Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part II: Modeling
1994 ◽
Vol 23
(8)
◽
pp. 729-734
◽
1994 ◽
Vol 23
(8)
◽
pp. 721-727
◽
2012 ◽
Vol 511
(1)
◽
pp. 176-188
◽
Keyword(s):
2007 ◽
Vol 22
(10)
◽
pp. 2817-2824
◽
2014 ◽
Vol 27
◽
pp. 634-642
◽
2018 ◽
Vol 73
(6)
◽
pp. 555-558
◽
Keyword(s):
2007 ◽
Vol 353-358
◽
pp. 1765-1768