Increased thermal conductivity of free-standing low-dislocation-density GaN films

2005 ◽  
Vol 202 (12) ◽  
pp. R135-R137 ◽  
Author(s):  
Weili Liu ◽  
Alexander A. Balandin ◽  
Changho Lee ◽  
Hae-Yong Lee
Keyword(s):  
Thermal Conductivity ◽  
Dislocation Density ◽  
Free Standing ◽  
Low Dislocation Density

A nitrogen doped low-dislocation density free-standing single crystal diamond plate fabricated by a lift-off process

2014 ◽  
Vol 104 (25) ◽  
pp. 252109 ◽  
Author(s):  
Yoshiaki Mokuno ◽  
Yukako Kato ◽  
Nobuteru Tsubouchi ◽  
Akiyoshi Chayahara ◽  
Hideaki Yamada ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Single Crystal ◽  
Free Standing ◽  
Nitrogen Doped ◽  
Diamond Plate ◽  
Low Dislocation Density ◽  
Single Crystal Diamond ◽  
Lift Off

Free Standing AlN Single Crystal Grown on Pre-Patterned and In Situ Patterned 4H-SiC Substrates

2010 ◽  
Vol 645-648 ◽  
pp. 1187-1190 ◽  
Author(s):  
Gholam Reza Yazdi ◽  
Konstantin Vassilevski ◽  
José M. Córdoba ◽  
Daniela Gogova ◽  
Irina P. Nikitina ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Vapor Transport ◽  
Physical Vapor Transport ◽  
Free Standing ◽  
Patterned Substrate ◽  
Low Dislocation Density ◽  
Temperature Ramp ◽  
Transport Method ◽  
Vapor Transport Method

Free standing AlN wafers were grown on pre-patterned and in situ patterned 4H-SiC substrates by a physical vapor transport method. It is based on the coalescence of AlN microrods, which evolve from the apex of SiC pyramids grown on the SiC substrate during a temperature ramp up for in situ patterned substrate and SiC pyramids formed by reactive ion etching (RIE). This process yields stress-free (according XRD and Raman results) AlN single crystals with a thickness up to 400 µm and low dislocation density.

Low dislocation density AlN on sapphire prepared by double sputtering and annealing

2020 ◽  
Vol 13 (9) ◽  
pp. 095501
Author(s):  
Ding Wang ◽  
Kenjiro Uesugi ◽  
Shiyu Xiao ◽  
Kenji Norimatsu ◽  
Hideto Miyake
Keyword(s):  
Dislocation Density ◽  
Low Dislocation Density

Growth Of Low-Dislocation-Density InP Single Crystals By The VCZ Method

1989 ◽  
Author(s):  
M. Tatsumi ◽  
T. Kawase ◽  
T. Araki ◽  
N. Yamabayashi ◽  
T. Iwasaki ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Single Crystals ◽  
Low Dislocation Density

Trenched epitaxial lateral overgrowth of fast coalesced a-plane GaN with low dislocation density

2006 ◽  
Vol 89 (25) ◽  
pp. 251109 ◽  
Author(s):  
Te-Chung Wang ◽  
Tien-Chang Lu ◽  
Tsung-Shine Ko ◽  
Hao-Chung Kuo ◽  
Min Yu ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Epitaxial Lateral Overgrowth ◽  
Lateral Overgrowth ◽  
Low Dislocation Density

Heteroepitaxy and Characterization of Low-Dislocation-Density GaN on Periodically Grooved Substrates

2000 ◽  
Vol 639 ◽  
Author(s):  
T. Detchprohm ◽  
M. Yano ◽  
R. Nakamura ◽  
S. Sano ◽  
S. Mochiduki ◽  
...  
Keyword(s):  
Dislocation Density ◽  
New Method ◽  
Growth Technique ◽  
New Approach ◽  
Density Area ◽  
Low Dislocation Density ◽  
Dislocation Densities ◽  
Movpe Growth

ABSTRACTWe have developed a new method to prepare low-dislocation-density GaN by using periodically grooved substrates in a conventional MOVPE growth technique. This new approach was demonstrated for GaN grown on periodically grooved α-Al2O3(0001), 6H-SiC(0001)Si and Si(111) substrates. Dislocation densities were 2×107 cm−2 in low-dislocation-density area.

scholarly journals Oxide Thin Film Heterostructures on Large Area, with Flexible Doping, Low Dislocation Density, and Abrupt Interfaces: Grown by Pulsed Laser Deposition

2010 ◽  
Vol 2010 ◽  
pp. 1-27 ◽  
Author(s):  
Michael Lorenz ◽  
Holger Hochmuth ◽  
Christoph Grüner ◽  
Helena Hilmer ◽  
Alexander Lajn ◽  
...  
Keyword(s):  
Thin Film ◽  
Dislocation Density ◽  
Pulsed Laser Deposition ◽  
Pulsed Laser ◽  
Chemical Vapor ◽  
Laser Deposition ◽  
Oxide Thin Film ◽  
Organic Chemical ◽  
Large Area ◽  
Low Dislocation Density

Advanced Pulsed Laser Deposition (PLD) processes allow the growth of oxide thin film heterostructures on large area substrates up to 4-inch diameter, with flexible and controlled doping, low dislocation density, and abrupt interfaces. These PLD processes are discussed and their capabilities demonstrated using selected results of structural, electrical, and optical characterization of superconducting (YBa2Cu3O7−δ), semiconducting (ZnO-based), and ferroelectric (BaTiO3-based) and dielectric (wide-gap oxide) thin films and multilayers. Regarding the homogeneity on large area of structure and electrical properties, flexibility of doping, and state-of-the-art electronic and optical performance, the comparably simple PLD processes are now advantageous or at least fully competitive to Metal Organic Chemical Vapor Deposition or Molecular Beam Epitaxy. In particular, the high flexibility connected with high film quality makes PLD a more and more widespread growth technique in oxide research.

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