Preparation of stable aqueous conductive ink with silver nanoflakes and its application on paper-based flexible electronics

2011 ◽  
Vol 44 (5) ◽  
pp. 529-534 ◽  
Author(s):  
Yan-Long Tai ◽  
Zhen-Guo Yang
Keyword(s):  
Flexible Electronics ◽  
Conductive Ink

Printable and Recyclable Conductive Ink Based on a Liquid Metal with Excellent Surface Wettability for Flexible Electronics

2021 ◽  
Vol 13 (6) ◽  
pp. 7443-7452
Author(s):  
Jianyu Xu ◽  
Hongda Guo ◽  
Hongyao Ding ◽  
Qiao Wang ◽  
Ziqing Tang ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Surface Wettability ◽  
Conductive Ink

Preparation of Conductive Nanosilver Ink and its Application on RFID Tags

2014 ◽  
Vol 904 ◽  
pp. 121-125 ◽  
Author(s):  
Ji Lan Fu ◽  
Ya Ling Li ◽  
Li Xin Mo ◽  
Yu Wang ◽  
Jun Ran ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Screen Printing ◽  
Surface Resistance ◽  
Large Scale ◽  
Printed Electronics ◽  
Silver Content ◽  
Rfid Tags ◽  
Rheological Characteristics ◽  
Conductive Ink ◽  
New Type

The recent dramatic progress in the printed electronics and flexible electronics, due to the universality of the substrates including the foldable and stretchable substrates, has opened a new prospect in the field of future electronics. In this paper, silver nanospheres in large-scale are synthesized, the nanosilver ink with 63.88% silver content are prepared and a new type of highly conductive and far identify distance RFID tags are manufactured. Especially there are no resin and other additives containing in our conductive ink which satisfy the rheological characteristics and process of screen printing. The tags exhibit the best radiation performance own to there is no high temperature sintering in need. The surface resistance of the tags could be 80 mΩ/, and the identify distance reach to 6.0m. Keywords:silver nanoparticles, conductive ink, RFID tags

Preparation and application of water-based nano-silver conductive ink in paper-based 3D printing

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chenfei Zhao ◽  
Jun Wang ◽  
Lini Lu
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Methyl Cellulose ◽  
Conductive Ink ◽  
Content Type ◽  
Nano Silver ◽  
Printed Circuit ◽  
Silver Ink ◽  
Sintering Time ◽  
Water Based

Purpose In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy. Design/methodology/approach The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed. Findings The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions. Originality/value In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

Synthesis and Self-Assembly of Large-Area Cu Nanosheets and Their Application as an Aqueous Conductive Ink on Flexible Electronics

2013 ◽  
Vol 6 (1) ◽  
pp. 622-629 ◽  
Author(s):  
Rui Dang ◽  
Lingling Song ◽  
Wenjun Dong ◽  
Chaorong Li ◽  
Xiaobo Zhang ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Self Assembly ◽  
Conductive Ink ◽  
Large Area

Surfactant-free carbon black@graphene conductive ink for flexible electronics

2019 ◽  
Vol 54 (16) ◽  
pp. 11157-11167 ◽  
Author(s):  
Xinbin Qiu ◽  
Xiaomin Zhao ◽  
Feixiang Liu ◽  
Songlin Chen ◽  
Jianfeng Xu ◽  
...  
Keyword(s):  
Carbon Black ◽  
Flexible Electronics ◽  
Free Carbon ◽  
Conductive Ink

Synthesis of air stable silver nanoparticles and their application as conductive ink on paper based flexible electronics

2014 ◽  
Vol 18 (sup4) ◽  
pp. S4-723-S4-727 ◽  
Author(s):  
W. Li ◽  
M. Chen ◽  
W. Li ◽  
C. You ◽  
J. Wei ◽  
...  
Keyword(s):  
Silver Nanoparticles ◽  
Flexible Electronics ◽  
Conductive Ink

Binding Conductive Ink Initiatively and Strongly: Transparent and Thermally Stable Cellulose Nanopaper as a Promising Substrate for Flexible Electronics

2019 ◽  
Vol 11 (22) ◽  
pp. 20281-20290 ◽  
Author(s):  
Huang Yu ◽  
Dongjun Fang ◽  
Mahmut Dirican ◽  
Ruiping Wang ◽  
Yan Tian ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Conductive Ink ◽  
Thermally Stable ◽  
Cellulose Nanopaper

scholarly journals Stepwise Current Increment Sintering of Silver Nanoparticle Structures

Crystals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1264
Author(s):  
Dongkeun Kim ◽  
Arif Hussain ◽  
Hee-Lak Lee ◽  
Yoon-Jae Moon ◽  
Junyoung Hwang ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Vital Role ◽  
Process Temperature ◽  
Conductive Ink ◽  
Sintering Process ◽  
Electric Currents ◽  
Temperature Estimation ◽  
Rapid Sintering ◽  
The Relationship ◽  
Sintering Method

Owing to its unique properties, silver (Ag) in the form of nanoparticle (NP) ink promises to play a vital role in the development of printed and flexible electronics. Once printed, metal NP inks require a thermal treatment process called sintering to render them conductive. Among the various methods, electrical sintering is a highly selective and rapid sintering method. Here, we studied the electrical sintering of inkjet-printed Ag NP lines via a stepwise current increment sintering (SCIS) technique. In the SCIS technique, the supplied electric current was gradually increased in multiple steps from low electric currents to higher electric currents to avoid thermal damage to the printed Ag NP ink lines. In less than 0.15 s, a line resistivity as low as 6.8 μΩcm was obtained which was comparable with furnace sintered line resistivity of 6.13 μΩcm obtained at 250 °C in 600 s. Furthermore, a numerical model was developed for the SCIS process temperature estimation. The results enabled us to elaborate on the relationship between the Ag NP line resistivity and the process temperature under various electric currents. Under the applied SCIS technique, a stable sintering process was carried out avoiding the conductive ink line and substrate damage.

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