Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

2012 ◽  
Vol 511 (1) ◽  
pp. 176-188 ◽  
Author(s):  
H.R. Kotadia ◽  
O. Mokhtari ◽  
M.P. Clode ◽  
M.A. Green ◽  
S.H. Mannan
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Growth Suppression ◽  
Intermetallic Compound Growth ◽  
Zn Addition

Research on High Temperature Anti-Abrasion Protection Technology of Thermocouple Cannula

2007 ◽  
Vol 353-358 ◽  
pp. 1765-1768
Author(s):  
Hong Fei Sun ◽  
Can Ming Wang ◽  
Qiang Song ◽  
Qiong Qiong Yan
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Service Life ◽  
New Technologies ◽  
Work Conditions ◽  
Protection Method ◽  
Metal Ceramic ◽  
Protection Technology ◽  
Compound Coating ◽  
Ceramic Compound

Abrasion mechanism of thermocouple cannula is studied in this article. For different working position and condition, different material should be selected to ensure the working characteristics of thermocouple cannula. Several protection methods were introduced to prolong the sevice life of thermocouple cannula. 1. M-Al series intermetallic compound coating protection method. 2. Metal/ceramic compound coating protection method. 3. Development of new abrasion-resisting material for high temperature according to some special work conditions of thermocouple cannula. With the adoption of those new technologies, thermocouple cannula’s service life can be prolonged to 3~5 times of that untreated.

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