SiO 2 microstructure evolution during plasma deposition analyzed via ellipsometric porosimetry

2019 ◽  
Vol 16 (9) ◽  
pp. 1900015 ◽  
Author(s):  
Rahel Buschhaus ◽  
 Achim Keudell
Keyword(s):  
Microstructure Evolution ◽  
Plasma Deposition ◽  
Ellipsometric Porosimetry

FAST PLASMA DEPOSITION OF CARBON AND SILICON LAYERS

1990 ◽  
Vol 51 (C5) ◽  
pp. C5-361-C5-367 ◽  
Author(s):  
J. J. BEULENS ◽  
A. J.M. BUURON ◽  
L. A. BISSCHOPS ◽  
T. H.J. BISSCHOPS ◽  
A. B.M. HUSKEN ◽  
...  
Keyword(s):  
Plasma Deposition

Microstructure Evolution Induced by Ultraviolet Light Irradiation in Ti-Si Codoped Diamond-like Carbon films

2014 ◽  
Vol 29 (9) ◽  
pp. 941
Author(s):  
JIANG Jin-Long ◽  
WANG Qiong ◽  
HUANG Hao ◽  
ZHANG Xia ◽  
WANG Yu-Bao ◽  
...  
Keyword(s):  
Ultraviolet Light ◽  
Microstructure Evolution ◽  
Carbon Films ◽  
Light Irradiation ◽  
Diamond Like Carbon ◽  
Ultraviolet Light Irradiation

Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch

2013 ◽  
Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  
Keyword(s):  
Thin Film ◽  
Oxide Film ◽  
Microstructure Evolution ◽  
Depth Profiling ◽  
Surface Microstructure ◽  
The Difference ◽  
Surface Microstructures ◽  
Pt Films

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.

Abnormal Microstructure Evolution Behaviors of Annealed Ag-Co Alloy Film on Flexible Polyimide Substrates

2020 ◽  
Author(s):  
Yuanjiang Lv ◽  
Xin Xin Lian ◽  
Haoliang Sun ◽  
Xiaoxue Huang ◽  
Guang xin Wang
Keyword(s):  
Microstructure Evolution ◽  
Alloy Film
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