Simple Models for Surface Cracking

1988 ◽  
Vol 130 ◽  
Author(s):  
Paul Meakin
Keyword(s):  
Thin Films ◽  
Surface Layer ◽  
Simple Model ◽  
Crack Initiation ◽  
Crack Growth ◽  
Growth Kinetics ◽  
Growth Process ◽  
Surface Cracking ◽  
Cracking Process ◽  
Initiation Period

AbstractA simple model for crack growth in thin films deposited onto a substrate has been developed. This model results in the generation of cracking patterns which have a remarkably realistic appearance. In the simulations a slow crack initiation period is followed by a period of rapid crack growth in which quite linear cracks are formed. Later on the crack growth process becomes slower and less regular as the cracking process relieves much of the stress in the surface layer. In this model pre-existing defects have a large effect on the crack growth kinetics and morphology.

scholarly journals Analysis of the Crack Initiation and Growth in Crystalline Materials Using Discrete Dislocations and the Modified Kitagawa–Takahashi Diagram

Crystals ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 358
Author(s):  
Kuntimaddi Sadananda ◽  
Ilaksh Adlakha ◽  
Kiran N. Solanki ◽  
A.K. Vasudevan
Keyword(s):  
Crack Initiation ◽  
Crack Growth ◽  
Growth Kinetics ◽  
Dislocation Dynamics ◽  
Internal Stresses ◽  
Stress Concentrations ◽  
Crystalline Materials ◽  
Discrete Dislocation ◽  
Continuous Crack ◽  
American Society

Crack growth kinetics in crystalline materials is examined both from the point of continuum mechanics and discrete dislocation dynamics. Kinetics ranging from the Griffith crack to continuous elastic-plastic cracks are analyzed. Initiation and propagation of incipient cracks require very high stresses and appropriate stress gradients. These can be obtained either by pre-existing notches, as is done in a typical American Society of Testing and Materials (ASTM) fatigue and fracture tests, or by in situ generated stress concentrations via dislocation pile-ups. Crack growth kinetics are also examined using the modified Kitagawa–Takahashi diagram to show the role of internal stresses and their gradients needed to sustain continuous crack growth. Incipient crack initiation and growth are also examined using discrete dislocation modeling. The analysis is supported by the experimental data available in the literature.

Microstructure and Strain-Based Fatigue Life Approach for High-Performance Welds

2014 ◽  
Vol 891-892 ◽  
pp. 1500-1506 ◽  
Author(s):  
Heikki Remes ◽  
Pauli Lehto ◽  
Jani Romanoff
Keyword(s):  
Fatigue Life ◽  
Fracture Mechanics ◽  
Crack Initiation ◽  
Crack Growth ◽  
Welded Joints ◽  
Welded Joint ◽  
Damage Zone ◽  
Stress Gradient ◽  
Fatigue Crack Initiation ◽  
Initiation Period

Microstructure and pre-existing surface flaws in smooth notch geometries significantly affect the fatigue life of welded joints. Traditionally, a welded joint is assumed to incorporate crack-like defects and the crack propagation dominates the total fatigue life. For a smooth weld notch geometry, the macro crack initiation period becomes more significant, and this difference cannot be modelled with the existing stress or fracture mechanics ‑based approaches. In this paper, a microstructure and strain ‑based fatigue life approach is presented. In the approach, the fatigue damage process is modelled as a repeated crack initiation process within a material volume related to the microstructure. The novelty of the developed approach is that the size of the damage zone is defined from the grain size statistics without using fracture mechanics. The approach is able to consider the changes in the stress gradient, stress triaxiality and plasticity during the fatigue crack initiation and growth. The developed approach has been validated with experiments on submerged-arc and laser-hybrid welded joints. The predicted fatigue life, crack growth path and rate showed good agreement with the experiments. For a welded joint with smooth and favourable notch shape, the short crack growth, i.e. macro crack initiation period is dominant and it has a significant influence on the fatigue life.

