In-situ formation of thin-film like β′'-alumina layers on α-alumina substrates

Ionics ◽  
1997 ◽  
Vol 3 (3-4) ◽  
pp. 277-281 ◽  
Author(s):  
O. Schäf ◽  
T. Widmer ◽  
U. Guth
Keyword(s):  
Thin Film ◽  
In Situ Formation

scholarly journals In situ formation of PLA-grafted alkoxysilanes for toughening a biodegradable PLA stereocomplex thin film

RSC Advances ◽  
2019 ◽  
Vol 9 (38) ◽  
pp. 21748-21759 ◽  
Author(s):  
Jieun Jeong ◽  
Muhammad Ayyoob ◽  
Ji-Heung Kim ◽  
Sung Woo Nam ◽  
Young Jun Kim
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Significant Loss ◽  
Current Work ◽  
Synergistic Approach ◽  
In Situ Formation

Current work provides a synergistic approach to prepare super tough PLA without any significant loss of its excellent intrinsic mechanical properties.

Water vapor dehumidification using thin-film nanocomposite membranes by the in situ formation of ultrasmall size iron-chelated nanoparticles

2021 ◽  
Vol 542 ◽  
pp. 148562
Author(s):  
Ali M. Abou-Elanwar ◽  
Yogita M. Shirke ◽  
Cheol Hun Yoo ◽  
Soon Jin Kwon ◽  
Won-Kil Choi ◽  
...  
Keyword(s):  
Thin Film ◽  
Water Vapor ◽  
Nanocomposite Membranes ◽  
In Situ Formation ◽  
Thin Film Nanocomposite

Antibiofouling thin-film composite membranes (TFC) by in situ formation of Cu-(m-phenylenediamine) oligomer complex

2018 ◽  
Vol 53 (9) ◽  
pp. 6325-6338 ◽  
Author(s):  
B. Rodríguez ◽  
D. Oztürk ◽  
M. Rosales ◽  
M. Flores ◽  
A. García
Keyword(s):  
Thin Film ◽  
Composite Membranes ◽  
Film Composite ◽  
Thin Film Composite ◽  
In Situ Formation

In situ formation of sol-gel derived PbTiO3/NiFe2O4 biphase thin film

2007 ◽  
Vol 21 (1-4) ◽  
pp. 327-330 ◽  
Author(s):  
Y. L. Dong ◽  
P. Y. Du ◽  
W. J. Weng ◽  
G. R. Han ◽  
G. L. Zhao
Keyword(s):  
Thin Film ◽  
Sol Gel ◽  
In Situ Formation

In situ formation of silver nanoparticles on thin-film composite reverse osmosis membranes for biofouling mitigation

2014 ◽  
Vol 62 ◽  
pp. 260-270 ◽  
Author(s):  
Moshe Ben-Sasson ◽  
Xinglin Lu ◽  
Edo Bar-Zeev ◽  
Katherine R. Zodrow ◽  
Siamak Nejati ◽  
...  
Keyword(s):  
Thin Film ◽  
Silver Nanoparticles ◽  
Reverse Osmosis ◽  
Film Composite ◽  
Thin Film Composite ◽  
In Situ Formation ◽  
Reverse Osmosis Membranes

The use of transmission and analytical electron microscopy in studying reactions and phase transformations in thin film

1993 ◽  
Vol 51 ◽  
pp. 842-843
Author(s):  
K. Barmak
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Phase Transformations ◽  
Analytical Electron Microscopy ◽  
Ex Situ ◽  
Multilayer Thin Films ◽  
Absolute Concentration ◽  
Analytical Electron ◽  
Deposition Step

Generally, processing of thin films involves several annealing steps in addition to the deposition step. During the annealing steps, diffusion, transformations and reactions take place. In this paper, examples of the use of TEM and AEM for ex situ and in situ studies of reactions and phase transformations in thin films will be presented.The ex situ studies were carried out on Nb/Al multilayer thin films annealed to different stages of reaction. Figure 1 shows a multilayer with dNb = 383 and dAl = 117 nm annealed at 750°C for 4 hours. As can be seen in the micrograph, there are four phases, Nb/Nb3-xAl/Nb2-xAl/NbAl3, present in the film at this stage of the reaction. The composition of each of the four regions marked 1-4 was obtained by EDX analysis. The absolute concentration in each region could not be determined due to the lack of thickness and geometry parameters that were required to make the necessary absorption and fluorescence corrections.

Growth kinetics of Al2Cu in an Al-1.5Cu thin film by in Situ TEM

1993 ◽  
Vol 51 ◽  
pp. 1172-1173
Author(s):  
M. Park ◽  
S.J. Krause ◽  
S.R. Wilson
Keyword(s):  
Thin Film ◽  
In Situ Tem ◽  
Collector Plate ◽  
Transmission Electron ◽  
Device Processing ◽  
Corrosion Susceptibility ◽  
Precipitation Phenomena ◽  
Semiconductor Chips ◽  
Kinetics Of

Cu alloying in Al interconnection lines on semiconductor chips improves their resistance to electromigration and hillock growth. Excess Cu in Al can result in the formation of Cu-rich Al2Cu (θ) precipitates. These precipitates can significantly increase corrosion susceptibility due to the galvanic action between the θ-phase and the adjacent Cu-depleted matrix. The size and distribution of the θ-phase are also closely related to the film susceptibility to electromigration voiding. Thus, an important issue is the precipitation phenomena which occur during thermal device processing steps. In bulk alloys, it was found that the θ precipitates can grow via the grain boundary “collector plate mechanism” at rates far greater than allowed by volume diffusion. In a thin film, however, one might expect that the growth rate of a θ precipitate might be altered by interfacial diffusion. In this work, we report on the growth (lengthening) kinetics of the θ-phase in Al-Cu thin films as examined by in-situ isothermal aging in transmission electron microscopy (TEM).

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