Crack growth kinetics under impulse loading

1992 ◽  
Vol 24 (7) ◽  
pp. 447-450
Author(s):  
V. N. Katanchik ◽  
V. V. Malyatin
Keyword(s):  
Crack Growth ◽  
Growth Kinetics ◽  
Impulse Loading

Investigation of IG-SCC growth kinetics in Al-Mg alloys in thin film environments

CORROSION ◽  
10.5006/3833 ◽  
2021 ◽  
Author(s):  
Patrick Steiner ◽  
Zachary Harris ◽  
Carolina Vicente Moraes ◽  
Robert Kelly ◽  
james burns
Keyword(s):  
Thin Film ◽  
Fracture Mechanics ◽  
Crack Growth ◽  
Growth Kinetics ◽  
Computational Modelling ◽  
Close Correlation ◽  
Open Circuit ◽  
Cathodic Current ◽  
Anodized Aluminum ◽  
Intergranular Stress Corrosion

The effect of thin film environments on the intergranular stress corrosion cracking (IG-SCC) behavior of AA5083-H131 was investigated using fracture mechanics-based testing, high-fidelity monitoring of crack growth, and electrochemical potential measurements. A protocol for conducting thin film IG-SCC fracture mechanics experiments with anodized aluminum oxide (AAO) membranes is developed and the ability to maintain films of specific thicknesses without impeding oxygen diffusion during testing is validated via EIS testing and computational modelling. The IG-SCC susceptibility was found to increase once a critical thin film thickness of 82 µm was achieved; above this thickness a duality in IG-SCC susceptibility behavior was observed. These results are analyzed in the context of a coupled anodic dissolution and hydrogen (H) embrittlement mechanism, where susceptibility is found to scale with the cathodic limitation of the governing IG-SCC mechanism. Specifically, thinner film thicknesses led to limitations on the amount of cathodic current availability, which caused a decrease in the dissolution at the crack tip, a less aggressive crack chemistry development, and thus lower levels of H production. A close correlation between the open circuit potential of the bulk surface and the crack growth kinetics was also observed, consistent with trends reported in previous IG-SCC studies on this alloy.

scholarly journals Analysis of the Crack Initiation and Growth in Crystalline Materials Using Discrete Dislocations and the Modified Kitagawa–Takahashi Diagram

Crystals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 358
Author(s):  
Kuntimaddi Sadananda ◽  
Ilaksh Adlakha ◽  
Kiran N. Solanki ◽  
A.K. Vasudevan
Keyword(s):  
Crack Initiation ◽  
Crack Growth ◽  
Growth Kinetics ◽  
Dislocation Dynamics ◽  
Internal Stresses ◽  
Stress Concentrations ◽  
Crystalline Materials ◽  
Discrete Dislocation ◽  
Continuous Crack ◽  
American Society

Crack growth kinetics in crystalline materials is examined both from the point of continuum mechanics and discrete dislocation dynamics. Kinetics ranging from the Griffith crack to continuous elastic-plastic cracks are analyzed. Initiation and propagation of incipient cracks require very high stresses and appropriate stress gradients. These can be obtained either by pre-existing notches, as is done in a typical American Society of Testing and Materials (ASTM) fatigue and fracture tests, or by in situ generated stress concentrations via dislocation pile-ups. Crack growth kinetics are also examined using the modified Kitagawa–Takahashi diagram to show the role of internal stresses and their gradients needed to sustain continuous crack growth. Incipient crack initiation and growth are also examined using discrete dislocation modeling. The analysis is supported by the experimental data available in the literature.

Simple Models for Surface Cracking

1988 ◽  
Vol 130 ◽  
Author(s):  
Paul Meakin
Keyword(s):  
Thin Films ◽  
Surface Layer ◽  
Simple Model ◽  
Crack Initiation ◽  
Crack Growth ◽  
Growth Kinetics ◽  
Growth Process ◽  
Surface Cracking ◽  
Cracking Process ◽  
Initiation Period

AbstractA simple model for crack growth in thin films deposited onto a substrate has been developed. This model results in the generation of cracking patterns which have a remarkably realistic appearance. In the simulations a slow crack initiation period is followed by a period of rapid crack growth in which quite linear cracks are formed. Later on the crack growth process becomes slower and less regular as the cracking process relieves much of the stress in the surface layer. In this model pre-existing defects have a large effect on the crack growth kinetics and morphology.

Environment-exposure-dependent fatigue crack growth kinetics for Al–Cu–Mg/Li

2007 ◽  
Vol 468-470 ◽  
pp. 88-97 ◽  
Author(s):  
YunJo Ro ◽  
Sean R. Agnew ◽  
Gary H. Bray ◽  
Richard P. Gangloff
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Growth Kinetics ◽  
Environment Exposure
Sign in / Sign up

Export Citation Format

Share Document