Imaging Surface Recombination Velocities of Grain Boundaries in Multicrystalline Silicon Wafers via Photoluminescence

Solar RRL ◽  
2016 ◽  
Vol 1 (1) ◽  
pp. 1600014 ◽  
Author(s):  
Hang Cheong Sio ◽  
Sieu Pheng Phang ◽  
Daniel Macdonald
2014 ◽  
Vol 125 (4) ◽  
pp. 1010-1012 ◽  
Author(s):  
G. Kato ◽  
M. Tajima ◽  
F. Okayama ◽  
S. Tokumaru ◽  
R. Sato ◽  
...  

2007 ◽  
Vol 2007 ◽  
pp. 1-4 ◽  
Author(s):  
Mohamed Fathi

We have selected Secco and Yang etch solutions for the crystalline defect delineation on multicrystalline silicon (mc-Si) wafers. Following experimentations and optimization of Yang and Secco etching process parameters, we have successfully revealed crystalline extended defects on mc-Si surfaces. A specific delineation process with successive application of Yang and Secco agent on the same sample has proved the increased sensitivity of Secco etch to crystalline extended defects in mc-Si materials. The exploration of delineated mc-Si surfaces indicated that strong dislocation densities are localized mainly close to the grain boundaries and on the level of small grains in size (below 1 mm). Locally, we have observed the formation of several parallel dislocation lines, perpendicular to the grain boundaries. The overlapping of several dislocations lines has revealed particular forms for etched pits of dislocations.


2013 ◽  
Vol 23 (1) ◽  
pp. 30-36 ◽  
Author(s):  
Yacine Boulfrad ◽  
Antti Haarahiltunen ◽  
Hele Savin ◽  
Eivind J. Øvrelid ◽  
Lars Arnberg

2018 ◽  
Author(s):  
Aditya Kovvali ◽  
Matthias Demant ◽  
Theresa Trötschler ◽  
Jonas Haunschild ◽  
Stefan Rein

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