Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

2005 ◽  
Vol 127 (4) ◽  
pp. 466-473 ◽  
Author(s):  
B. L. Chen ◽  
X. Q. Shi ◽  
G. Y. Li ◽  
K. H. Ang ◽  
Jason P. Pickering
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Rapid Temperature ◽  
Reliability Of Solder Joints ◽  
Solder Joint Fatigue ◽  
Time Required ◽  
Failure Location

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

scholarly journals Impact of Conformal Coating Material on the Long-Term Reliability of Ball Grid Array Solder Joints

2019 ◽  
Vol 38 ◽  
pp. 1138-1142
Author(s):  
Abid-Alrahman Fawzi Abbas ◽  
Christopher M. Greene ◽  
Krishnaswami Srihari ◽  
Daryl Santos ◽  
Ganesh Pandiarajan
Keyword(s):  
Solder Joints ◽  
Ball Grid Array ◽  
Coating Material ◽  
Conformal Coating

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

2002 ◽  
Vol 124 (3) ◽  
pp. 246-253 ◽  
Author(s):  
Y. W. Chan ◽  
T. H. Ju ◽  
Saeed A. Hareb ◽  
Y. C. Lee ◽  
Jih-Shun Wu ◽  
...  
Keyword(s):  
Solder Joints ◽  
Fatigue Behavior ◽  
Three Dimensional ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Substrate Thickness ◽  
Reliability Model ◽  
Efficient Computation ◽  
Surface Evolver ◽  
Plastic Ball

A reliability model is established to study thermal fatigue behavior of solder joints in plastic ball grid array (PBGA) assemblies. The model is able to simulate a configuration with a large number of warpage affected solder joints. For efficient computation, regression models are used to calculate the force acting on each solder joint to determine its height under different warpage conditions. With the height and specified solder parameters, the shapes of selected solder joints are calculated using the Surface Evolver. In addition, the displacements of these solder joints can be determined by a macro model using equivalent beams to represent hundreds of solder joints. With the shapes and displacements, three-dimensional micro models for the selected joints are established to compute strain energy densities during temperature cycling. The energy densities can be used to estimate fatigue lives through an empirical correlation. Two PBGA assemblies with 72-I/O cavity-up and 540-I/O cavity-down packages are studied using the reliability model. Silicon chip size and substrate thickness are critical to solder fatigue in the cavity-up assembly. Their effects are reduced substantially for the cavity-down assembly, which is more reliable due to small global thermal mismatch. However, its reliability is strongly affected by the warpage. The warpage changes the shapes of solder joints and can reduce the corner joint’s fatigue life from 20,000 to 7800 temperature cycles for an arch-type warpage of 0.28 mm across a 42.5 mm×42.5 mm region.

Long-Term Reliability of Solder Joints on Wafer-Level Packaged Accelerometer for Medical Applications

2007 ◽  
Author(s):  
Tom Kwa ◽  
Thorsten Teutsch
Keyword(s):  
High Performance ◽  
Solder Joints ◽  
Minimum Size ◽  
Medical Applications ◽  
Test Results ◽  
Wafer Level ◽  
Embedded Sensing ◽  
Small Footprint ◽  
Reliability Of Solder Joints

Miniaturization of devices is driving replacement of electronic components with surface mount technology (SMT) equivalent parts, including any embedded sensing devices. In many cases the size of the sensor is restricted by the minimum size of the package rather than by the die. Other solutions to preserve real-estate involve manual mounting of the die onto substrates that have gone through an SMT assembly process. The +/-2g accelerometer presented here is, to our knowledge, the first wafer-level packaged device with solderable terminals that allows the silicon die to be mounted directly onto a substrate in a standard SMT process and without the need for stressisolating interposers. With its small footprint and ceiling requirements (2.1 × 2.9 × 0.8 mm3), and robustness and high performance it is the smallest commercially-available packaged accelerometer suitable for medical applications where these characteristics are critical. The device features terminals that are electrically and mechanically separated but robust enough to withstand large shear forces that may occur during use and board assembly. The device was solder mounted on a variety of substrates without affecting its performance. Most significantly, both device and solder joints were able to withstand extended thermal cycling over a wide temperature range (-55 to 125°C). In this paper, we present the device design, the performance and the long-term reliability test results of this novel and high-performance device on a variety of substrates and solder materials.

Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests

2002 ◽  
Author(s):  
T. E. Wong ◽  
C. Y. Lau ◽  
L. A. Kachatorian ◽  
H. S. Fenger ◽  
I. C. Chen
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Design Parameters ◽  
Physical Analysis ◽  
Printed Wiring Board ◽  
Thermal Fatigue Life ◽  
The Impact

The objective of the present study is to evaluate the impact of electronic packaging design/manufacturing process parameters on the thermal fatigue life of ball grid array (BGA) solder joints. The four selected parameters are BGA under-fill materials, conformal coating, solder pad sizes on printed wiring board, and BGA rework, with each having either two or three levels of variation. A test vehicle (TV), on which various sizes of BGA daisy-chained packages are soldered, is first designed and fabricated, and then subjected to temperature cycling (−55°C to +125°C) with continuous monitoring of solder joint integrity. The total of 15 experimental cases is used in the present study. Based on monitored results, a destructive physical analysis is conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Test results indicate that the influence of these design parameters on fatigue life is dependent on the particular package, in some instances improving the fatigue life tenfold.

scholarly journals Probabilistic methodology for reliability assessment of electronic packages

2019 ◽  
Vol 286 ◽  
pp. 02002
Author(s):  
H. Hamdani ◽  
B. Radi ◽  
A. El Hami
Keyword(s):  
Solder Joint ◽  
Reliability Assessment ◽  
Temperature Cycling ◽  
Time Dependent ◽  
Electronic Packages ◽  
Finite Element Analyses ◽  
Material Parameters ◽  
Joint Reliability ◽  
Design Variables ◽  
Solder Joint Fatigue

In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and randomness which will affect the lifetime prediction quality. This paper focuses on solder joint reliability in tape-based chip-scale packages(CSP) with the consideration of uncertainties in material parameters.

Long-Term Reliability of Solder Joints in 3D ICs Under Near-Application Conditions

2019 ◽  
Author(s):  
Omar Ahmed ◽  
Golareh Jalilvand ◽  
Hector Fernandez ◽  
Peng Su ◽  
Tae-Kyu Lee ◽  
...  
Keyword(s):  
Solder Joints ◽  
3D Ics ◽  
Reliability Of Solder Joints

A Modeling Study of the Effect of Underfill Materials on Solder Joint Thermal Fatigue of Ball Grid Array Package

2014 ◽  
Author(s):  
Wei Wang ◽  
Tung Nguyen
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Young’S Modulus ◽  
Material Properties ◽  
Young's Modulus ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Solder Joint Fatigue ◽  
Underfill Material

Flip Chip Ball Grid Array packages (FCBGA) have been widely used in microelectronic industry in integrated circuit (IC) packages. Due to the intrinsic mismatch of the coefficient of thermal expansion (CTE) between silicon chip and Printed Circuit Board (PCB) material, solder joint fatigue failure due to thermal cycling becomes the most important concern for this technology. Underfill materials have been widely used as a solution to improving solder joint fatigue life. It is of importance to understand the effect of underfill material properties on the solder joint fatigue life. In this study, finite element method (FEM) was employed to study the effect of underfill materials on solder joint low cycle fatigue life in thermal cycling. ANSYS code was used to calculate the inelastic energy density generated in temperature cycling. The viscoplastic model was used for the solder to consider the inelastic and time dependent behavior under thermal cycling. By using the FEM model, the underfill material properties, the Young’s modulus and CTE were examined to study their effects on the solder joint fatigue life. It was found that the improvement of solder fatigue life could be achieved only when the CTE was low. This improvement could be strengthened by large Young’s modulus to increase the solder strength. In contrast, a large CTE underfill material could deepen the solder joint fatigue damage. This worsening effect became more significant as the Young’s modulus became larger. This study could serve as a foundation for understanding the mechanism of solder joint fatigue in the presence of underfill materials and provide guidance to choose appropriate underfill materials to improve BGA solder joint thermal fatigue in temperature cycling.

Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

2012 ◽  
Vol 2 (8) ◽  
pp. 1317-1328 ◽  
Author(s):  
Jiawei Zhang ◽  
Sivasubramanian Thirugnanasambandam ◽  
John L. Evans ◽  
Michael J. Bozack ◽  
Richard Sesek
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Fine Pitch ◽  
Ball Grid Array Packages
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