Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model

2002 ◽  
Vol 18 (3) ◽  
pp. 274-287 ◽  
Author(s):  
Shi Xunqing ◽  
Wang Zhiping ◽  
John HL Pang ◽  
Zhang Xueren ◽  
Nie Jingxu
Keyword(s):  
Constitutive Relation ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Assessment Methodology ◽  
Fatigue Model ◽  
Quick Assessment ◽  
Reliability Of Solder Joints

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

2005 ◽  
Vol 127 (4) ◽  
pp. 466-473 ◽  
Author(s):  
B. L. Chen ◽  
X. Q. Shi ◽  
G. Y. Li ◽  
K. H. Ang ◽  
Jason P. Pickering
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Rapid Temperature ◽  
Reliability Of Solder Joints ◽  
Solder Joint Fatigue ◽  
Time Required ◽  
Failure Location

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability

1994 ◽  
Vol 116 (4) ◽  
pp. 242-248 ◽  
Author(s):  
Teh-Hua Ju ◽  
Wei Lin ◽  
Y. C. Lee ◽  
Jay J. Liu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Printed Wiring Board ◽  
Ceramic Ball ◽  
Solder Volume ◽  
Bga Package ◽  
Reliability Of Solder Joints ◽  
Wiring Board

The effects of manufacturing variations on the reliability of solder joints between a ceramic ball grid array (BGA) package and a printed wiring board (PWB) are investigated. Two cases are studied, namely, with and without spacers between the BGA package and the PWB to maintain the solder joint height. Manufacturing variations considered include changes in solder volume, joint height, and pad size. To evaluate the effect of manufacturing variations on reliability, every possible solder joint profile is first derived. The maximum strain is calculated next. Finally, the fatigue life is predicted. The calculations show that these manufacturing variations change the joint profile, and subsequently affect the fatigue life. Since the package is heavy, the use of spacers is necessary to control the solder joint height for reliable connections, and to maintain a large gap for cleaning. The solder joints formed with the use of spacers, may have convex, cylindrical or concave profiles. The concave solder joints are preferred, since they have long fatigue lives and are less sensitive to the manufacturing variations. For the convex solder joints, their fatigue lives are strongly affected by the joint height variation caused by package warpage and by the combined effects of solder volume and pad size.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

2021 ◽  
Author(s):  
Tae-Yong Park ◽  
Hyun-Ung Oh
Keyword(s):  
Fatigue Life ◽  
Random Vibration ◽  
Critical Strain ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Mechanical Design ◽  
Ball Grid Array ◽  
Primary Objective ◽  
Circuit Board ◽  
Analytical Approaches

Abstract To overcome the theoretical limitations of Steinberg's theory for evaluating the mechanical safety of the solder joints of spaceborne electronics in a launch random vibration environment, a critical strain-based methodology was proposed and validated in a previous study. However, for the critical strain-based methodology to be used reliably in the mechanical design of spaceborne electronics, its effectiveness must be validated under various conditions of the package mounting locations and the first eigenfrequencies of a printed circuit board (PCB); achieving this validation is the primary objective of this study. For the experimental validation, PCB specimens with ball grid array packages mounted on various board locations were fabricated and exposed to a random vibration environment to assess the fatigue life of the solder joint. The effectiveness of the critical strain-based methodology was validated through a comparison of the fatigue life of the tested packages and their margin of safety, which was estimated using various analytical approaches.

Study on the Conversion Method of Three-Dimensional Shape Prediction Model of BGA Solder Joints

2013 ◽  
Vol 706-708 ◽  
pp. 1693-1696
Author(s):  
Hua Bin Zhao ◽  
De Jian Zhou
Keyword(s):  
Solder Joints ◽  
Three Dimensional ◽  
Ball Grid Array ◽  
Analysis Software ◽  
Surface Evolver ◽  
Element Analysis ◽  
Shape Prediction ◽  
Dimensional Shape ◽  
Point Line ◽  
Three Dimensional Shape

In the study of three-dimensional shape prediction of SMT solder joints, the software Surface Evolver has been widely applied as a quick and accurate effective tool for the prediction of solder joints shape. But the model it builds is not able to be directly imported into any finite element analysis software like ANSYS, and even after the import it still needs a lot of time to mend the import model. For this issue, to predict of the solder joints shape of ball grid array (BGA), the implement programs of three conversion methods of point-line-area method, axisymmetric method and infinitesimal method are given. By comparison, axisymmetric method and infinitesimal method are more suitable for the shape conversion of BGA solder joints.

Sign in / Sign up

Export Citation Format

Share Document