Transformations and properties of high-speed alloys hardened with intermetallic compounds

1966 ◽  
Vol 8 (11) ◽  
pp. 913-917
Author(s):  
V. A. Brostrem ◽  
Yu. A. Geller
Keyword(s):  
Intermetallic Compounds ◽  
High Speed

scholarly journals Influence of process parameters on thermal cycle and intermetallic compounds formation in high speed laser weld-brazing of aluminium-steel angle joints

2018 ◽  
Vol 26 ◽  
pp. 690-699 ◽  
Author(s):  
Guillaume Filliard ◽  
Mohamed El Mansori ◽  
Mathieu De Metz-Noblat ◽  
Christian Bremont ◽  
Anthony Reullier ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Process Parameters ◽  
Thermal Cycle ◽  
High Speed ◽  
Laser Weld ◽  
Influence Of Process Parameters ◽  
Steel Angle

The Organization and Microhardness of the Coating of Aluminum Alloy after FSP

2012 ◽  
Vol 472-475 ◽  
pp. 2922-2925
Author(s):  
Xiao Ping Zhou ◽  
Xin Zhou ◽  
Ming Li
Keyword(s):  
Aluminum Alloy ◽  
Intermetallic Compounds ◽  
High Speed ◽  
Dynamic Recovery ◽  
High Speed Steel ◽  
Feed Speed ◽  
Friction Stir ◽  
Influence Area

The principle of the friction stir processed (FSP) was studied in this paper. When the rotate-speed of the mixing head is 3000r/min, as feed speed of the mixing head is 15μm / s and cutting output is 0.1mm,an influence area constituted with Fe-Al intermetallic compounds was produced between the coating of high-speed steel and Al substrate because of dynamic recovery and recrystallization.The Fe-Al intermetallic compounds can improve microhardness as hard strengthening phase.and the highest microhardness of the influence area achieved 600 HV.

Rare-earth transition-metal intermetallic compounds produced via self-propagating, high-temperature synthesis

2010 ◽  
Vol 25 (4) ◽  
pp. 718-727 ◽  
Author(s):  
Joel P. McDonald ◽  
Mark A. Rodriguez ◽  
Eric D. Jones ◽  
David P. Adams
Keyword(s):  
Rare Earth ◽  
High Temperature ◽  
Transition Metal ◽  
Intermetallic Compounds ◽  
High Speed ◽  
High Speed Photography ◽  
Material System ◽  
Temperature Synthesis ◽  
High Temperature Synthesis ◽  
Metal Metal

Several binary intermetallic compounds—each containing a rare-earth (RE) element paired with a transition metal (TM)—were prepared by self-propagating, high-temperature synthesis (SHS). Thin multilayers, composed of alternating Sc or Y (RE element) and Ag, Cu, or Au (TM), were first deposited by direct current magnetron sputtering. Once the initially distinct layers were stimulated and caused to mix, exothermic reactions propagated to completion. X-ray diffraction revealed that Sc/Au, Sc/Cu, Y/Au, and Y/Cu multilayers react in vacuum to form single-phase, cubic B2 structures. Multilayers containing Ag and a RE metal formed cubic B2 (RE)Ag and a minority (RE)Ag2 phase. The influence of an oxygen-containing environment on the reaction dynamics and the formation of phase were investigated, providing evidence for the participation of secondary combustion reactions during metal-metal SHS. High-speed photography demonstrated reaction propagation speeds that ranged from 0.1–40.0 m/s (dependent on material system and foil design). Both steady and spin-like reaction modes were observed.

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Chaoran Yang ◽  
Fubin Song ◽  
S. W. Ricky Lee
Keyword(s):  
Electron Microscopy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
High Speed ◽  
Solder Matrix ◽  
Electroless Nickel ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Surface Finishes ◽  
Ternary Intermetallic Compounds

SnCuNi is one of the most common ternary intermetallic compounds formed in the Sn-based solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial reaction and diffuse into the intermetallic compound layer from either the solder or from the pad. In this research, comparative studies of different SnCuNi intermetallic compounds were conducted using two kinds of SnCuNi solders with organic solderability preservatives pad finish and a SnCu solder with electroless nickel/immersion gold pad finish. In the former case, Ni can only diffuse into the intermetallic compound from the solder matrix, while in the latter the Ni is only from the metallization layer on the Cu base. Scanning electron microscopy and transmission electron microscopy were employed to inspect the morphologies and interfacial microstructures of the intermetallic compounds. The thermal aging test was conducted to investigate their growth behavior under elevated temperature conditions. Mechanical strength after different aging hours was also evaluated via high speed ball pull test.

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

The on-line use of histogram data for high-speed correction and alignment of electron microscope images

1984 ◽  
Vol 42 ◽  
pp. 556-557
Author(s):  
William Krakow
Keyword(s):  
Power Spectrum ◽  
High Speed ◽  
Direct Memory Access ◽  
Digital Television ◽  
Contrast Transfer Function ◽  
The Past ◽  
High Resolution Tem ◽  
On Line ◽  
Correction Of Astigmatism ◽  
The Fourier Transform

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.

Structural changes in silicon-on-insulator material during post-implantation annealing

1986 ◽  
Vol 44 ◽  
pp. 736-737
Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson
Keyword(s):  
Integrated Circuits ◽  
Oxide Layer ◽  
High Speed ◽  
Structural Changes ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Quality ◽  
Radiation Hardened ◽  
Post Implantation ◽  
Very High

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.

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