Differential Scanning Calorimetry Cure Studies of Tetra-N-glycidyldiaminodiphenylmethane Epoxy Resins. Part 1 - Reaction with 4,4′-Diaminodiphenylsulphone

1986 ◽  
Vol 18 (1) ◽  
pp. 37-43 ◽  
Author(s):  
John M. Barton
1999 ◽  
Vol 19 (3) ◽  
pp. 161-174 ◽  
Author(s):  
Oriana Motta ◽  
Antonino Rocca ◽  
Valentina Siracusa ◽  
Domenico Acierno

Abstract In this paper we carried out the crosslinking of the tetraglycidyl-4,4′- diaminodiphenyl methane epoxy resin by using a reactive poly(arylene ether sulphone) as curing agent. Differential scanning calorimetry was used to derive the kinetic parameters of the reactions involved in the cure process and to evaluate the extent of the reaction as a function of time by measuring the total (ΔHr) and the residual heat(ΔHresid) of the resin at different curing times. A comparatively slower reaction was found to take place when the resin was cured with the poly(arylene ether sulphone) that when it was cured with the conventional curing agent 4,4′-diaminodiphenyl sulphone.


2013 ◽  
Vol 702 ◽  
pp. 119-122
Author(s):  
Teng Fei Shen ◽  
Fa Chao Wu ◽  
Ying Juan Sun

A series of novel azo-containing twin liquid crystalline (LC) epoxy monomers were cured with anhydrides without extra catalyst and the curing kinetics was investigated by non-isothermal differential scanning calorimetry (DSC) technique. The effect of Azo group on the Curing Kinetics of Epoxy/anhydride System was investigated and the result showed that Azo group served as a catalyst to accelerate the curing reaction. The curing mechanism was confirmed by the UV-Vis spectrum.


2017 ◽  
Vol 30 (3) ◽  
pp. 303-311 ◽  
Author(s):  
Chao Chen ◽  
Yanxia Li ◽  
Yizhuo Gu ◽  
Min Li ◽  
Zuoguang Zhang

The curing kinetics of two different types of commercial epoxy resins were investigated by means of nonisothermal differential scanning calorimetry (DSC) in this work. The complex curve of measured heat flow of CYCOM 970 epoxy resin was simplified with the method of resolution of peak. Two typical autocatalytic curing reaction curves were gained and the kinetic parameters of the curing process were demonstrated by combination of those two reactions. The Kissinger method was adopted to obtain the values of the activation energy. The parameters of curing kinetic model were acquired according to the fitting of Kamal model. Isothermal DSC curve of CYCOM 970 epoxy resin obtained using the experimental data shows a good agreement with that theoretically calculated. Then, 603 epoxy resin was investigated by the simplified method and the kinetic parameters were received through the same procedure. The nonisothermal DSC curve tested according to the recommended cure cycle of 603 epoxy resin is also consistent with the calculated results. This improved simplified approach provides an effective method to analyze the curing kinetics of the epoxy resins with complex DSC curves as similar to this study.


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