengths ranging from 1-4 µm. In addition, PL analysis showed strong UV emission at 380 nm, making it suitable for UV lasing. Next, RF plasma was introduced for 30 minutes. Both remote and in situ RF plasma produced less satisfactory ZnO nanostructures with poorer crystalline structure, surface morphology, and optical properties due to etching effect of energetic ions produced from plasma. However, a reduction in plasma discharge duration to 10 minutes produced thicker and shorter ZnO nanostructures. Based on experimentation conducted, it is insufficient to conclude that RF plasma cannot aid in producing well-defined ZnO nanostructures. It can be deduced that the etching effect of energetic ions outweighed the increased oxygen radical production in RF plasma nanofabrication.

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