Effect of HIPing on the effective thermal conductivity/diffusivity and the interfacial thermal conductance of uniaxial SiC fibrereinforced RBSN

1992 ◽  
Vol 27 (24) ◽  
pp. 6653-6661 ◽  
Author(s):  
H. Bhatt ◽  
K. Y. Donaldson ◽  
D. P. H. Hasselman ◽  
R. T. Bhatt
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Thermal Conductance ◽  
Interfacial Thermal Conductance

Effective Thermal Conductivity of MoSi2/SiC Composites

2005 ◽  
Vol 492-493 ◽  
pp. 551-554
Author(s):  
Guang Zhao Bai ◽  
Wan Jiang ◽  
G. Wang ◽  
Li Dong Chen ◽  
X. Shi
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Effective Medium Theory ◽  
Thermal Conductance ◽  
Inclusion Size ◽  
Laser Flash ◽  
Flash Method ◽  
Medium Theory ◽  
Interfacial Thermal Conductance ◽  
Sic Composites

Thermal conductivity of as-prepared MoSi2/SiC composites has been determined by Laser Flash method. Interfacial thermal conductance for composites with 100nm SiC and with 0.5µm has been determined by using effective medium theory. The results of interfacial thermal conductance exhibit that both the inclusion size and the clustering of the inclusions play an important role in determining composite thermal conductivity.

scholarly journals A Multiscale Investigation on the Thermal Transport in Polydimethylsiloxane Nanocomposites: Graphene vs Borophene

2021 ◽  
Author(s):  
Alessandro Di Pierro ◽  
Bohayra Mortazavi ◽  
Hamidreza Noori ◽  
Timon Rabczuk ◽  
Alberto Fina
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Effective Thermal Conductivity ◽  
Volume Content ◽  
Thermal Conductance ◽  
Single Layer ◽  
Interfacial Thermal Conductance ◽  
Aspect Ratios ◽  
The Matrix ◽  
Dynamics Simulations

Graphene and borophene are highly attractive two-dimensional materials with outstanding physical properties. In this study we employed a combined atomistic continuum multiscale modeling to explore the effective thermal conductivity of polymers nanocomposites made of PDMS polymer as the matrix and graphene and borophene as nanofillers. We first conduct classical molecular dynamics simulations to investigate the interfacial thermal conductance between graphene/PDMS and borophene/PDMS interfaces. Acquired results confirm that the interfacial thermal conductance between nanosheets and polymer increases from the single-layer to multilayered nanosheets and finally converges. The data provided by the atomistic simulations were then used in the finite element method simulations to evaluate the effective thermal conductivity of polymer nanocomposites at continuum level. We explore the effects of nanofillers type, their volume content, geometry aspect ratio and thickness on the nanocomposites effective thermal conductivity. As a very interesting finding, we show that borophene nanosheets, despite almost two orders of magnitude lower thermal conductivity than graphene, can yield very close enhancement in the effective thermal conductivity in comparison with graphene, particularly for low volume content and small aspect ratios and thicknesses. We conclude that for the polymer-based nanocomposites, significant improvement in the thermal conductivity can be reached by improving the bonding between the fillers and polymer or in another word enhancing the thermal conductance at the interface. By taking into account the high electrical conductivity of borophene, our results suggest borophene nanosheets as promising nanofillers to simultaneously enhance the polymers thermal and electrical conductivity.

scholarly journals Interfacial Thermal Conductance across Graphene/MoS2 van der Waals Heterostructures

Energies ◽  
2020 ◽  
Vol 13 (21) ◽  
pp. 5851
Author(s):  
Shuang Wu ◽  
Jifen Wang ◽  
Huaqing Xie ◽  
Zhixiong Guo
Keyword(s):  
Thermal Conductivity ◽  
First Principles ◽  
Van Der Waals ◽  
Thermal Conductance ◽  
Md Simulations ◽  
Monolayer Graphene ◽  
Density Of State ◽  
Interfacial Thermal Conductance ◽  
Van Der Waals Heterostructure ◽  
Phonon Spectra

The thermal conductivity and interface thermal conductance of graphene stacked MoS2 (graphene/MoS2) van der Waals heterostructure were studied by the first principles and molecular dynamics (MD) simulations. Firstly, two different heterostructures were established and optimized by VASP. Subsequently, we obtained the thermal conductivity (K) and interfacial thermal conductance (G) via MD simulations. The predicted Κ of monolayer graphene and monolayer MoS2 reached 1458.7 W/m K and 55.27 W/m K, respectively. The thermal conductance across the graphene/MoS2 interface was calculated to be 8.95 MW/m2 K at 300 K. The G increases with temperature and the interface coupling strength. Finally, the phonon spectra and phonon density of state were obtained to analyze the changing mechanism of thermal conductivity and thermal conductance.

scholarly journals Electronic structure and thermal conductance of the MASnI3/Bi2Te3 interface: a first-principles study

