An improved simplified approach for curing kinetics of epoxy resins by nonisothermal differential scanning calorimetry

2017 ◽  
Vol 30 (3) ◽  
pp. 303-311 ◽  
Author(s):  
Chao Chen ◽  
Yanxia Li ◽  
Yizhuo Gu ◽  
Min Li ◽  
Zuoguang Zhang
Keyword(s):  
Differential Scanning Calorimetry ◽  
Epoxy Resin ◽  
Kinetic Parameters ◽  
Epoxy Resins ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Simplified Approach ◽  
Curing Kinetic ◽  
Autocatalytic Curing ◽  
Kinetics Of

The curing kinetics of two different types of commercial epoxy resins were investigated by means of nonisothermal differential scanning calorimetry (DSC) in this work. The complex curve of measured heat flow of CYCOM 970 epoxy resin was simplified with the method of resolution of peak. Two typical autocatalytic curing reaction curves were gained and the kinetic parameters of the curing process were demonstrated by combination of those two reactions. The Kissinger method was adopted to obtain the values of the activation energy. The parameters of curing kinetic model were acquired according to the fitting of Kamal model. Isothermal DSC curve of CYCOM 970 epoxy resin obtained using the experimental data shows a good agreement with that theoretically calculated. Then, 603 epoxy resin was investigated by the simplified method and the kinetic parameters were received through the same procedure. The nonisothermal DSC curve tested according to the recommended cure cycle of 603 epoxy resin is also consistent with the calculated results. This improved simplified approach provides an effective method to analyze the curing kinetics of the epoxy resins with complex DSC curves as similar to this study.

Study on Curing Kinetics of MEP-15/593/660 System

2014 ◽  
Vol 988 ◽  
pp. 31-35
Author(s):  
Jia Le Song ◽  
Chan Chan Li ◽  
Zhi Mi Zhou ◽  
Chao Qiang Ye ◽  
Wei Guang Li
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Kinetic Parameters ◽  
Curing Kinetics ◽  
Conversion Ratio ◽  
Scanning Calorimetry ◽  
Degree Of Cure ◽  
Curing Kinetic ◽  
The Relationship ◽  
Kinetics Of

Curing kinetics of MEP-15/593 system and MEP-15/593/660 system is studied by means of differential scanning calorimetry (DSC). Curing kinetic parameters are evaluated and the relationship between diluent 660 and the curing properties is investigated. The results show that the diluent 660 can not only reduce viscosity and activation energy, but also improve the degree of cure and conversion ratio.

Study on Curing Mechanism of Azo-Containing Twin Liquid Crystalline Epoxy Resins with Anhydride

2013 ◽  
Vol 702 ◽  
pp. 119-122
Author(s):  
Teng Fei Shen ◽  
Fa Chao Wu ◽  
Ying Juan Sun
Keyword(s):  
Differential Scanning Calorimetry ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Curing Kinetics ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Azo Group ◽  
Liquid Crystalline Epoxy ◽  
Curing Mechanism ◽  
Kinetics Of

A series of novel azo-containing twin liquid crystalline (LC) epoxy monomers were cured with anhydrides without extra catalyst and the curing kinetics was investigated by non-isothermal differential scanning calorimetry (DSC) technique. The effect of Azo group on the Curing Kinetics of Epoxy/anhydride System was investigated and the result showed that Azo group served as a catalyst to accelerate the curing reaction. The curing mechanism was confirmed by the UV-Vis spectrum.

scholarly journals The Curing Kinetics of E-Glass Fiber/Epoxy Resin Prepreg and the Bending Properties of Its Products

Materials ◽  
2021 ◽  
Vol 14 (16) ◽  
pp. 4673
Author(s):  
Lvtao Zhu ◽  
Zhenxing Wang ◽  
Mahfuz Bin Rahman ◽  
Wei Shen ◽  
Chengyan Zhu
Keyword(s):  
Glass Fiber ◽  
Epoxy Resin ◽  
Composite Laminates ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Scanning Calorimetry ◽  
Three Point Bending ◽  
Reinforced Composite ◽  
Curing Kinetic ◽  
Kinetics Of

The curing kinetics can influence the final macroscopic properties, particularly the three-point bending of the fiber-reinforced composite materials. In this research, the curing kinetics of commercially available glass fiber/epoxy resin prepregs were studied by non-isothermal differential scanning calorimetry (DSC). The curing kinetic parameters were obtained by fitting and the apparent activation energy Ea of the prepreg, the pre-exponent factor, and the reaction order value obtained. A phenomenological nth-order curing reaction kinetic model was established according to Kissinger equation and Crane equation. Furthermore, the optimal curing temperature of the prepregs was obtained by the T-β extrapolation method. A vacuum hot pressing technique was applied to prepare composite laminates. The pre-curing, curing, and post-curing temperatures were 116, 130, and 153 °C respectively. In addition, three-point bending was used to test the specimens’ fracture behavior, and the surface morphology was analyzed. The results show that the differences in the mechanical properties of the samples are relatively small, indicating that the process settings are reasonable.

Curing Kinetics of Silicone Epoxy Resin Containing Fluorene

2014 ◽  
Vol 936 ◽  
pp. 28-33 ◽  
Author(s):  
Wei Xing Deng ◽  
Yuan Wei Zhong ◽  
Jie Qin ◽  
Xue Bing Huang ◽  
Jin Wen Peng
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Ftir Spectroscopy ◽  
Epoxy Resin ◽  
1H Nmr ◽  
Chemical Structure ◽  
Curing Kinetics ◽  
Curing Agent ◽  
Scanning Calorimetry ◽  
Kinetics Of

A new epoxy resin based on dichlorosilane and 9,9-bis (4-hydroxyphenyl) fluorene was synthesized to produce a highly heat-resistant network. The chemical structure was characterized with FTIR spectroscopy and 1H-NMR. 4-4′-Diaminodiphenylsulfone (DDS) was used as the curing agent. The curing kinetics of different epoxy/DDS systems were investigated using non-isothermal differential scanning calorimetry (DSC). The results showed that the values of activation energy (E) were affected by the chemical structure of epoxy resin, and BPEBF exhibited lower curing reactivity towards DDS compared to E-51.

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