Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Chaoran Yang ◽  
Fubin Song ◽  
S. W. Ricky Lee
Keyword(s):  
Electron Microscopy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
High Speed ◽  
Solder Matrix ◽  
Electroless Nickel ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Surface Finishes ◽  
Ternary Intermetallic Compounds

SnCuNi is one of the most common ternary intermetallic compounds formed in the Sn-based solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial reaction and diffuse into the intermetallic compound layer from either the solder or from the pad. In this research, comparative studies of different SnCuNi intermetallic compounds were conducted using two kinds of SnCuNi solders with organic solderability preservatives pad finish and a SnCu solder with electroless nickel/immersion gold pad finish. In the former case, Ni can only diffuse into the intermetallic compound from the solder matrix, while in the latter the Ni is only from the metallization layer on the Cu base. Scanning electron microscopy and transmission electron microscopy were employed to inspect the morphologies and interfacial microstructures of the intermetallic compounds. The thermal aging test was conducted to investigate their growth behavior under elevated temperature conditions. Mechanical strength after different aging hours was also evaluated via high speed ball pull test.

Interfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG Substrate

2016 ◽  
Vol 701 ◽  
pp. 216-219
Author(s):  
Hiroshi Nishikawa ◽  
Abdulaziz N. Alhazaa ◽  
Si Liang He ◽  
Abdulhakim A. Almajid ◽  
Mahmoud S. Soliman
Keyword(s):  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Interfacial Reaction ◽  
Oxygen Concentration ◽  
Solder Matrix ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Reflow Process ◽  
Spreading Area

In order to clarify the effect of the addition of Mg to Sn-Ag-Cu solder on the wettability and the microstructure of the solder, the reaction between Sn-Ag-Cu-Mg solder and a substrate was investigated. Sn-3.5mass%Ag-1.0mass%Cu-xMg solders (x =0, 0.2 and 0.4 mass%) was specially prepared in this study. For the reflow process, specimens were heated in a radiation furnace at 250 oC for 120 s to evaluate the wettability of the solder on a substrate and the microstructure of the solder matrix and the intermetallic compound layer at the interface. The results showed that the spreading area of Sn-Ag-Cu-Mg solder is almost similar with that of Sn-Ag-Cu solder regardless of oxygen concentration. In the case of Sn-Ag-Cu-Mg solders, it was observed that intermetallic compounds (IMCs) containing Mg were formed in the solder matrix and near the interface. The IMC formation at the interface for Sn-Ag-Cu-Mg solders was almost similar with that for Sn-Ag-Cu solder.

Friction Welding of A 6061 Aluminum Alloy and S45C Carbon Steel

2004 ◽  
Vol 449-452 ◽  
pp. 437-440 ◽  
Author(s):  
Takeshi Shinoda ◽  
Shiniti Kawata
Keyword(s):  
Tensile Strength ◽  
Aluminum Alloy ◽  
Carbon Steel ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Friction Welding ◽  
Compound Layer ◽  
Weld Interface ◽  
Welding Parameters ◽  
Intermetallic Compound Layer

Many researches for friction welding of aluminum with either carbon steel or stainless steel have been carried out. From those results, it is concluded that the greatest problem is the formation of brittle intermetallic compounds at weld interface. However, it is not clearly demonstrated the effect of friction welding parameters on the formation of intermetallic compounds. This research purposes are to evaluate the formation of intermetallic compounds and to investigate the effect of friction welding parameters on the strength of welded joint. For these purposes, A6061 aluminum alloy and S45C carbon steel were used with a continuous drive vertical friction welding machine. Tensile test results revealed that the maximum tensile strength was achieved at extremely short friction time and high upset. The joint strength reached 92% of the tensile strength of A6061 base metal. Tensile strength of friction welding was increasing with increasing upset pressure when friction time 1sec. However, tensile properties were deteriorated with increasing friction time. It was observed that the amount of formed intermetallic compound was increasing with increasing friction time at weld interface. Partly formed intermetallic compound on weld interface were identified when friction time 1sec. However, intermetallic compound layer were severely developed with longer friction time at weld interface. It was concluded that intermetallic compound layer deteriorated the tensile properties of weld joints.

Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes

2020 ◽  
Vol 12 (4) ◽  
pp. 564-570
Author(s):  
Haksan Jeong ◽  
Choong-Jae Lee ◽  
Woo-Ram Myung ◽  
Kyung Deuk Min ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Solder Joints ◽  
Solder Matrix ◽  
Electroless Nickel ◽  
Bending Test ◽  
Three Point Bending ◽  
Electroless Nickel Immersion Gold ◽  
Surface Finishes ◽  
Effects Of Temperature

An epoxy Sn–58wt.%Bi solder joint was evaluated by a three-point bending test with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG) surface finishes aged at 85 °C and 85% relative humidity. Scanning electron microscopy and electron probe microanalysis were carried out to study intermetallic compound variation. The morphology, total thickness, and chemical composition of intermetallic compound in epoxy Sn58Bi solder joints were the same as those of Sn–58wt.%Bi solder joints with each surface finish. The average number of bending-to-failure cycles for the epoxy Sn–58wt.%Bi solder/ENIG joints and epoxy Sn–58wt.%Bi solder/ENEPIG was more than 4000 and 5000, respectively. The average number of bending-to-failure cycles of the epoxy Sn–58wt.%Bi solder joint decreased with increasing age. Three-point bending reliability of epoxy Sn–58wt.%Bi solder joints was higher than that of Sn–58wt.%Bi solder with both surface finishes. Cracking of all solder joints subjected to as-reflowed was propagated through the solder matrix. However, after aging for 1000 h, cracking occurred primarily between intermetallic compound layers.

Dissimilar Metal Welding of Steel to Al-Mg Alloy by Spot Resistance Welding

2006 ◽  
Vol 15-17 ◽  
pp. 381-386 ◽  
Author(s):  
I.H. Hwang ◽  
Takehiko Watanabe ◽  
Y. Doi
Keyword(s):  
Intermetallic Compound ◽  
Base Metal ◽  
Joint Strength ◽  
Pure Aluminum ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Mg Alloy ◽  
Intermetallic Compound Layer ◽  
Commercially Pure ◽  
Insert Metal

We tried to join steel to Al-Mg alloy using a resistance spot welding method. The effect of Mg in Al-Mg alloy on the strength and the interfacial microstructure of the joint was investigated. Additionally, the effect of insert metal of commercially pure aluminum, which was put into the bonding interface, on the joint strength was examined. The obtained results were as follows. The cross-tensile strength of a joint between SS400 steel and commercially pure aluminum (SS400/Al) was high and fracture occurred in the aluminum base metal. However, the strength of a joint between SS400 and Al-Mg alloy was remarkably low and less than 30% of that of the SS400/Al joint. An intermetallic compound layer developed so thickly at the bonded interface of the SS400/Al-Mg alloy joint that the joint strength decreased. The intermetallic compound layer developed more thickly as Mg content in the Al-Mg alloy increased. Using insert metal of commercially pure aluminum containing little Mg successfully improved the strength of the SS400/Al-Mg alloy joint and the strength was equivalent to that of the base metal.

Formation of intermetallic compound layer in multi-laminated Ni–(TiB2/Al) composite sheets during annealing treatment

Micron ◽  
2013 ◽  
Vol 45 ◽  
pp. 150-154 ◽  
Author(s):  
Q.W. Wang ◽  
G.H. Fan ◽  
L. Geng ◽  
J. Zhang ◽  
Y.Z. Zhang ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Annealing Treatment ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Al Composite

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Contact Angle ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Solder Paste ◽  
X Ray Diffraction ◽  
Free Solder ◽  
Sic Particle

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

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