Fundamental Research into Thin Films in a Developing Country

1972 ◽  
Vol 30 ◽  
pp. 500-501
Author(s):  
J.A. Eades ◽  
E. Grünbaum
Keyword(s):  
Thin Films ◽  
Growth Process ◽  
Empirical Process ◽  
Nucleation And Growth ◽  
Research Groups ◽  
Film Research ◽  
Fundamental Research ◽  
Controlled Deposition ◽  
The One ◽  
The University

In the last decade and a half, thin film research, particularly research into problems associated with epitaxy, has developed from a simple empirical process of determining the conditions for epitaxy into a complex analytical and experimental study of the nucleation and growth process on the one hand and a technology of very great importance on the other. During this period the thin films group of the University of Chile has studied the epitaxy of metals on metal and insulating substrates. The development of the group, one of the first research groups in physics to be established in the country, has parallelled the increasing complexity of the field.The elaborate techniques and equipment now needed for research into thin films may be illustrated by considering the plant and facilities of this group as characteristic of a good system for the controlled deposition and study of thin films.

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

Electron beam induced effects in Cu/GeSe2amorphous films

2003 ◽  
Vol 777 ◽  
Author(s):  
J.S. Romero ◽  
A.G. Fitzgerald
Keyword(s):  
Thin Films ◽  
Electron Beam ◽  
Simple Model ◽  
Copper Concentration ◽  
Negative Charge ◽  
Electron Bombardment ◽  
Continuous Operation ◽  
Electron Radiation ◽  
Crystalline Product ◽  
Intense Electron

AbstractCopper migration is observed in the SEM in amorphous GeSe2/Cu thin films when an electron beam is focused in pulsed or continuous operation on the surface of these thin films. The phenomenon can be explained using a simple model in which the population of D- centers is considered to increase upon electron irradiation. The increase in the D- center population is envisaged as due to the breaking of bonds by the electron radiation and by the constant presence of negative charge in irradiated regions. Changes in copper concentration of 20%-30% have been obtained. Additionally we have observed the local crystallization of amorphous GeSe2/Cu thin films in the TEM when the samples were subjected to intense electron bombardment. The crystalline product has been identified as Berzelianite (Cu2Se).

High-mobility InSb thin films on GaAs (001) substrate grown by the two-step growth process

2004 ◽  
Vol 267 (1-2) ◽  
pp. 17-21 ◽  
Author(s):  
M.C. Debnath ◽  
T. Zhang ◽  
C. Roberts ◽  
L.F. Cohen ◽  
R.A. Stradling
Keyword(s):  
Thin Films ◽  
Growth Process ◽  
High Mobility ◽  
Insb Thin Films ◽  
Step Growth

Modeling of Fatigue Crack Propagation

2004 ◽  
Vol 126 (1) ◽  
pp. 77-86 ◽  
Author(s):  
Yanyao Jiang ◽  
Miaolin Feng
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Initiation ◽  
Crack Propagation ◽  
Crack Growth ◽  
Fatigue Damage ◽  
Fatigue Crack Propagation ◽  
Fatigue Crack Initiation ◽  
Cyclic Plasticity ◽  
R Ratio

Fatigue crack propagation was modeled by using the cyclic plasticity material properties and fatigue constants for crack initiation. The cyclic elastic-plastic stress-strain field near the crack tip was analyzed using the finite element method with the implementation of a robust cyclic plasticity theory. An incremental multiaxial fatigue criterion was employed to determine the fatigue damage. A straightforward method was developed to determine the fatigue crack growth rate. Crack propagation behavior of a material was obtained without any additional assumptions or fitting. Benchmark Mode I fatigue crack growth experiments were conducted using 1070 steel at room temperature. The approach developed was able to quantitatively capture all the important fatigue crack propagation behaviors including the overload and the R-ratio effects on crack propagation and threshold. The models provide a new perspective for the R-ratio effects. The results support the notion that the fatigue crack initiation and propagation behaviors are governed by the same fatigue damage mechanisms. Crack growth can be treated as a process of continuous crack nucleation.

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