Antireflective structures in CdTe and CdZnTe surfaces by ECR plasma etching

2001 ◽  
Vol 30 (6) ◽  
pp. 733-737 ◽  
Author(s):  
A. J. Stoltz ◽  
M. R. Banish ◽  
J. H. Dinan ◽  
J. D. Benson ◽  
D. R. Brown ◽  
...  
1990 ◽  
Vol 29 (Part 1, No. 10) ◽  
pp. 2223-2228 ◽  
Author(s):  
Nobuo Fujiwara ◽  
Hisaharu Sawai ◽  
Masahiro Yoneda ◽  
Kyusaku Nishioka ◽  
Haruhiko Abe

1993 ◽  
Vol 140-142 ◽  
pp. 39-54
Author(s):  
Y. Tobinaga ◽  
T. Miyano ◽  
K. Fujimoto ◽  
M. Fujito ◽  
H. Fujiwara

1992 ◽  
Vol 28 (9) ◽  
pp. 822 ◽  
Author(s):  
S.J. Pearton ◽  
A. Katz ◽  
F. Ren ◽  
J.R. Lothian

1996 ◽  
Vol 421 ◽  
Author(s):  
J. W. Lee ◽  
S. J. Pearton ◽  
C. J. Santana ◽  
E. S. Lambers ◽  
C. R. Abernathy ◽  
...  

AbstractElectron Cyclotron Resonance (ECR) plasma etching with additional if-biasing produces etch rates ≥ 2,500Å/min for InGaP and AlInP in CH4/H2/Ar. These rates are an order of magnitude or much higher than for reactive ion etching conditions (RIE) carried out in the same reactor. N2 addition to CH4/H2/Ar can enhance the InGaP etch rates at low flow rates, while at higher concentrations it provides an etch-stop reaction. The InGaP and AtlnP etched under ECR conditions have somewhat rougher morphologies and different stoichiometries up to ˜200Å from the surface relative to the RIE samples.


1995 ◽  
Vol 31 (10) ◽  
pp. 834-836 ◽  
Author(s):  
J.G. van Hassel ◽  
C.M. van Es ◽  
P.A.M. Nouwens

2005 ◽  
Vol 5 (4) ◽  
pp. 351-355 ◽  
Author(s):  
L.S.S. Singh ◽  
K.P. Tiwary ◽  
R.K. Purohit ◽  
Z.H. Zaidi ◽  
M. Husain

Author(s):  
Haruyosi HAMA ◽  
Kyohei TERAO ◽  
Hidekuni TAKAO ◽  
Fusao SIMOKAWA ◽  
Fumikazu OOHIRA ◽  
...  

2001 ◽  
Author(s):  
Naoyuki Kofuji ◽  
Takashi Tsutsumi ◽  
Eiji Matsumoto ◽  
Kotaro Fujimoto ◽  
Naoshi Itabashi ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document