Residual stress anisotropy, stress control, and resistivity in post cathode magnetron sputter deposited molybdenum films

1988 ◽  
Vol 6 (5) ◽  
pp. 2914-2920 ◽  
Author(s):  
R. E. Cuthrell ◽  
D. M. Mattox ◽  
C. R. Peeples ◽  
P. L. Dreike ◽  
K. P. Lamppa
Keyword(s):  
Residual Stress ◽  
Stress Control ◽  
Stress Anisotropy ◽  
Magnetron Sputter ◽  
Sputter Deposited

Residual Stress, Fracture, and Adhesion in Sputter-Deposited Molybdenum Films

1988 ◽  
Vol 119 ◽  
Author(s):  
D. M. Mattox ◽  
R. E. Cuthrell
Keyword(s):  
Residual Stress ◽  
Strain Energy ◽  
Pressure Cycling ◽  
Stress Anisotropy ◽  
Magnetron Sputter Deposition ◽  
Magnetron Sputter ◽  
Sputter Deposited ◽  
Film Substrate ◽  
Deposited Films ◽  
Deposition Conditions

AbstractAtomistically deposited films may form with high residual stresses which may be either tensile or compressive in nature. These film stresses represent stored strain energy which may affect the adhesion of the film-substrate couple and in the limit may cause spontaneous fracture at or near the film-substrate interface (loss of adhesion). In the post cathode magnetron sputter deposition of molybdenum films, we have found that the intrinsic film stresses are generally anisotropic and may easily exceed the fracture or adhesive strength of the film-substrate couple. The residual stress anisotropy in the film is dependent on the orientation with respect to the post cathode and the magnitude and nature of the stresses are very dependent on the deposition conditions, particularly gas pressure during sputtering. By using a pressure-cycling technique, we have deposited thick (5 microns) films of molybdenum which have little residual stress or stress anisotropy.

Improvement of Stress Anisotropy in Circular Planar Magnetron Sputter Deposited Molybdenum Films with Annealing

2002 ◽  
Vol 19 (7) ◽  
pp. 964-966 ◽  
Author(s):  
Wu Yong-Gang ◽  
Gu Chun-Shi ◽  
Cao Er-Hua ◽  
Wang Zhan-Shan ◽  
Wei Jun-Ming ◽  
...  
Keyword(s):  
Stress Anisotropy ◽  
Planar Magnetron ◽  
Magnetron Sputter ◽  
Sputter Deposited

Stress anisotropy in circular planar magnetron sputter deposited molybdenum films and its annealing effect

2003 ◽  
Vol 76 (2) ◽  
pp. 147-152 ◽  
Author(s):  
Y.G. Wu ◽  
E.H. Cao ◽  
Z.S. Wang ◽  
J.M. Wei ◽  
W.X. Tang ◽  
...  
Keyword(s):  
Annealing Effect ◽  
Stress Anisotropy ◽  
Planar Magnetron ◽  
Magnetron Sputter ◽  
Sputter Deposited

Growth and characterization of radio frequency magnetron sputter-deposited zinc stannate, Zn2SnO4, thin films

2002 ◽  
Vol 92 (1) ◽  
pp. 310-319 ◽  
Author(s):  
David L. Young ◽  
Helio Moutinho ◽  
Yanfa Yan ◽  
Timothy J. Coutts
Keyword(s):  
Thin Films ◽  
Radio Frequency ◽  
Radio Frequency Magnetron ◽  
Zinc Stannate ◽  
Magnetron Sputter ◽  
Sputter Deposited

scholarly journals Superlayer Residual Stress Effect on the Indentation Adhesion Measurements

1999 ◽  
Vol 594 ◽  
Author(s):  
Alex A. Volinsky ◽  
Neville R. Moody ◽  
William W. Gerberich
Keyword(s):  
Residual Stress ◽  
Sputter Deposition ◽  
Work Of Adhesion ◽  
Stress Effect ◽  
Aluminum Films ◽  
Nanoindentation Testing ◽  
Deposition Parameters ◽  
Thin Aluminum ◽  
Residual Stress Effect ◽  
Sputter Deposited

AbstractThe practical work of adhesion has been measured in thin aluminum films as a function of film thickness and residual stress. These films were sputter deposited onto thermally oxidized silicon wafers followed by sputter deposition of a one micron thick W superlayer. The superlayer deposition parameters were controlled to produce either a compressive residual stress of 1 GPa or a tensile residual stress of 100 MPa. Nanoindentation testing was then used to induce delamination and a mechanics based model for circular blister formation was used to determine practical works of adhesion. The resulting measured works of adhesion for all films between 100 nm and 1 μm thick was 30 J/m2 regardless of superlayer stress. However, films with the compressively stressed superlayers produced larger blisters than films with tensile stressed superlayers. In addition, these films were susceptible to radial cracking producing a high variability in average adhesion values.

scholarly journals Diffusion studies in magnetron sputter deposited silicon nitride films

2014 ◽  
Vol 255 ◽  
pp. 37-42 ◽  
Author(s):  
J. Kulczyk-Malecka ◽  
P.J. Kelly ◽  
G. West ◽  
Clarke G.C.B. ◽  
J.A. Ridealgh
Keyword(s):  
Silicon Nitride ◽  
Silicon Nitride Films ◽  
Diffusion Studies ◽  
Magnetron Sputter ◽  
Sputter Deposited
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