Stress anisotropy in circular planar magnetron sputter deposited molybdenum films and its annealing effect

2003 ◽  
Vol 76 (2) ◽  
pp. 147-152 ◽  
Author(s):  
Y.G. Wu ◽  
E.H. Cao ◽  
Z.S. Wang ◽  
J.M. Wei ◽  
W.X. Tang ◽  
...  
Keyword(s):  
Annealing Effect ◽  
Stress Anisotropy ◽  
Planar Magnetron ◽  
Magnetron Sputter ◽  
Sputter Deposited

Improvement of Stress Anisotropy in Circular Planar Magnetron Sputter Deposited Molybdenum Films with Annealing

2002 ◽  
Vol 19 (7) ◽  
pp. 964-966 ◽  
Author(s):  
Wu Yong-Gang ◽  
Gu Chun-Shi ◽  
Cao Er-Hua ◽  
Wang Zhan-Shan ◽  
Wei Jun-Ming ◽  
...  
Keyword(s):  
Stress Anisotropy ◽  
Planar Magnetron ◽  
Magnetron Sputter ◽  
Sputter Deposited

Residual Stress, Fracture, and Adhesion in Sputter-Deposited Molybdenum Films

1988 ◽  
Vol 119 ◽  
Author(s):  
D. M. Mattox ◽  
R. E. Cuthrell
Keyword(s):  
Residual Stress ◽  
Strain Energy ◽  
Pressure Cycling ◽  
Stress Anisotropy ◽  
Magnetron Sputter Deposition ◽  
Magnetron Sputter ◽  
Sputter Deposited ◽  
Film Substrate ◽  
Deposited Films ◽  
Deposition Conditions

AbstractAtomistically deposited films may form with high residual stresses which may be either tensile or compressive in nature. These film stresses represent stored strain energy which may affect the adhesion of the film-substrate couple and in the limit may cause spontaneous fracture at or near the film-substrate interface (loss of adhesion). In the post cathode magnetron sputter deposition of molybdenum films, we have found that the intrinsic film stresses are generally anisotropic and may easily exceed the fracture or adhesive strength of the film-substrate couple. The residual stress anisotropy in the film is dependent on the orientation with respect to the post cathode and the magnitude and nature of the stresses are very dependent on the deposition conditions, particularly gas pressure during sputtering. By using a pressure-cycling technique, we have deposited thick (5 microns) films of molybdenum which have little residual stress or stress anisotropy.

Simulation of thin film step coverage and microstructure

1989 ◽  
Vol 67 (4) ◽  
pp. 347-350 ◽  
Author(s):  
M. J. Brett ◽  
K. L. Westra ◽  
T. Smy
Keyword(s):  
Thin Film ◽  
Film Growth ◽  
Substrate Surface ◽  
Surface Profile ◽  
Mobility Model ◽  
Surface Mobility ◽  
Planar Magnetron ◽  
Magnetron Sputter Deposition ◽  
Magnetron Sputter ◽  
Sputter Deposited

Ballistic deposition of hard discs has been used for computer simulation of thin film growth over a step on a substrate surface. Up to 16 000 particles were deposited per simulation using an angular distribution of particle trajectories representative of planar magnetron sputter deposition and incorporating a surface mobility model for deposited particles. The simulated films show a surface profile evolution during growth and an orientation of columnar film microstructure that are very close to the surface profile and microstructure observed in real films of aluminum sputter deposited over an oxide step on a silicon substrate.

Growth and characterization of radio frequency magnetron sputter-deposited zinc stannate, Zn2SnO4, thin films

2002 ◽  
Vol 92 (1) ◽  
pp. 310-319 ◽  
Author(s):  
David L. Young ◽  
Helio Moutinho ◽  
Yanfa Yan ◽  
Timothy J. Coutts
Keyword(s):  
Thin Films ◽  
Radio Frequency ◽  
Radio Frequency Magnetron ◽  
Zinc Stannate ◽  
Magnetron Sputter ◽  
Sputter Deposited

scholarly journals Diffusion studies in magnetron sputter deposited silicon nitride films

2014 ◽  
Vol 255 ◽  
pp. 37-42 ◽  
Author(s):  
J. Kulczyk-Malecka ◽  
P.J. Kelly ◽  
G. West ◽  
Clarke G.C.B. ◽  
J.A. Ridealgh
Keyword(s):  
Silicon Nitride ◽  
Silicon Nitride Films ◽  
Diffusion Studies ◽  
Magnetron Sputter ◽  
Sputter Deposited
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