Brittle fracture of intermetallic compounds in SAC solder joints under high speed ball pull/pin pull and Charpy impact tests

2013 ◽  
Author(s):  
Chaoran Yang ◽  
Guangsui Xu ◽  
S. W. Ricky Lee ◽  
Xinping Zhang
Keyword(s):  
Brittle Fracture ◽  
Intermetallic Compounds ◽  
High Speed ◽  
Solder Joints ◽  
Charpy Impact ◽  
Impact Tests ◽  
Sac Solder

Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

2008 ◽  
Vol 23 (9) ◽  
pp. 2545-2554 ◽  
Author(s):  
Jenn-Ming Song ◽  
Yao-Ren Liu ◽  
Chien-Wei Su ◽  
Yi-Shao Lai ◽  
Ying-Ta Chiu
Keyword(s):  
Transition Metal ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Alloying Elements ◽  
Intermetallic Formation ◽  
Two Phases ◽  
Substrate Dissolution ◽  
Electroless Ni ◽  
First Time ◽  
Sac Solder

The effect of minor transition metal (TM) additives of Ni, Co, or Zn on the interfacial reactions of the solder joints between Sn–Ag–Cu (SAC) solder and the Cu/Ni(P)/Au substrate was investigated, especially subsequent to multi-reflowing. (Cu,Ni)6Sn5 formed at the interface of all the joints except that of SAC–Ni, of which the interfacial compound was (Ni,Cu)6Sn5. The interfacial compounds of the SAC–Co and SAC–Zn contained a small amount of alloying elements of less than 3 at.%. Two P-rich layers, Ni3P and Ni–Sn–P emerged at the interface of the SAC joints. Nanoindentation analysis indicates that the hardness and Young’s modulus of these two phases were slightly higher than those of the Ni(P) substrate, which were in turn much greater than those of the Cu–Ni–Sn compounds. Worthy of notice is that with TM additions, the Ni–Sn–P phase between Ni3P and interfacial compounds was absent even after 10 reflows. For the SAC–Co joints, the growth of Ni-containing intermetallic compounds within the solder gave rise to the excess Ni dissolution, which caused a discrete Ni3P layer and over-consumed Ni(P) substrate underneath the grooves in-between (Cu, Ni)6Sn5 scallop grains at the interface. This phenomenon is presented for the first time, and the mechanism is proposed in this study.

Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Phase Distribution ◽  
Bond Failure ◽  
Microstructural Parameters ◽  
Snpb Solder ◽  
Grain Orientations ◽  
Accelerated Thermal Cycling ◽  
The Relationship ◽  
Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

scholarly journals Influence of process parameters on thermal cycle and intermetallic compounds formation in high speed laser weld-brazing of aluminium-steel angle joints

2018 ◽  
Vol 26 ◽  
pp. 690-699 ◽  
Author(s):  
Guillaume Filliard ◽  
Mohamed El Mansori ◽  
Mathieu De Metz-Noblat ◽  
Christian Bremont ◽  
Anthony Reullier ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Process Parameters ◽  
Thermal Cycle ◽  
High Speed ◽  
Laser Weld ◽  
Influence Of Process Parameters ◽  
Steel Angle
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