Review of methods for the mitigation of plasma‐induced damage to low‐dielectric‐constant interlayer dielectrics used for semiconductor logic device interconnects

2019 ◽  
Vol 16 (9) ◽  
pp. 1900039 ◽  
Author(s):  
Hideshi Miyajima ◽  
Kenji Ishikawa ◽  
Makoto Sekine ◽  
Masaru Hori
Keyword(s):  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Logic Device ◽  
Interlayer Dielectrics ◽  
Low Dielectric

Deposition and Characterization of Low-Dielectric-Constant SiOC(-H) Thin Films for Interlayer Dielectrics in Multilevel Interconnections

2007 ◽  
Vol 50 (6) ◽  
pp. 1803 ◽  
Author(s):  
Rangaswamy Navamathavan ◽  
An Soo Jung ◽  
Hyun Seung Kim ◽  
Young Jun Jang ◽  
Chi Kyu Choi ◽  
...  
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Interlayer Dielectrics ◽  
Low Dielectric

Application of Fluorinated Amorphous Carbon Thin Films for Low Dielectric Constant Interlayer Dielectrics

1998 ◽  
Vol 37 (Part 1, No. 4A) ◽  
pp. 1809-1814 ◽  
Author(s):  
Kazuhiko Endo ◽  
Toru Tatsumi ◽  
Yoshihisa Matsubara ◽  
Tadahiko Horiuchi
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Amorphous Carbon ◽  
Low Dielectric Constant ◽  
Interlayer Dielectrics ◽  
Low Dielectric ◽  
Carbon Thin Films
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