Novel high performance RTM bismaleimide resin with low cure temperature for advanced composites

2005 ◽  
Vol 16 (7) ◽  
pp. 563-566 ◽  
Author(s):  
Aijuan Gu
2012 ◽  
Vol 23 (16) ◽  
pp. 2072-2080 ◽  
Author(s):  
Keqin Cao ◽  
Carlos Pons Siepermann ◽  
Ming Yang ◽  
Anthony M. Waas ◽  
Nicholas A. Kotov ◽  
...  

2007 ◽  
Vol 44 (3/4) ◽  
pp. 233 ◽  
Author(s):  
Paolo Feraboli ◽  
Attilio Masini ◽  
Andrea Bonfatti

2011 ◽  
Vol 110-116 ◽  
pp. 1361-1367 ◽  
Author(s):  
Mohammad Reza Khosravani

— Using Composite materials are growing more and more today and we have to use them in possible situation. One of the Composite materials applications is on the Airplane and aero space. Reduction of Airplane weight and more adaptability with nature are examples of benefit of using composite materials in aerospace industries. In this article process of manufacturing of composite materials and specially carbon fiber composite are explained. Advance composite materials are common today and are characterized by the use of expensive, high-performance resin systems and high-strength, high-stiffness fiber reinforcement. The aerospace industry, including military and commercial aircraft of all types, is the major customer for advanced composites. Product range now includes materials for low pressure and low temperature. Some using composite materials in aero space are as follow: Satellite Components, Thin Walled Tubing for Aircraft and Satellites, launch vehicle components and honeycomb structures.


1989 ◽  
Vol 154 ◽  
Author(s):  
C. P. Wong

AbstractSilicone gels are becoming some of the most accepted protective coatings for VLSI integrated circuits due to their excellent electrical, thermal, and soft gel-like nature and properties, as well as their ultra-purity and ability to protect IC devices against severe environments. Recent studies indicate that proper IC Chip surface protection with high performance silicone gels in low-cost, non-hermetic plastic packaging might well replace the conventional hermetic ceramic packaging. This paper describes the use of the soft silicone gels and coatings in IC devices. It also describes the correlation between the material cure temperature and cure time versus their adhesion and electrical reliability during 85°C, 85% RH and bias accelerating testing.


2016 ◽  
Vol 29 (3) ◽  
pp. 298-304 ◽  
Author(s):  
Ping Liu ◽  
Chunyan Qu ◽  
Dezhi Wang ◽  
Ming Zhao ◽  
Changwei Liu

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