Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process

2019 ◽  
Vol 19 (5) ◽  
pp. 570-581 ◽  
Author(s):  
Lixiang Zhang ◽  
Pei Chen ◽  
Tong An ◽  
Yanwei Dai ◽  
Fei Qin
Keyword(s):  
Silicon Wafer ◽  
Subsurface Damage ◽  
Grinding Process ◽  
Analytical Prediction

Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering

2019 ◽  
Vol 141 (10) ◽  
Author(s):  
Jingfei Yin ◽  
Qian Bai ◽  
Bi Zhang
Keyword(s):  
Residual Stress ◽  
Silicon Wafer ◽  
Incident Light ◽  
Subsurface Damage ◽  
Grinding Process ◽  
Subsurface Crack ◽  
Principal Stresses ◽  
Laser Scattering ◽  
Hard And Brittle Material ◽  
The Difference

Abstract A silicon wafer is important for the electronic and computer industries. However, subsurface damage (SSD), which is detrimental to the performance and lifetime of a silicon chip, is easily induced in a silicon wafer during a grinding process since silicon is typically a hard and brittle material. Therefore, it is necessary to detect and remove SSD in the subsequent processes. In this study, a polarized laser scattering (PLS) system is installed to detect the SSD in a ground wafer. It is found that not only the subsurface crack but also the residual stress leads to depolarization of an incident light. The effects of residual stress on depolarization are studied. The residual stress results in the photoelasticity, which causes the depolarization of the incident light in the PLS system. The depolarization caused by the residual stress is determined by the directions and the difference of the principal stresses. When the polarization direction of the incident light is aligned with one of the principal stresses, the effects of the residual stress can be minimized; therefore, the subsurface crack can be quantitatively estimated by PLS.

In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

2021 ◽  
Vol 154 ◽  
pp. 107550
Author(s):  
Fei Qin ◽  
Lixiang Zhang ◽  
Pei Chen ◽  
Tong An ◽  
Yanwei Dai ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Grinding Force ◽  
Grinding Process ◽  
Wireless Measurement

701 Study on grinding process of ultra-thin silicon wafer

2011 ◽  
Vol 2011.19 (0) ◽  
pp. 177-178
Author(s):  
Haruma Chiba ◽  
Yutaro Ebina ◽  
Takeyuki Yamamoto ◽  
Hirotaka Ojima ◽  
Teppei Onuki ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Grinding Process ◽  
Thin Silicon

Evaluation of Subsurface Damage and Residual Stress of Glass Ceramic Under Grinding Process

2012 ◽  
Vol 8 (1) ◽  
pp. 484-488
Author(s):  
Y. C. Chen ◽  
G. J. Fan ◽  
C. Y. Chan ◽  
T. M. Huang
Keyword(s):  
Residual Stress ◽  
Glass Ceramic ◽  
Subsurface Damage ◽  
Grinding Process
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