2022 ◽  
Vol 12 (1) ◽  
Author(s):  
Masayuki Morimoto ◽  
Shoya Kawano ◽  
Shotaro Miyamoto ◽  
Koji Miyazaki ◽  
Shuzi Hayase ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Material ◽  
First Principles ◽  
High Performance ◽  
Thermal Conductance ◽  
Electronic States ◽  
Interface Structure ◽  
First Principles Calculations ◽  
Interfacial Thermal Conductance ◽  
Interface Structures

AbstractTo develop high-performance thermoelectric devices that can be created using printing technology, the interface of a composite material composed of MASnI3 and Bi2Te3, which individually show excellent thermoelectric performance, was studied based on first-principles calculations. The structural stability, electronic state, and interfacial thermal conductance of the interface between Bi2Te3 and MASnI3 were evaluated. Among the interface structure models, we found stable interface structures and revealed their specific electronic states. Around the Fermi energy, the interface structures with TeII and Bi terminations exhibited interface levels attributed to the overlapping electron densities for Bi2Te3 and MASnI3 at the interface. Calculation of the interfacial thermal conductance using the diffuse mismatch model suggested that construction of the interface between Bi2Te3 and MASnI3 could reduce the thermal conductivity. The obtained value was similar to the experimental value for the inorganic/organic interface.

Numerical Modeling of Thermal Conductivity of Diamond Particle Reinforced Aluminum Composite

2013 ◽  
Vol 873 ◽  
pp. 344-349
Author(s):  
Wu Lin Yang ◽  
Kun Peng ◽  
Jia Jun Zhu ◽  
De Yi Li ◽  
Ling Ping Zhou
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Finite Element ◽  
Diamond Particle ◽  
Thermal Conductance ◽  
Aluminum Matrix ◽  
Experimental Result ◽  
Total Thermal Conductivity ◽  
Aluminum Composite ◽  
Interfacial Thermal Conductance

In the present work, the finite element method is employed to predict the effective thermal conductivity of diamond particle reinforced aluminum composite. The common finite element commercial software ANSYS is used to for this numerical analysis. A body-centered cubic particle arrangement model are constructed to simulate the microstructure of the composite with 60 vol.% diamond. The effect of particle size and inhomogeneous interfacial conductance on the thermal conductivity of diamond particles reinforced aluminum composite is investigated. Cubo-octahedral particles are assumed and interfacial thermal conductance between different diamond faces and aluminum matrix is implemented by real constants of contact element. The results show that the numerical results using present model agree reasonably well with the experimentation. Taking into consideration the interfacial thermal conductance, the influence of particle size on total thermal conductivity of composite is obvious, the larger size particles tend to meet requirement of the high thermal conductivity of composite. Fitting the experimental result with the inhomogeneous interfacial thermal conductance model, the evolution of the composite thermal property is profound studied.

Printed Circuit Board Thermal Modeling Without the Use of an Effective Thermal Conductivity

2005 ◽  
Author(s):  
Richard L. Sampson
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Thermal Model ◽  
Printed Circuit Board ◽  
Homogeneous Medium ◽  
Thermal Conductance ◽  
General Purpose ◽  
Circuit Board ◽  
Printed Circuit ◽  
Thermal Analyzer

The complexity of the circuit traces on the layers of a typical printed circuit board (PCB) poses a serious problem when preparing a thermal model of the board. Thermal analysts have resorted to the use of an average or so called, “effective thermal conductivity”, Keff, treating the board as a homogeneous medium in their PCB thermal models. This approach carries with it the possibility of significant error in the prediction of board temperatures. A typical PCB will have large variations in the density and pattern of the circuit traces, and a single value of Keff cannot accurately represent all board locations. An alternative approach to this long standing problem is presented in this paper. In the new procedure the thermal conductance between pairs of nodes is computed using all of the details of the circuit traces in the internodal region. The trace information is obtained from bitmap files of each circuit layer, files which may be generated from the board CAD files. The conductances are utilized in a general purpose thermal analyzer for computation of system temperatures. Using the details of the local circuit traces in the computation of internodal conductances results in a more accurate thermal model.

scholarly journals Thermal Conductance of Epoxy/Alumina Interfaces

2021 ◽  
Vol 2133 (1) ◽  
pp. 012002
Author(s):  
Wei Yang ◽  
Yun Chen ◽  
Yipeng Zhang ◽  
Yongsheng Fu ◽  
Kun Zheng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Polymer Matrix ◽  
Time Domain ◽  
Conductive Polymer ◽  
Thermal Conductance ◽  
Interfacial Thermal Conductance ◽  
Piranha Solution ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

Abstract The interfacial thermal conductance (ITC) between filler and polymer matrix is considered as one of the important factors that limits the thermal conductivity of thermally conductive polymer composites. The effect of two different surface treatments (piranha solution and plasma) on ITC of epoxy/alumina was investigated using Time-domain thermoreflectance method (TDTR). The TDTR results show that compared with non-treated samples, the ITC of samples treated by piranha solution and plasma increased 2.9 times and 3.4 times, respectively. This study provides guidance for improving the thermal conductivity of thermally conductive polymer composites.

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